Where does WirthCo Engineering, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), WirthCo Engineering, Inc. ranks #33,907 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does WirthCo Engineering, Inc. hold?

WirthCo Engineering, Inc. holds 8 US utility patents granted between 2015 and 2023, spanning 2 technology areas.

What is WirthCo Engineering, Inc.'s Innovation Score?

WirthCo Engineering, Inc. has an Innovation Score of 27.9 out of 100 (25th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is WirthCo Engineering, Inc.'s patent grant rate increasing or decreasing?

WirthCo Engineering, Inc.'s recent grant velocity is -67% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for WirthCo Engineering, Inc.'s patents?

WirthCo Engineering, Inc.'s patents average 3.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the WirthCo Engineering, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

WirthCo Engineering, Inc.

Q: What technology areas does WirthCo Engineering, Inc. focus on?

WirthCo Engineering, Inc.'s top technology area is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors) with 1 patents, ranking #1,397 of 2,265 assignees active in that subclass. Grants appear in 2 CPC subclasses total.

USPTO PatentsView assignee record - 8 granted patents across 2 technology areas, recorded in grant years 2015–2023. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Wirthco ranks #33,907 of 49,997 tracked US assignees by granted-patent volume, with 8 patents across 2 technology areas.

#33,907
of 49,997 US assignees by volume: 25th percentile
by Innovation Score (27.9/100): 3.3
avg claims per patent: -67%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R33907 · US Corporation #33,907 · 8 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-SPARSE · TYPE-USCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 8 grants
MID-PACK #33,907/49,997
PHOTO-FINISH William Reber
CPC-NARROW H01R · 2 areas
INNOV-THIN 27.9/100
CLAIMS-SPARSE 3.3 claims/avg
TYPE-USCORP US Corporation
VEL-DROP -67% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: William Reber, LLC (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Wirthco’s 27.9 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 7.6 pts (27%) Velocity 13.3 pts (48%) Breadth 5.0 pts (18%) Claim depth 2.0 pts (7%)

Qualcomm Incorporated · highest

85
WirthCo Engineering · this assignee

28
3D Lighting… · lowest

7

What this shows Wirthco's Innovation Score is 27.9/100 (25th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Wirthco?

Each dot is one of Wirthco’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Wirthco’s own 3.3 claims/patent is at or below the 13.6 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Wirthco vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Wirthco's grants concentrate

WirthCo Engineering, Inc. is a focused PatentsView assignee: 2 CPC subclasses with 12.5% of grants classified under H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors). Peak complete grant year is 2015 (6 grants) versus a trough of 1 in 2022. By volume, Wirthco sits between William Reber, LLC and Woodward HRT, Inc..

Wirthco's three-year grant acceleration

WirthCo Engineering, Inc. shows 2 grants in 2022–2024 against only 0 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

William Reber

8
Winchester Interc…

8
Wind Harvest Intl

8
Wirtgen America

8
Wisetech Global

8
Wolter

8
Wood Stone

8
Woodward HRT

8
Wirthco Engineeri… ◀

8

What this shows WirthCo holds 8 patents at rank #33,897, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near WirthCo

By rank, the assignees closest to #33,897 in granted patent volume.

Leaders in H01R (Electrically-conductive Connections)

Other assignees with the most granted patents in WirthCo's primary technology class.

Wirthco's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

28 25th percentile higher than 25% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2023

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

WirthCo Engineering, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	6	75.0%
2022	1	12.5%
2023	1	12.5%

Which technologies does WirthCo Engineering, Inc. patent most?

H01R - Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors 1

B60D - Vehicle Connections 1

Top 2 of 2 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

WirthCo Engineering, Inc.'s patent record in context - here's where to go next.

WirthCo Engineering, Inc.'s lead technology class is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors), 12.5% of its portfolio - see every assignee active in that class. Explore H01R
Ranked #33,907 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare WirthCo Engineering, Inc. against William Reber, LLC, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 27.9/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.