Where does HSP Technologies Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), HSP Technologies Inc. ranks #22,728 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does HSP Technologies Inc. hold?

HSP Technologies Inc. holds 12 US utility patents granted between 2017 and 2025, spanning 8 technology areas.

What is HSP Technologies Inc.'s Innovation Score?

HSP Technologies Inc. has an Innovation Score of 43.9 out of 100 (top 27% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is HSP Technologies Inc.'s patent grant rate increasing or decreasing?

HSP Technologies Inc.'s recent grant velocity is +900% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for HSP Technologies Inc.'s patents?

HSP Technologies Inc.'s patents average 8.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the HSP Technologies Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

HSP Technologies Inc.

Q: What technology areas does HSP Technologies Inc. focus on?

HSP Technologies Inc.'s top technology area is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing) with 12 patents, ranking #508 of 4,378 assignees active in that subclass. Grants appear in 8 CPC subclasses total.

USPTO PatentsView assignee record - 12 granted patents across 8 technology areas, recorded in grant years 2017–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, HSP ranks #22,728 of 49,997 tracked US assignees by granted-patent volume, with 12 patents across 8 technology areas.

#22,728
of 49,997 US assignees by volume: Top 27%
by Innovation Score (43.9/100): 8.3
avg claims per patent: +900%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R22728 · Foreign Corporation #22,728 · 12 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 12 grants
MID-PACK #22,728/49,997
PHOTO-FINISH HON LIN Technology
CPC-NARROW B29C · 8 areas
INNOV-PAR 43.9/100
CLAIMS-PAR 8.3 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +900% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: HON LIN Technology Co., Ltd. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How HSP’s 43.9 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 8.9 pts (20%) Velocity 20.0 pts (46%) Breadth 10.0 pts (23%) Claim depth 5.0 pts (11%)

Qualcomm Incorporated · highest

85
HSP · this assignee

44
3D Lighting… · lowest

7

What this shows HSP's Innovation Score is 43.9/100 (top 27% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for HSP?

Each dot is one of HSP’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). HSP’s own 8.3 claims/patent is at or below the 14.9 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

HSP vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where HSP's grants concentrate

HSP Technologies Inc. is a focused PatentsView assignee: 8 CPC subclasses with 100% of grants classified under B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing). Peak complete grant year is 2022 (4 grants) versus a trough of 1 in 2017. By volume, HSP sits between HON LIN Technology Co., Ltd. and HYC Co., Ltd..

HSP's three-year grant acceleration

HSP Technologies Inc. shows 8 grants in 2022–2024 against only 2 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

HON LIN Technology

12
Hongfujin Precisi…

12
House OF Metals

12
Hsbc Technology &…

12
HTE THE High Thro…

12
HTI IP

12
Hyaxiom

12
HYC

12
HSP ◀

12

What this shows HSP holds 12 patents at rank #22,704, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near HSP

By rank, the assignees closest to #22,704 in granted patent volume.

Leaders in B29C (Shaping OR Joining OF Plastics)

Other assignees with the most granted patents in HSP's primary technology class.

HSP's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

44 Top 27% higher than 73% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2017–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2017–2019 baseline. Full figures in the table below.

View data table

HSP Technologies Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2017	1	8.3%
2021	2	16.7%
2022	4	33.3%
2023	4	33.3%
2025partial year	1	8.3%

Which technologies does HSP Technologies Inc. patent most?

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 12

B29B - Preparation OR Pretreatment OF THE Material TO BE SHAPED; Making Granules OR PREFORMS; Recovery OF Plastics OR Other Constituents OF Waste Material Containing Plastics 11

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 8

C08L - Compositions OF Macromolecular Compounds 1

C08F - Macromolecular Compounds Obtained BY Reactions Only Involving Carbon-to-carbon Unsaturated Bonds 1

C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients 1

C08J - WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h 1

H01B - CABLES; CONDUCTORS; INSULATORS; Selection OF Materials FOR Their Conductive, Insulating OR Dielectric Properties 1

Top 8 of 8 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

HSP Technologies Inc.'s patent record in context - here's where to go next.

HSP Technologies Inc.'s lead technology class is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing), 100% of its portfolio - see every assignee active in that class. Explore B29C
Ranked #22,728 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare HSP Technologies Inc. against HON LIN Technology Co., Ltd., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 43.9/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.