Where does 3D-Micromac AG rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), 3D-Micromac AG ranks #30,704 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does 3D-Micromac AG hold?

3D-Micromac AG holds 8 US utility patents granted between 2018 and 2024, spanning 12 technology areas.

What is 3D-Micromac AG's Innovation Score?

3D-Micromac AG has an Innovation Score of 37.0 out of 100 (top 45% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is 3D-Micromac AG's patent grant rate increasing or decreasing?

3D-Micromac AG's recent grant velocity is +200% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for 3D-Micromac AG's patents?

3D-Micromac AG's patents average 13.9 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the 3D-Micromac AG patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

3D-Micromac AG

Q: What technology areas does 3D-Micromac AG focus on?

3D-Micromac AG's top technology area is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam) with 3 patents. Grants appear in 12 CPC subclasses total.

USPTO PatentsView assignee record - 8 granted patents across 12 technology areas, recorded in grant years 2018–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, 3d-micromac ranks #30,704 of 49,997 tracked US assignees by granted-patent volume, with 8 patents across 12 technology areas.

#30,704
of 49,997 US assignees by volume: Top 45%
by Innovation Score (37.0/100): 13.9
avg claims per patent: +200%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R30704 · Foreign Corporation #30,704 · 8 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-RICH · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 8 grants
MID-PACK #30,704/49,997
PHOTO-FINISH 152310 Canada
CPC-FOCUS B23K · 12 areas
INNOV-THIN 37.0/100
CLAIMS-RICH 13.9 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +200% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: 152310 Canada (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
3D-Micromac · this assignee

37
3D Lighting… · lowest

7

What this shows 3d-micromac's Innovation Score is 37.0/100 (top 45% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where 3d-micromac's grants concentrate

3D-Micromac AG is a focused PatentsView assignee: 12 CPC subclasses with 37.5% of grants classified under B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam). Peak complete grant year is 2020 (2 grants) versus a trough of 1 in 2018. By volume, 3d-micromac sits between 152310 Canada and 5D Robotics, Inc..

3d-micromac's three-year grant acceleration

3D-Micromac AG shows 4 grants in 2022–2024 against only 3 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

152310 Canada

8
21

8
2109971 Ontario

8
360 Knee Systems…

8
3nine AB

8
454 Life Sciences

8
4topps

8
5D Robotics

8
3d-micromac ◀

8

What this shows 3D-Micromac holds 8 patents at rank #30,704, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near 3D-Micromac

By rank, the assignees closest to #30,704 in granted patent volume.

Leaders in B23K (Soldering OR Unsoldering)

Other assignees with the most granted patents in 3D-Micromac's primary technology class.

3d-micromac's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

37 Top 45% higher than 55% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2018–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2018–2019 baseline. Full figures in the table below.

View data table

3D-Micromac AG patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2018	1	12.5%
2019	1	12.5%
2020	2	25.0%
2022	1	12.5%
2023	2	25.0%
2024	1	12.5%

Which technologies does 3D-Micromac AG patent most?

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 3

H01L - Semiconductor Devices NOT Covered BY Class H10 3

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 3

C03B - Manufacture, Shaping, OR Supplementary Processes 2

H10H - Inorganic Light-emitting Semiconductor Devices Having Potential Barriers 2

G06K - Graphical Data Reading ; Presentation OF DATA; Record CARRIERS; Handling Record Carriers 2

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 2

B28D - Working Stone OR Stone-like Materials 1

Y10T - Technical Subjects Covered BY Former US Classification 1

H01Q - Antennas, i.e. Radio Aerials 1

G02B - Optical Elements, Systems OR Apparatus 1

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 1

Top 12 of 12 technology areas

Where it ranks

Overall rank by patents

#30,704

of 49,997 tracked assignees

Innovation Score

37.0 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

3D-Micromac AG's patent record in context - here's where to go next.

3D-Micromac AG's lead technology class is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam), 37.5% of its portfolio - see every assignee active in that class. Explore B23K
Ranked #30,704 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare 3D-Micromac AG against 152310 Canada, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 37.0/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.