Where does Daishinku Corporation rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Daishinku Corporation ranks #5,753 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Daishinku Corporation hold?

Daishinku Corporation holds 59 US utility patents granted between 2015 and 2025, spanning 13 technology areas.

What is Daishinku Corporation's Innovation Score?

Daishinku Corporation has an Innovation Score of 42.8 out of 100 (top 30% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Daishinku Corporation focus on?

Daishinku Corporation's top technology area is H03H (Impedance Networks, e.g. Resonant CIRCUITS; Resonators) with 52 patents, ranking #21 of 636 assignees active in that subclass. Grants appear in 13 CPC subclasses total.

Is Daishinku Corporation's patent grant rate increasing or decreasing?

Daishinku Corporation's recent grant velocity is -7% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Daishinku Corporation's patents?

Daishinku Corporation's patents average 9.8 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Daishinku Corporation patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Daishinku Corporation

USPTO PatentsView assignee record - 59 granted patents across 13 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H03H (Impedance Networks, e.g. Resonant CIRCUITS; Resonators).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Daishinku ranks #5,753 of 49,997 tracked US assignees by granted-patent volume, with 59 patents across 13 technology areas.

#5,753
of 49,997 US assignees by volume: Top 30%
by Innovation Score (42.8/100): 9.8
avg claims per patent: -7%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R5753 · Foreign Corporation #5,753 · 59 grants

GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · VEL-FLAT · BOOK-FULL

GRANTS-SMALL 59 grants
UPPER-Q #5,753/49,997
PHOTO-FINISH Contitech Transportb…
CPC-FOCUS H03H · 13 areas
INNOV-PAR 42.8/100
CLAIMS-PAR 9.8 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-FLAT -7% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Contitech Transportbandsysteme GmBH (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Daishinku’s 42.8 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 14.1 pts (33%) Velocity 10.0 pts (23%) Breadth 12.7 pts (30%) Claim depth 5.9 pts (14%)

Qualcomm Incorporated · highest

85
Bandai Namco… · near

43
Cal-comp BIG Data · near

43
Daishinku · this assignee

43
Enzo Life Sciences · near

43
Pierburg · near

43
3D Lighting… · lowest

7

What this shows Daishinku's Innovation Score is 42.8/100 (top 30% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Daishinku?

Each dot is one of Daishinku’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Daishinku’s own 9.8 claims/patent is at or below the 19.3 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Daishinku vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Daishinku's grants concentrate

Daishinku Corporation is a focused PatentsView assignee: 13 CPC subclasses with 88.1% of grants classified under H03H (Impedance Networks, e.g. Resonant CIRCUITS; Resonators). Peak complete grant year is 2015 (9 grants) versus a trough of 3 in 2018. By volume, Daishinku sits between Contitech Transportbandsysteme GmBH and Eva Automation, Inc..

Daishinku's three-year grant acceleration

Daishinku Corporation shows 18 grants in 2022–2024 against only 12 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Contitech Transpo…

59
Cummins IP

59
Cummins-allison

59
D6

59
Donnelly

59
Electro Industrie…

59
Enterprise Holdin…

59
Eva Automation

59
Daishinku ◀

59

What this shows Daishinku holds 59 patents at rank #5,753, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Daishinku

By rank, the assignees closest to #5,753 in granted patent volume.

Leaders in H03H (Impedance Networks)

Other assignees with the most granted patents in Daishinku's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Daishinku, neither rank-band nor same-CPC leaders (those blocks stay above). In H03H (Impedance Networks), Daishinku ranks #21 of 636 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (43 here).

Enzo Life Sciences, Inc. 43 Cal-comp BIG Data, Inc. 43 Pierburg GMBH 43 Bandai Namco Entertainment Inc. 43

Similar claim depth

Nearest assignees by average claims per patent (9.8 here).

Em-tech Co., Ltd 9.8 avg Asahi Intecc Co., Ltd. 9.8 avg Samsung Heavy IND. Co., Ltd. 9.8 avg CLO Virtual Fashion Inc. 9.8 avg

Daishinku's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

43 Top 30% higher than 70% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Daishinku Corporation patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	9	15.3%
2016	5	8.5%
2017	7	11.9%
2018	3	5.1%
2019	4	6.8%
2020	4	6.8%
2021	4	6.8%
2022	8	13.6%
2023	5	8.5%
2024	5	8.5%
2025partial year	5	8.5%

Which technologies does Daishinku Corporation patent most?

H03H - Impedance Networks, e.g. Resonant CIRCUITS; Resonators 52

H01L - Semiconductor Devices NOT Covered BY Class H10 23

H10N - Electric Solid-state Devices NOT Otherwise Provided FOR 20

H03B - Generation OF Oscillations, Directly OR BY Frequency-changing, BY Circuits Employing Active Elements Which Operate IN A Non-switching MANNER; Generation OF Noise BY Such Circuits 16

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 4

Y10T - Technical Subjects Covered BY Former US Classification 3

B81B - Microstructural Devices OR Systems, e.g. Micromechanical Devices 2

H03L - Automatic Control, Starting, Synchronisation OR Stabilisation OF Generators OF Electronic Oscillations OR Pulses 2

H10F - Inorganic Semiconductor Devices Sensitive TO Infrared Radiation, Light, Electromagnetic Radiation OF Shorter Wavelength OR Corpuscular Radiation 1

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 1

B01D - Separation 1

A61C - DENTISTRY; Apparatus OR Methods FOR Oral OR Dental Hygiene 1

B06B - Methods OR Apparatus FOR Generating OR Transmitting Mechanical Vibrations OF Infrasonic, Sonic, OR Ultrasonic Frequency, ; e.g.; FOR Performing Mechanical Work IN General 1

Top 13 of 13 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Daishinku Corporation's patent record in context - here's where to go next.

Daishinku Corporation's lead technology class is H03H (Impedance Networks, e.g. Resonant CIRCUITS; Resonators), 88.1% of its portfolio - see every assignee active in that class. Explore H03H
Ranked #5,753 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Daishinku Corporation against Contitech Transportbandsysteme GmBH, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 42.8/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.