Where does Hsing CHAU Industrial Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hsing CHAU Industrial Co., Ltd. ranks #24,485 of 50,000 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hsing CHAU Industrial Co., Ltd. hold?

Hsing CHAU Industrial Co., Ltd. holds 11 US utility patents granted between 2016 and 2024, spanning 5 technology areas.

What is Hsing CHAU Industrial Co., Ltd.'s Innovation Score?

Hsing CHAU Industrial Co., Ltd. has an Innovation Score of 42.8 out of 100 (top 30% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Hsing CHAU Industrial Co., Ltd.'s patent grant rate increasing or decreasing?

Hsing CHAU Industrial Co., Ltd.'s recent grant velocity is -62% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Hsing CHAU Industrial Co., Ltd.'s patents?

Hsing CHAU Industrial Co., Ltd.'s patents average 10.6 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Hsing CHAU Industrial Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Hsing CHAU Industrial Co., Ltd.

Q: What technology areas does Hsing CHAU Industrial Co., Ltd. focus on?

Hsing CHAU Industrial Co., Ltd.'s top technology area is H01R (ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS) with 9 patents. Grants appear in 5 CPC subclasses total.

USPTO PatentsView assignee record - 11 granted patents across 5 technology areas, recorded in grant years 2016–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01R (ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS).

Compiled by PlainPatent · May 15, 2026

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Hsing ranks #24,485 of 50,000 tracked US assignees by granted-patent volume, with 11 patents across 5 technology areas.

#24,485
of 50,000 US assignees by volume: Top 30%
by Innovation Score (42.8/100): 10.6
avg claims per patent: -62%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R24485 · Foreign Corporation #24,485 · 11 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 11 grants
MID-PACK #24,485/50,000
PHOTO-FINISH HOLLYMATIC
CPC-NARROW H01R · 5 areas
INNOV-PAR 42.8/100
CLAIMS-PAR 10.6 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -62% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Hollymatic Corporation (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Hsing CHAU Industrial · this assignee

43
3D Lighting Innovati… · lowest

7

What this shows Hsing's Innovation Score is 42.8/100 (top 30% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Hsing's grants concentrate

Hsing CHAU Industrial Co., Ltd. is a focused PatentsView assignee: 5 CPC subclasses with 81.8% of grants classified under H01R (ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS). Peak complete grant year is 2016 (3 grants) versus a trough of 1 in 2019. By volume, Hsing sits between Hollymatic Corporation and Huxley Medical, Inc..

Hsing's three-year grant acceleration

Hsing CHAU Industrial Co., Ltd. shows 3 grants in 2022–2024 against only 1 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Hollymatic

11
Hoteck

11
Houghton Technical

11
HP3 Real

11
HTS

11
Huber SE

11
Huizhou Roypow Te…

11
Huxley Medical

11
Hsing CHAU Indust… ◀

11

What this shows Hsing holds 11 patents at rank #24,452, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hsing

By rank, the assignees closest to #24,452 in granted patent volume.

Leaders in H01R (Electrically-conductive Connections)

Other assignees with the most granted patents in Hsing's primary technology class.

Hsing's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

43 Top 30% higher than 70% of 50,000 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2016–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2016–2019 baseline. Full figures in the table below.

View data table

Hsing CHAU Industrial Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2016	3	27.3%
2017	2	18.2%
2018	2	18.2%
2019	1	9.1%
2024	3	27.3%

Which technologies does Hsing CHAU Industrial Co., Ltd. patent most?

H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 9

G06F - ELECTRIC DIGITAL DATA PROCESSING 1

H01F - MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 1

H04Q - SELECTING 1

G02B - OPTICAL ELEMENTS, SYSTEMS OR APPARATUS 1

Top 5 of 5 technology areas

Where it ranks

Overall rank by patents

#24,485

of 50,000 tracked assignees

Innovation Score

42.8 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.