Where does Shanghai Tianyang HOT Melt Adhesive Co., Ltd rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Shanghai Tianyang HOT Melt Adhesive Co., Ltd ranks #42,945 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Shanghai Tianyang HOT Melt Adhesive Co., Ltd hold?

Shanghai Tianyang HOT Melt Adhesive Co., Ltd holds 6 US utility patents granted between 2015 and 2020, spanning 10 technology areas.

What is Shanghai Tianyang HOT Melt Adhesive Co., Ltd's Innovation Score?

Shanghai Tianyang HOT Melt Adhesive Co., Ltd has an Innovation Score of 21.6 out of 100 (9th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Shanghai Tianyang HOT Melt Adhesive Co., Ltd's patent grant rate increasing or decreasing?

Shanghai Tianyang HOT Melt Adhesive Co., Ltd's recent grant velocity is -80% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Shanghai Tianyang HOT Melt Adhesive Co., Ltd's patents?

Shanghai Tianyang HOT Melt Adhesive Co., Ltd's patents average 6.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Shanghai Tianyang HOT Melt Adhesive Co., Ltd

Q: What technology areas does Shanghai Tianyang HOT Melt Adhesive Co., Ltd focus on?

Shanghai Tianyang HOT Melt Adhesive Co., Ltd's top technology area is C09J (ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives) with 6 patents, ranking #152 of 837 assignees active in that subclass. Grants appear in 10 CPC subclasses total.

Q: How is the Shanghai Tianyang HOT Melt Adhesive Co., Ltd patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO PatentsView assignee record - 6 granted patents across 10 technology areas, recorded in grant years 2015–2020. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: C09J (ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Shanghai ranks #42,945 of 49,997 tracked US assignees by granted-patent volume, with 6 patents across 10 technology areas.

#42,945
of 49,997 US assignees by volume: 9th percentile
by Innovation Score (21.6/100): 6.2
avg claims per patent: -80%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R42945 · Foreign Corporation #42,945 · 6 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 6 grants
LOWER-Q #42,945/49,997
PHOTO-FINISH Shanghai Jiaotong…
CPC-FOCUS C09J · 10 areas
INNOV-THIN 21.6/100
CLAIMS-SPARSE 6.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -80% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Shanghai Jiaotong University School OF Medicine (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Shanghai’s 21.6 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 6.7 pts (31%) Velocity 0.0 pts (0%) Breadth 11.2 pts (52%) Claim depth 3.7 pts (17%)

Qualcomm Incorporated · highest

85
Shanghai Tianyang… · this assignee

22
3D Lighting… · lowest

7

What this shows Shanghai's Innovation Score is 21.6/100 (9th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Shanghai?

Each dot is one of Shanghai’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Shanghai’s own 6.2 claims/patent is at or below the 15.0 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Shanghai vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Shanghai's grants concentrate

Shanghai Tianyang HOT Melt Adhesive Co., Ltd is a focused PatentsView assignee: 10 CPC subclasses with 100% of grants classified under C09J (ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives). Peak complete grant year is 2019 (3 grants) versus a trough of 1 in 2015. By volume, Shanghai sits between Shanghai Jiaotong University School OF Medicine and Shantou Chenghai Yate Auto Accessories Factory.

Shanghai Jiaotong…

6
Shanghai Micropor…

6
Shanghai NEW Toba…

6
Shanghai Runhood…

6
Shanghai Unicar-t…

6
Shanghai United I…

6
Shanghai Vision M…

6
Shantou Chenghai…

6
Shanghai Tianyang… ◀

6

What this shows Shanghai holds 6 patents at rank #42,823, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Shanghai

By rank, the assignees closest to #42,823 in granted patent volume.

Leaders in C09J (Adhesives)

Other assignees with the most granted patents in Shanghai's primary technology class.

Shanghai's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

22 9th percentile higher than 9% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2020

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Shanghai Tianyang HOT Melt Adhesive Co., Ltd patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	1	16.7%
2016	1	16.7%
2019	3	50.0%
2020	1	16.7%

Which technologies does Shanghai Tianyang HOT Melt Adhesive Co., Ltd patent most?

C09J - ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives 6

C08G - Macromolecular Compounds Obtained Otherwise Than BY Reactions Only Involving Unsaturated Carbon-to-carbon Bonds 3

C08L - Compositions OF Macromolecular Compounds 2

C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients 2

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 1

H10F - Inorganic Semiconductor Devices Sensitive TO Infrared Radiation, Light, Electromagnetic Radiation OF Shorter Wavelength OR Corpuscular Radiation 1

D04H - Making Textile Fabrics, e.g. From Fibres OR Filamentary Material ; Fabrics Made BY Such Processes OR Apparatus, e.g. Felts, Non-woven FABRICS; COTTON-WOOL; Wadding ; ; Non-woven Fabrics From Staple Fibres, Filaments OR Yarns, Bonded With AT Least ONE Web-like Material During Their Consolidation 1

D10B - Indexing Scheme Associated With Sublasses OF Section D, Relating TO Textiles 1

D01D - Mechanical Methods OR Apparatus IN THE Manufacture OF Artificial Filaments, Threads, Fibres, Bristles OR Ribbons 1

C08J - WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h 1

Top 10 of 10 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Shanghai Tianyang HOT Melt Adhesive Co., Ltd's patent record in context - here's where to go next.

Shanghai Tianyang HOT Melt Adhesive Co., Ltd's lead technology class is C09J (ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives), 100% of its portfolio - see every assignee active in that class. Explore C09J
Ranked #42,945 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Shanghai Tianyang HOT Melt Adhesive Co., Ltd against Shanghai Jiaotong University School OF Medicine, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 21.6/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.