Where does Viasystems Technologies Corp. L.L.C. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Viasystems Technologies Corp. L.L.C. ranks #43,941 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Viasystems Technologies Corp. L.L.C. hold?

Viasystems Technologies Corp. L.L.C. holds 6 US utility patents granted between 2015 and 2018, spanning 5 technology areas.

What is Viasystems Technologies Corp. L.L.C.'s Innovation Score?

Viasystems Technologies Corp. L.L.C. has an Innovation Score of 21.1 out of 100 (8th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Viasystems Technologies Corp. L.L.C.'s patent grant rate increasing or decreasing?

Viasystems Technologies Corp. L.L.C.'s recent grant velocity is -100% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Viasystems Technologies Corp. L.L.C.'s patents?

Viasystems Technologies Corp. L.L.C.'s patents average 10.8 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Viasystems Technologies Corp. L.L.C. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Viasystems Technologies Corp. L.L.C.

Q: What technology areas does Viasystems Technologies Corp. L.L.C. focus on?

Viasystems Technologies Corp. L.L.C.'s top technology area is H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components) with 6 patents. Grants appear in 5 CPC subclasses total.

USPTO PatentsView assignee record - 6 granted patents across 5 technology areas, recorded in grant years 2015–2018. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Viasystems ranks #43,941 of 49,997 tracked US assignees by granted-patent volume, with 6 patents across 5 technology areas.

#43,941
of 49,997 US assignees by volume: 8th percentile
by Innovation Score (21.1/100): 10.8
avg claims per patent: -100%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R43941 · US Corporation #43,941 · 6 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-PAR · TYPE-USCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 6 grants
LOWER-Q #43,941/49,997
PHOTO-FINISH Vesalius Cardiovascu…
CPC-NARROW H05K · 5 areas
INNOV-THIN 21.1/100
CLAIMS-PAR 10.8 claims/avg
TYPE-USCORP US Corporation
VEL-DROP -100% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Vesalius Cardiovascular Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Viasystems L L C · this assignee

21
3D Lighting… · lowest

7

What this shows Viasystems's Innovation Score is 21.1/100 (8th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Viasystems's grants concentrate

Viasystems Technologies Corp. L.L.C. is a focused PatentsView assignee: 5 CPC subclasses with 100% of grants classified under H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components). Peak complete grant year is 2015 (3 grants) versus a trough of 1 in 2016. By volume, Viasystems sits between Vesalius Cardiovascular Inc. and Videndum Media Solutions S.P.A.

Vesalius Cardiova…

6
VeterinÄRmedizini…

6
Vexilar

6
VGX Pharmaceutica…

6
Vibracoustic Fors…

6
Viconic Defense

6
Victorinox

6
Videndum Media So…

6
Viasystems L L C ◀

6

What this shows Viasystems holds 6 patents at rank #43,879, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Viasystems

By rank, the assignees closest to #43,879 in granted patent volume.

Leaders in H05K (Printed Circuits)

Other assignees with the most granted patents in Viasystems's primary technology class.

Viasystems's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

21 8th percentile higher than 8% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2018

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Viasystems Technologies Corp. L.L.C. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	3	50.0%
2016	1	16.7%
2017	1	16.7%
2018	1	16.7%

Which technologies does Viasystems Technologies Corp. L.L.C. patent most?

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 6

Y10T - Technical Subjects Covered BY Former US Classification 3

C25D - Processes FOR THE Electrolytic OR Electrophoretic Production OF COATINGS; ELECTROFORMING; Apparatus Therefor 1

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 1

H05B - Electric HEATING; Electric Light Sources NOT Otherwise Provided FOR; Circuit Arrangements FOR Electric Light Sources, IN General 1

Top 5 of 5 technology areas

Where it ranks

Overall rank by patents

#43,941

of 49,997 tracked assignees

Innovation Score

21.1 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Viasystems Technologies Corp. L.L.C.'s patent record in context - here's where to go next.

Viasystems Technologies Corp. L.L.C.'s lead technology class is H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components), 100% of its portfolio - see every assignee active in that class. Explore H05K
Ranked #43,941 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Viasystems Technologies Corp. L.L.C. against Vesalius Cardiovascular Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 21.1/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.