Where does Horiba Stec, Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Horiba Stec, Co., Ltd. ranks #2,372 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Horiba Stec, Co., Ltd. hold?

Horiba Stec, Co., Ltd. holds 165 US utility patents granted between 2015 and 2025, spanning 48 technology areas.

What is Horiba Stec, Co., Ltd.'s Innovation Score?

Horiba Stec, Co., Ltd. has an Innovation Score of 53.6 out of 100 (top 9% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Horiba Stec, Co., Ltd. focus on?

Horiba Stec, Co., Ltd.'s top technology area is G05D (Systems FOR Controlling OR Regulating Non-electric Variables) with 76 patents, ranking #60 of 2,515 assignees active in that subclass. Grants appear in 48 CPC subclasses total.

Is Horiba Stec, Co., Ltd.'s patent grant rate increasing or decreasing?

Horiba Stec, Co., Ltd.'s recent grant velocity is +5% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Horiba Stec, Co., Ltd.'s patents?

Horiba Stec, Co., Ltd.'s patents average 9.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Horiba Stec, Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Horiba Stec, Co., Ltd.

USPTO PatentsView assignee record - 165 granted patents across 48 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: G05D (Systems FOR Controlling OR Regulating Non-electric Variables).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Horiba ranks #2,372 of 49,997 tracked US assignees by granted-patent volume, with 165 patents across 48 technology areas.

#2,372
of 49,997 US assignees by volume: Top 9%
by Innovation Score (53.6/100): 9.2
avg claims per patent: +5%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R2372 · Foreign Corporation #2,372 · 165 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-WIDE · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · VEL-FLAT · BOOK-FULL

GRANTS-MID 165 grants
TOP-DECILE #2,372/49,997
PHOTO-FINISH A Raymond ET CIE
CPC-WIDE G05D · 48 areas
INNOV-PAR 53.6/100
CLAIMS-PAR 9.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-FLAT +5% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: A. Raymond ET CIE (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Horiba’s 53.6 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 17.7 pts (33%) Velocity 5.9 pts (11%) Breadth 24.5 pts (46%) Claim depth 5.5 pts (10%)

Qualcomm Incorporated · highest

85
Heatcraft Refrigerat… · near

54
Eppendorf · near

54
Horiba Stec · this assignee

54
Tandem Diabetes Care · near

54
Sanden · near

54
3D Lighting… · lowest

7

What this shows Horiba's Innovation Score is 53.6/100 (top 9% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Horiba?

Each dot is one of Horiba’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Horiba’s own 9.2 claims/patent is at or below the 13.5 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Horiba vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Horiba's grants concentrate

Horiba Stec, Co., Ltd. is a focused PatentsView assignee: 48 CPC subclasses with 46.1% of grants classified under G05D (Systems FOR Controlling OR Regulating Non-electric Variables). Peak complete grant year is 2019 (18 grants) versus a trough of 8 in 2016. By volume, Horiba sits between A. Raymond ET CIE and SOLiD, Inc..

Horiba's three-year grant acceleration

From 2019–2021 to 2022–2024, Horiba Stec, Co., Ltd. moved from 51 to 45 grants (0.88x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #1,544. See the growth leaderboard.

A Raymond ET CIE

165
Amdocs Software S…

165
DMG Mori

165
Godo Kaisha IP Br…

165
Inscripta

165
Meso Scale

165
Ping AN Technolog…

165
Solid

165
Horiba Stec ◀

165

What this shows Horiba holds 165 patents at rank #2,372, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Horiba

By rank, the assignees closest to #2,372 in granted patent volume.

Leaders in G05D (Systems FOR Controlling OR Regulating Non-electric Variables)

Other assignees with the most granted patents in Horiba's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Horiba, neither rank-band nor same-CPC leaders (those blocks stay above). In G05D (Systems FOR Controlling OR Regulating Non-electric Variables), Horiba ranks #60 of 2,515 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (54 here).

Tandem Diabetes Care, Inc. 54 Eppendorf AG 54 Sanden Corporation 54 Heatcraft Refrigeration Products LLC 54

Similar claim depth

Nearest assignees by average claims per patent (9.2 here).

Atlas Copco Industrial Technique AB 9.2 avg Wuhan University 9.2 avg YKK Corporation 9.2 avg Lapis Semiconductor Co., Ltd. 9.2 avg

Horiba's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

54 Top 9% higher than 91% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Horiba Stec, Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	16	9.7%
2016	8	4.8%
2017	15	9.1%
2018	17	10.3%
2019	18	10.9%
2020	16	9.7%
2021	17	10.3%
2022	17	10.3%
2023	16	9.7%
2024	12	7.3%
2025partial year	13	7.9%

Which technologies does Horiba Stec, Co., Ltd. patent most?

G05D - Systems FOR Controlling OR Regulating Non-electric Variables 76

G01F - Measuring Volume, Volume Flow, Mass Flow OR Liquid LEVEL; Metering BY Volume 58

F16K - VALVES; TAPS; COCKS; ACTUATING-FLOATS; Devices FOR Venting OR Aerating 43

Y10T - Technical Subjects Covered BY Former US Classification 32

G01N - Investigating OR Analysing Materials BY Determining Their Chemical OR Physical Properties 22

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 20

G05B - Control OR Regulating Systems IN GENERAL; Functional Elements OF Such SYSTEMS; Monitoring OR Testing Arrangements FOR Such Systems OR Elements 13

H01L - Semiconductor Devices NOT Covered BY Class H10 13

G01L - Measuring Force, Stress, Torque, Work, Mechanical Power, Mechanical Efficiency, OR Fluid Pressure 9

H01J - Electric Discharge Tubes OR Discharge Lamps 6

B01F - Mixing, e.g. Dissolving, Emulsifying OR Dispersing 5

H02N - Electric Machines NOT Otherwise Provided FOR 5

B01D - Separation 5

G01D - Measuring NOT Specially Adapted FOR A Specific VARIABLE; Arrangements FOR Measuring TWO OR More Variables NOT Covered IN A Single Other SUBCLASS; Tariff Metering APPARATUS; Measuring OR Testing NOT Otherwise Provided FOR 4

F16L - PIPES; Joints OR Fittings FOR PIPES; Supports FOR Pipes, Cables OR Protective TUBING; Means FOR Thermal Insulation IN General 4

Top 15 of 48 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Horiba Stec, Co., Ltd.'s patent record in context - here's where to go next.

Horiba Stec, Co., Ltd.'s lead technology class is G05D (Systems FOR Controlling OR Regulating Non-electric Variables), 46.1% of its portfolio - see every assignee active in that class. Explore G05D
Ranked #2,372 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Horiba Stec, Co., Ltd. against A. Raymond ET CIE, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 53.6/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.