Where does Diamet Corporation rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Diamet Corporation ranks #8,575 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Diamet Corporation hold?

Diamet Corporation holds 37 US utility patents granted between 2015 and 2025, spanning 20 technology areas.

What is Diamet Corporation's Innovation Score?

Diamet Corporation has an Innovation Score of 37.4 out of 100 (top 44% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Diamet Corporation's patent grant rate increasing or decreasing?

Diamet Corporation's recent grant velocity is +92% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Diamet Corporation's patents?

Diamet Corporation's patents average 8.4 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Diamet Corporation patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Diamet Corporation

Q: What technology areas does Diamet Corporation focus on?

Diamet Corporation's top technology area is B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder) with 30 patents, ranking #49 of 926 assignees active in that subclass. Grants appear in 20 CPC subclasses total.

USPTO PatentsView assignee record - 37 granted patents across 20 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Diamet ranks #8,575 of 49,997 tracked US assignees by granted-patent volume, with 37 patents across 20 technology areas.

#8,575
of 49,997 US assignees by volume: Top 44%
by Innovation Score (37.4/100): 8.4
avg claims per patent: +92%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R8575 · Foreign Corporation #8,575 · 37 grants

GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-PAR · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-SMALL 37 grants
UPPER-Q #8,575/49,997
PHOTO-FINISH Daktronics
CPC-FOCUS B22F · 20 areas
INNOV-THIN 37.4/100
CLAIMS-PAR 8.4 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +92% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Daktronics, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Diamet’s 37.4 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 12.6 pts (34%) Velocity 4.0 pts (11%) Breadth 15.8 pts (42%) Claim depth 5.0 pts (13%)

Qualcomm Incorporated · highest

85
Case-mate · near

37
Diamet · this assignee

37
EPICMEMS(XIAMEN) · near

37
Humanscale · near

37
SyneuRx Internationa… · near

37
3D Lighting… · lowest

7

What this shows Diamet's Innovation Score is 37.4/100 (top 44% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Diamet?

Each dot is one of Diamet’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Diamet’s own 8.4 claims/patent is at or below the 12.8 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Diamet vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Diamet's grants concentrate

Diamet Corporation is a focused PatentsView assignee: 20 CPC subclasses with 81.1% of grants classified under B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder). Peak complete grant year is 2020 (11 grants) versus a trough of 1 in 2019. By volume, Diamet sits between Daktronics, Inc. and Exemplar Design, LLC.

Diamet's three-year grant acceleration

Diamet Corporation shows 9 grants in 2022–2024 against only 15 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Daktronics

37
Dal-tile

37
Daniel Defense

37
Decision Sciences…

37
Digitaloptics Mems

37
Elesa S P A

37
Episurf Ip-manage…

37
Exemplar Design

37
Diamet ◀

37

What this shows Diamet holds 37 patents at rank #8,578, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Diamet

By rank, the assignees closest to #8,578 in granted patent volume.

Leaders in B22F (Working Metallic Powder)

Other assignees with the most granted patents in Diamet's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Diamet, neither rank-band nor same-CPC leaders (those blocks stay above). In B22F (Working Metallic Powder), Diamet ranks #49 of 926 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (37 here).

SyneuRx International (Taiwan) Corp. 37 Humanscale Corporation 37 EPICMEMS(XIAMEN) Co., Ltd. 37 Case-mate, Inc. 37

Diamet's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

37 Top 44% higher than 56% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Diamet Corporation patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	2	5.4%
2016	2	5.4%
2017	5	13.5%
2018	2	5.4%
2019	1	2.7%
2020	11	29.7%
2021	3	8.1%
2022	5	13.5%
2023	2	5.4%
2024	2	5.4%
2025partial year	2	5.4%

Which technologies does Diamet Corporation patent most?

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 30

F16C - SHAFTS; Flexible SHAFTS; Elements OR Crankshaft MECHANISMS; Rotary Bodies Other Than Gearing ELEMENTS; Bearings 24

C22C - Alloys 20

B30B - Presses IN General 3

H01F - MAGNETS; INDUCTANCES; TRANSFORMERS; Selection OF Materials FOR Their Magnetic Properties 3

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 3

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 3

F16J - Pistons ; CYLINDERS; Sealings 2

Y10T - Technical Subjects Covered BY Former US Classification 2

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 2

F04C - Rotary-piston, OR Oscillating-piston, Positive-displacement Machines FOR Liquids ; Rotary-piston, OR Oscillating-piston, Positive-displacement Pumps 2

F05D - Indexing Scheme FOR Aspects Relating TO Non-positive-displacement Machines OR Engines, Gas-turbines OR Jet-propulsion Plants 1

F04D - Non-positive-displacement Pumps 1

H02K - Dynamo-electric Machines 1

C10M - Lubricating Compositions ; USE OF Chemical Substances Either Alone OR AS Lubricating Ingredients IN A Lubricating Composition 1

Top 15 of 20 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Diamet Corporation's patent record in context - here's where to go next.

Diamet Corporation's lead technology class is B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder), 81.1% of its portfolio - see every assignee active in that class. Explore B22F
Ranked #8,575 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Diamet Corporation against Daktronics, Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 37.4/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.