Where does Shin-Etsu Engineering Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Shin-Etsu Engineering Co., Ltd. ranks #43,064 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Shin-Etsu Engineering Co., Ltd. hold?

Shin-Etsu Engineering Co., Ltd. holds 6 US utility patents granted between 2019 and 2023, spanning 3 technology areas.

What is Shin-Etsu Engineering Co., Ltd.'s Innovation Score?

Shin-Etsu Engineering Co., Ltd. has an Innovation Score of 30.5 out of 100 (34th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Shin-Etsu Engineering Co., Ltd. focus on?

Shin-Etsu Engineering Co., Ltd.'s top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 5 patents, ranking #1,398 of 3,373 assignees active in that subclass. Grants appear in 3 CPC subclasses total.

Is Shin-Etsu Engineering Co., Ltd.'s patent grant rate increasing or decreasing?

Shin-Etsu Engineering Co., Ltd.'s recent grant velocity is +400% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Shin-Etsu Engineering Co., Ltd.'s patents?

Shin-Etsu Engineering Co., Ltd.'s patents average 7.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Shin-Etsu Engineering Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Shin-Etsu Engineering Co., Ltd.

USPTO PatentsView assignee record - 6 granted patents across 3 technology areas, recorded in grant years 2019–2023. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Shin-etsu ranks #43,064 of 49,997 tracked US assignees by granted-patent volume, with 6 patents across 3 technology areas.

#43,064
of 49,997 US assignees by volume: 34th percentile
by Innovation Score (30.5/100): 7.2
avg claims per patent: +400%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R43064 · Foreign Corporation #43,064 · 6 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 6 grants
LOWER-Q #43,064/49,997
PHOTO-FINISH Shenzhen kensonic…
CPC-NARROW H01L · 3 areas
INNOV-THIN 30.5/100
CLAIMS-SPARSE 7.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +400% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Shenzhen kensonic Intelligent Technology Co., Ltd. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Shin-etsu’s 30.5 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 6.7 pts (22%) Velocity 13.3 pts (44%) Breadth 6.1 pts (20%) Claim depth 4.3 pts (14%)

Qualcomm Incorporated · highest

85
Shin-Etsu Engineering · this assignee

30
3D Lighting… · lowest

7

What this shows Shin-etsu's Innovation Score is 30.5/100 (34th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Shin-etsu?

Each dot is one of Shin-etsu’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Shin-etsu’s own 7.2 claims/patent is at or below the 10.5 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Shin-etsu vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Shin-etsu's grants concentrate

Shin-Etsu Engineering Co., Ltd. is a focused PatentsView assignee: 3 CPC subclasses with 83.3% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2022 (2 grants) versus a trough of 1 in 2019. By volume, Shin-etsu sits between Shenzhen kensonic Intelligent Technology Co., Ltd. and Shuangqing Home Furnishings Co., Ltd.

Shin-etsu's three-year grant acceleration

Shin-Etsu Engineering Co., Ltd. shows 4 grants in 2022–2024 against only 2 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Shenzhen kensonic…

6
Sherpa Enterprises

6
Sherritt Internat…

6
Shimadzu Research…

6
Shoot the Moon Pr…

6
Shooting Edge Tec…

6
Shorefield Holdin…

6
Shuangqing Home F…

6
Shin-etsu Enginee… ◀

6

What this shows Shin-Etsu holds 6 patents at rank #43,226, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Shin-Etsu

By rank, the assignees closest to #43,226 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in Shin-Etsu's primary technology class.

Shin-etsu's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

30 34th percentile higher than 34% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2019–2023

Grants by year

Teal-shaded recent years (2020–present) versus the 2019–2019 baseline. Full figures in the table below.

View data table

Shin-Etsu Engineering Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2019	1	16.7%
2020	1	16.7%
2022	2	33.3%
2023	2	33.3%

Which technologies does Shin-Etsu Engineering Co., Ltd. patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 5

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 3

B24B - Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents 1

Top 3 of 3 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Shin-Etsu Engineering Co., Ltd.'s patent record in context - here's where to go next.

Shin-Etsu Engineering Co., Ltd.'s lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 83.3% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #43,064 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Shin-Etsu Engineering Co., Ltd. against Shenzhen kensonic Intelligent Technology Co., Ltd., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 30.5/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.