Where does Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. ranks #2,821 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. hold?

Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. holds 136 US utility patents granted between 2017 and 2022, spanning 63 technology areas.

What is Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd.'s Innovation Score?

Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. has an Innovation Score of 51.9 out of 100 (top 11% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd.'s patent grant rate increasing or decreasing?

Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd.'s recent grant velocity is +52% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd.'s patents?

Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd.'s patents average 14.5 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd.

Q: What technology areas does Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. focus on?

Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd.'s top technology area is H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components) with 65 patents, ranking #122 of 3,545 assignees active in that subclass. Grants appear in 63 CPC subclasses total.

Q: How is the Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO PatentsView assignee record - 136 granted patents across 63 technology areas, recorded in grant years 2017–2022. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Hongfujin ranks #2,821 of 49,997 tracked US assignees by granted-patent volume, with 136 patents across 63 technology areas.

#2,821
of 49,997 US assignees by volume: Top 11%
by Innovation Score (51.9/100): 14.5
avg claims per patent: +52%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R2821 · Foreign Corporation #2,821 · 136 grants

GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-WIDE · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MID 136 grants
TOP-DECILE #2,821/49,997
PHOTO-FINISH Alphatec Spine
CPC-WIDE H05K · 63 areas
INNOV-PAR 51.9/100
CLAIMS-RICH 14.5 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +52% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Alphatec Spine, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Hongfujin’s 51.9 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 17.0 pts (33%) Velocity 1.2 pts (2%) Breadth 25.0 pts (48%) Claim depth 8.7 pts (17%)

Qualcomm Incorporated · highest

85
Chanel Parfums Beaute · near

52
Hongfujin Precision… · this assignee

52
Qingdao Haier… · near

52
Raytheon Canada · near

52
Sinfonia Technology · near

52
3D Lighting… · lowest

7

What this shows Hongfujin's Innovation Score is 51.9/100 (top 11% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Hongfujin?

Each dot is one of Hongfujin’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Hongfujin’s own 14.5 claims/patent is ABOVE the 13.1 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Hongfujin vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

How Hongfujin's grant cadence moved

Between 2020–2024, Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. received 82 grants versus 54 in 2015–2019 (+52% equal-window velocity, above median growth). Across complete PatentsView years, output peaked in 2019 at 35 grants and bottomed in 2017 at 3. Lead class H05K accounts for 47.8% of the portfolio across 63 subclasses. Volume neighbours: Alphatec Spine, Inc. (#2,816) and Jungheinrich AG (#2,824).

Hongfujin's three-year grant acceleration

From 2019–2021 to 2022–2024, Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. moved from 99 to 18 grants (0.18x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #3,118. See the growth leaderboard.

Alphatec Spine

136
Beijing BOE Senso…

136
Chung Yuan Christ…

136
Dayco IP Holdings

136
Haworth

136
Huawei Device (Do…

136
Industry Academy…

136
Jungheinrich

136
Hongfujin Precisi… ◀

136

What this shows Hongfujin holds 136 patents at rank #2,820, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hongfujin

By rank, the assignees closest to #2,820 in granted patent volume.

Leaders in H05K (Printed Circuits)

Other assignees with the most granted patents in Hongfujin's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Hongfujin, neither rank-band nor same-CPC leaders (those blocks stay above). In H05K (Printed Circuits), Hongfujin ranks #122 of 3,545 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (52 here).

Sinfonia Technology Co., Ltd. 52 Chanel Parfums Beaute 52 Raytheon Canada Limited 52 Qingdao Haier Air-conditioning Electronic Co., Ltd. 52

Similar claim depth

Nearest assignees by average claims per patent (14.5 here).

SL Corporation 14.5 avg HL Mando Corporation 14.5 avg Continental Automotive Systems Inc. 14.5 avg Apollo Intelligent Driving Technology (BEIJING) Co., Ltd. 14.5 avg

Hongfujin's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

52 Top 11% higher than 89% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2017–2022

Grants by year

Teal-shaded recent years (2020–present) versus the 2017–2019 baseline. Full figures in the table below.

View data table

Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2017	3	2.2%
2018	16	11.8%
2019	35	25.7%
2020	33	24.3%
2021	31	22.8%
2022	18	13.2%

Which technologies does Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. patent most?

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 65

G06F - Electric Digital Data Processing 43

G11B - Information Storage Based ON Relative Movement Between Record Carrier AND Transducer 19

H04L - Transmission OF Digital Information, e.g. Telegraphic Communication 12

Y02D - Climate Change Mitigation Technologies IN Information AND Communication Technologies [ICT], I.E. Information AND Communication Technologies Aiming AT THE Reduction OF Their OWN Energy USE 12

B60Q - Arrangement OF Signalling OR Lighting Devices, THE Mounting OR Supporting Thereof OR Circuits Therefor, FOR Vehicles IN General 11

A47B - TABLES; DESKS; Office FURNITURE; CABINETS; DRAWERS; General Details OF Furniture 9

G09F - DISPLAYING; ADVERTISING; SIGNS; Labels OR NAME-PLATES; Seals 6

H01R - Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors 6

G06V - Image OR Video Recognition OR Understanding 5

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 4

G06Q - Information AND Communication Technology [ICT] Specially Adapted FOR Administrative, Commercial, Financial, Managerial OR Supervisory PURPOSES; Systems OR Methods Specially Adapted FOR Administrative, Commercial, Financial, Managerial OR Supervisory Purposes, NOT Otherwise Provided FOR 4

E01F - Additional Work, Such AS Equipping Roads OR THE Construction OF Platforms, Helicopter Landing Stages, Signs, Snow Fences, OR THE Like 4

F28D - Heat-exchange Apparatus, NOT Provided FOR IN Another Subclass, IN Which THE Heat-exchange Media DO NOT Come Into Direct Contact 4

G05D - Systems FOR Controlling OR Regulating Non-electric Variables 3

Top 15 of 63 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd.'s patent record in context - here's where to go next.

Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd.'s lead technology class is H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components), 47.8% of its portfolio - see every assignee active in that class. Explore H05K
Ranked #2,821 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Hongfujin Precision ELECTRONICS(TIANJIN)CO., Ltd. against Alphatec Spine, Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 51.9/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.