Where does SH Materials Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), SH Materials Co., Ltd. ranks #37,426 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does SH Materials Co., Ltd. hold?

SH Materials Co., Ltd. holds 7 US utility patents granted between 2015 and 2019, spanning 2 technology areas.

What is SH Materials Co., Ltd.'s Innovation Score?

SH Materials Co., Ltd. has an Innovation Score of 17.6 out of 100 (4th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does SH Materials Co., Ltd. focus on?

SH Materials Co., Ltd.'s top technology area is H01L (Semiconductor Devices NOT Covered BY Class H10) with 7 patents, ranking #1,149 of 3,373 assignees active in that subclass. Grants appear in 2 CPC subclasses total.

Is SH Materials Co., Ltd.'s patent grant rate increasing or decreasing?

SH Materials Co., Ltd.'s recent grant velocity is -100% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for SH Materials Co., Ltd.'s patents?

SH Materials Co., Ltd.'s patents average 9.0 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the SH Materials Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

SH Materials Co., Ltd.

USPTO PatentsView assignee record - 7 granted patents across 2 technology areas, recorded in grant years 2015–2019. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01L (Semiconductor Devices NOT Covered BY Class H10).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, SH ranks #37,426 of 49,997 tracked US assignees by granted-patent volume, with 7 patents across 2 technology areas.

#37,426
of 49,997 US assignees by volume: 4th percentile
by Innovation Score (17.6/100): 9.0
avg claims per patent: -100%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R37426 · Foreign Corporation #37,426 · 7 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-LOW · CLAIMS-PAR · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 7 grants
MID-PACK #37,426/49,997
PHOTO-FINISH SET North America
CPC-NARROW H01L · 2 areas
INNOV-LOW 17.6/100
CLAIMS-PAR 9.0 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -100% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: SET North America, LLC (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How SH’s 17.6 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 7.2 pts (41%) Velocity 0.0 pts (0%) Breadth 5.0 pts (28%) Claim depth 5.4 pts (31%)

Qualcomm Incorporated · highest

85
SH Materials · this assignee

18
3D Lighting… · lowest

7

What this shows SH's Innovation Score is 17.6/100 (4th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for SH?

Each dot is one of SH’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). SH’s own 9.0 claims/patent is ABOVE the 8.9 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

SH vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where SH's grants concentrate

SH Materials Co., Ltd. is a focused PatentsView assignee: 2 CPC subclasses with 100% of grants classified under H01L (Semiconductor Devices NOT Covered BY Class H10). Peak complete grant year is 2017 (4 grants) versus a trough of 1 in 2015. By volume, SH sits between SET North America, LLC and Shanghai DE Novo Pharmatech Co., Ltd..

SET North America

7
Seti-tec

7
Seventy Eight

7
Sexy Back BRA

7
Shah

7
Shamrock Internat…

7
Shanghai Conant O…

7
Shanghai DE Novo…

7
SH Materials ◀

7

What this shows SH holds 7 patents at rank #37,358, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near SH

By rank, the assignees closest to #37,358 in granted patent volume.

Leaders in H01L (Semiconductor Devices NOT Covered BY Class H10)

Other assignees with the most granted patents in SH's primary technology class.

SH's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

18 4th percentile higher than 4% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2019

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

SH Materials Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	1	14.3%
2017	4	57.1%
2018	1	14.3%
2019	1	14.3%

Which technologies does SH Materials Co., Ltd. patent most?

H01L - Semiconductor Devices NOT Covered BY Class H10 7

H10H - Inorganic Light-emitting Semiconductor Devices Having Potential Barriers 1

Top 2 of 2 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

SH Materials Co., Ltd.'s patent record in context - here's where to go next.

SH Materials Co., Ltd.'s lead technology class is H01L (Semiconductor Devices NOT Covered BY Class H10), 100% of its portfolio - see every assignee active in that class. Explore H01L
Ranked #37,426 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare SH Materials Co., Ltd. against SET North America, LLC, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 17.6/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.