Where does Asia Pacific Microsystems, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Asia Pacific Microsystems, Inc. ranks #34,336 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Asia Pacific Microsystems, Inc. hold?

Asia Pacific Microsystems, Inc. holds 7 US utility patents granted between 2016 and 2025, spanning 7 technology areas.

What is Asia Pacific Microsystems, Inc.'s Innovation Score?

Asia Pacific Microsystems, Inc. has an Innovation Score of 26.6 out of 100 (21st percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Asia Pacific Microsystems, Inc. focus on?

Asia Pacific Microsystems, Inc.'s top technology area is B81B (Microstructural Devices OR Systems, e.g. Micromechanical Devices) with 4 patents, ranking #123 of 372 assignees active in that subclass. Grants appear in 7 CPC subclasses total.

Is Asia Pacific Microsystems, Inc.'s patent grant rate increasing or decreasing?

Asia Pacific Microsystems, Inc.'s recent grant velocity is -100% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Asia Pacific Microsystems, Inc.'s patents?

Asia Pacific Microsystems, Inc.'s patents average 16.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Asia Pacific Microsystems, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Asia Pacific Microsystems, Inc.

USPTO PatentsView assignee record - 7 granted patents across 7 technology areas, recorded in grant years 2016–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B81B (Microstructural Devices OR Systems, e.g. Micromechanical Devices).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Asia ranks #34,336 of 49,997 tracked US assignees by granted-patent volume, with 7 patents across 7 technology areas.

#34,336
of 49,997 US assignees by volume: 21st percentile
by Innovation Score (26.6/100): 16.7
avg claims per patent: -100%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R34336 · Foreign Corporation #34,336 · 7 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-RICH · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 7 grants
MID-PACK #34,336/49,997
PHOTO-FINISH Artificial Cell
CPC-NARROW B81B · 7 areas
INNOV-THIN 26.6/100
CLAIMS-RICH 16.7 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -100% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Artificial Cell Technologies, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Asia’s 26.6 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 7.2 pts (27%) Velocity 0.0 pts (0%) Breadth 9.4 pts (35%) Claim depth 10.0 pts (38%)

Qualcomm Incorporated · highest

85
Asia Pacific… · this assignee

27
3D Lighting… · lowest

7

What this shows Asia's Innovation Score is 26.6/100 (21st percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Asia?

Each dot is one of Asia’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Asia’s own 16.7 claims/patent is ABOVE the 14.7 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Asia vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Asia's grants concentrate

Asia Pacific Microsystems, Inc. is a focused PatentsView assignee: 7 CPC subclasses with 57.1% of grants classified under B81B (Microstructural Devices OR Systems, e.g. Micromechanical Devices). Peak complete grant year is 2016 (3 grants) versus a trough of 1 in 2018. By volume, Asia sits between Artificial Cell Technologies, Inc. and Asociados DON Mario S.A..

Artificial Cell

7
ASC Profiles

7
ASD

7
Asda Stores

7
ASM

7
Asmpt SMT Singapo…

7
AsociaciÓN Centro…

7
Asociados DON Mar…

7
Asia Pacific Micr… ◀

7

What this shows Asia holds 7 patents at rank #34,203, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Asia

By rank, the assignees closest to #34,203 in granted patent volume.

Leaders in B81B (Microstructural Devices OR Systems)

Other assignees with the most granted patents in Asia's primary technology class.

Asia's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

27 21st percentile higher than 21% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2016–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2016–2019 baseline. Full figures in the table below.

View data table

Asia Pacific Microsystems, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2016	3	42.9%
2017	2	28.6%
2018	1	14.3%
2025partial year	1	14.3%

Which technologies does Asia Pacific Microsystems, Inc. patent most?

B81B - Microstructural Devices OR Systems, e.g. Micromechanical Devices 4

B81C - Processes OR Apparatus Specially Adapted FOR THE Manufacture OR Treatment OF Microstructural Devices OR Systems 3

G01L - Measuring Force, Stress, Torque, Work, Mechanical Power, Mechanical Efficiency, OR Fluid Pressure 2

H01L - Semiconductor Devices NOT Covered BY Class H10 1

B06B - Methods OR Apparatus FOR Generating OR Transmitting Mechanical Vibrations OF Infrasonic, Sonic, OR Ultrasonic Frequency, ; e.g.; FOR Performing Mechanical Work IN General 1

G02B - Optical Elements, Systems OR Apparatus 1

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 1

Top 7 of 7 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Asia Pacific Microsystems, Inc.'s patent record in context - here's where to go next.

Asia Pacific Microsystems, Inc.'s lead technology class is B81B (Microstructural Devices OR Systems, e.g. Micromechanical Devices), 57.1% of its portfolio - see every assignee active in that class. Explore B81B
Ranked #34,336 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Asia Pacific Microsystems, Inc. against Artificial Cell Technologies, Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 26.6/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.