Where does Architectural busSTRUT Corporation rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Architectural busSTRUT Corporation ranks #44,807 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Architectural busSTRUT Corporation hold?

Architectural busSTRUT Corporation holds 5 US utility patents granted between 2019 and 2022, spanning 3 technology areas.

What is Architectural busSTRUT Corporation's Innovation Score?

Architectural busSTRUT Corporation has an Innovation Score of 28.3 out of 100 (27th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Architectural busSTRUT Corporation's patent grant rate increasing or decreasing?

Architectural busSTRUT Corporation's recent grant velocity is +50% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Architectural busSTRUT Corporation's patents?

Architectural busSTRUT Corporation's patents average 19.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Architectural busSTRUT Corporation patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Architectural busSTRUT Corporation

Q: What technology areas does Architectural busSTRUT Corporation focus on?

Architectural busSTRUT Corporation's top technology area is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors) with 5 patents. Grants appear in 3 CPC subclasses total.

USPTO PatentsView assignee record - 5 granted patents across 3 technology areas, recorded in grant years 2019–2022. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Architectural ranks #44,807 of 49,997 tracked US assignees by granted-patent volume, with 5 patents across 3 technology areas.

#44,807
of 49,997 US assignees by volume: 27th percentile
by Innovation Score (28.3/100): 19.2
avg claims per patent: +50%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R44807 · US Corporation #44,807 · 5 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-RICH · TYPE-USCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 5 grants
LOWER-Q #44,807/49,997
PHOTO-FINISH Archer Manufacturing
CPC-NARROW H01R · 3 areas
INNOV-THIN 28.3/100
CLAIMS-RICH 19.2 claims/avg
TYPE-USCORP US Corporation
VEL-SURGE +50% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Archer Manufacturing, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Architectural busSTRUT · this assignee

28
3D Lighting… · lowest

7

What this shows Architectural's Innovation Score is 28.3/100 (27th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Architectural's grants concentrate

Architectural busSTRUT Corporation is a focused PatentsView assignee: 3 CPC subclasses with 100% of grants classified under H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors). Peak complete grant year is 2019 (2 grants) versus a trough of 1 in 2020. By volume, Architectural sits between Archer Manufacturing, Inc. and Arcus Technology, Inc..

Architectural's three-year grant acceleration

Architectural busSTRUT Corporation shows 2 grants in 2022–2024 against only 3 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Archer Manufactur…

5
Archi Enterprises

5
Archimedes Contro…

5
Architectural Mai…

5
Arcom Digital Pat…

5
Arctop

5
Arcus Holding A/S

5
Arcus Technology

5
Architectural bus… ◀

5

What this shows Architectural holds 5 patents at rank #44,922, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Architectural

By rank, the assignees closest to #44,922 in granted patent volume.

Leaders in H01R (Electrically-conductive Connections)

Other assignees with the most granted patents in Architectural's primary technology class.

Architectural's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

28 27th percentile higher than 27% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2019–2022

Grants by year

Teal-shaded recent years (2020–present) versus the 2019–2019 baseline. Full figures in the table below.

View data table

Architectural busSTRUT Corporation patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2019	2	40.0%
2020	1	20.0%
2022	2	40.0%

Which technologies does Architectural busSTRUT Corporation patent most?

H01R - Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors 5

H02G - Installation OF Electric Cables OR Lines, OR OF Combined Optical AND Electric Cables OR Lines 3

H04B - Transmission 1

Top 3 of 3 technology areas

Where it ranks

Overall rank by patents

#44,807

of 49,997 tracked assignees

Innovation Score

28.3 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Architectural busSTRUT Corporation's patent record in context - here's where to go next.

Architectural busSTRUT Corporation's lead technology class is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors), 100% of its portfolio - see every assignee active in that class. Explore H01R
Ranked #44,807 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Architectural busSTRUT Corporation against Archer Manufacturing, Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 28.3/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.