Where does Kunshan Tianyang HOT Melt Adhesive Co., Ltd rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Kunshan Tianyang HOT Melt Adhesive Co., Ltd ranks #41,311 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Kunshan Tianyang HOT Melt Adhesive Co., Ltd hold?

Kunshan Tianyang HOT Melt Adhesive Co., Ltd holds 6 US utility patents granted between 2015 and 2020, spanning 10 technology areas.

What is Kunshan Tianyang HOT Melt Adhesive Co., Ltd's Innovation Score?

Kunshan Tianyang HOT Melt Adhesive Co., Ltd has an Innovation Score of 21.6 out of 100 (9th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Kunshan Tianyang HOT Melt Adhesive Co., Ltd's patent grant rate increasing or decreasing?

Kunshan Tianyang HOT Melt Adhesive Co., Ltd's recent grant velocity is -80% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Kunshan Tianyang HOT Melt Adhesive Co., Ltd's patents?

Kunshan Tianyang HOT Melt Adhesive Co., Ltd's patents average 6.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Kunshan Tianyang HOT Melt Adhesive Co., Ltd patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Kunshan Tianyang HOT Melt Adhesive Co., Ltd

Q: What technology areas does Kunshan Tianyang HOT Melt Adhesive Co., Ltd focus on?

Kunshan Tianyang HOT Melt Adhesive Co., Ltd's top technology area is C09J (ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives) with 6 patents. Grants appear in 10 CPC subclasses total.

USPTO PatentsView assignee record - 6 granted patents across 10 technology areas, recorded in grant years 2015–2020. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: C09J (ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Kunshan ranks #41,311 of 49,997 tracked US assignees by granted-patent volume, with 6 patents across 10 technology areas.

#41,311
of 49,997 US assignees by volume: 9th percentile
by Innovation Score (21.6/100): 6.2
avg claims per patent: -80%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R41311 · Foreign Corporation #41,311 · 6 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 6 grants
LOWER-Q #41,311/49,997
PHOTO-FINISH Kthepower
CPC-FOCUS C09J · 10 areas
INNOV-THIN 21.6/100
CLAIMS-SPARSE 6.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -80% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Kthepower Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Kunshan Tianyang… · this assignee

22
3D Lighting… · lowest

7

What this shows Kunshan's Innovation Score is 21.6/100 (9th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Kunshan's grants concentrate

Kunshan Tianyang HOT Melt Adhesive Co., Ltd is a focused PatentsView assignee: 10 CPC subclasses with 100% of grants classified under C09J (ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives). Peak complete grant year is 2019 (3 grants) versus a trough of 1 in 2015. By volume, Kunshan sits between Kthepower Inc. and Kwik LOK Corporation.

Kthepower

6
Kucharco

6
Kukdo Chemical

6
Kulcloud

6
Kuraray America

6
Kuraray Chemical

6
Kusumoto Chemicals

6
Kwik LOK

6
Kunshan Tianyang… ◀

6

What this shows Kunshan holds 6 patents at rank #41,215, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Kunshan

By rank, the assignees closest to #41,215 in granted patent volume.

Leaders in C09J (Adhesives)

Other assignees with the most granted patents in Kunshan's primary technology class.

Kunshan's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

22 9th percentile higher than 9% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2020

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Kunshan Tianyang HOT Melt Adhesive Co., Ltd patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	1	16.7%
2016	1	16.7%
2019	3	50.0%
2020	1	16.7%

Which technologies does Kunshan Tianyang HOT Melt Adhesive Co., Ltd patent most?

C09J - ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives 6

C08G - Macromolecular Compounds Obtained Otherwise Than BY Reactions Only Involving Unsaturated Carbon-to-carbon Bonds 3

C08L - Compositions OF Macromolecular Compounds 2

C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients 2

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 1

H10F - Inorganic Semiconductor Devices Sensitive TO Infrared Radiation, Light, Electromagnetic Radiation OF Shorter Wavelength OR Corpuscular Radiation 1

D04H - Making Textile Fabrics, e.g. From Fibres OR Filamentary Material ; Fabrics Made BY Such Processes OR Apparatus, e.g. Felts, Non-woven FABRICS; COTTON-WOOL; Wadding ; ; Non-woven Fabrics From Staple Fibres, Filaments OR Yarns, Bonded With AT Least ONE Web-like Material During Their Consolidation 1

D10B - Indexing Scheme Associated With Sublasses OF Section D, Relating TO Textiles 1

D01D - Mechanical Methods OR Apparatus IN THE Manufacture OF Artificial Filaments, Threads, Fibres, Bristles OR Ribbons 1

C08J - WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h 1

Top 10 of 10 technology areas

Where it ranks

Overall rank by patents

#41,311

of 49,997 tracked assignees

Innovation Score

21.6 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Kunshan Tianyang HOT Melt Adhesive Co., Ltd's patent record in context - here's where to go next.

Kunshan Tianyang HOT Melt Adhesive Co., Ltd's lead technology class is C09J (ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives), 100% of its portfolio - see every assignee active in that class. Explore C09J
Ranked #41,311 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Kunshan Tianyang HOT Melt Adhesive Co., Ltd against Kthepower Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 21.6/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.