Where does VIA Mechanics, Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), VIA Mechanics, Ltd. ranks #22,001 of 50,000 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does VIA Mechanics, Ltd. hold?

VIA Mechanics, Ltd. holds 13 US utility patents granted between 2015 and 2024, spanning 12 technology areas.

What is VIA Mechanics, Ltd.'s Innovation Score?

VIA Mechanics, Ltd. has an Innovation Score of 37.3 out of 100 (top 44% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is VIA Mechanics, Ltd.'s patent grant rate increasing or decreasing?

VIA Mechanics, Ltd.'s recent grant velocity is -56% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for VIA Mechanics, Ltd.'s patents?

VIA Mechanics, Ltd.'s patents average 4.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the VIA Mechanics, Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

VIA Mechanics, Ltd.

Q: What technology areas does VIA Mechanics, Ltd. focus on?

VIA Mechanics, Ltd.'s top technology area is B23K (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM) with 8 patents. Grants appear in 12 CPC subclasses total.

USPTO PatentsView assignee record - 13 granted patents across 12 technology areas, recorded in grant years 2015–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B23K (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM).

Compiled by PlainPatent · May 15, 2026

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, VIA ranks #22,001 of 50,000 tracked US assignees by granted-patent volume, with 13 patents across 12 technology areas.

#22,001
of 50,000 US assignees by volume: Top 44%
by Innovation Score (37.3/100): 4.3
avg claims per patent: -56%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R22001 · Foreign Corporation #22,001 · 13 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 13 grants
MID-PACK #22,001/50,000
PHOTO-FINISH VCG Holdings
CPC-FOCUS B23K · 12 areas
INNOV-THIN 37.3/100
CLAIMS-SPARSE 4.3 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -56% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: VCG Holdings Ltd. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
VIA Mechanics · this assignee

37
3D Lighting Innovati… · lowest

7

What this shows VIA's Innovation Score is 37.3/100 (top 44% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where VIA's grants concentrate

VIA Mechanics, Ltd. is a focused PatentsView assignee: 12 CPC subclasses with 61.5% of grants classified under B23K (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM). Peak complete grant year is 2015 (3 grants) versus a trough of 1 in 2016. By volume, VIA sits between VCG Holdings Ltd. and VON Ardenne Gmbh.

VCG Holdings

13
Ventra Group

13
Verbio Vereinigte…

13
Vermes Microdispe…

13
Vicis

13
Virtual Marketing

13
Voltafield Techno…

13
VON Ardenne

13
VIA Mechanics ◀

13

What this shows VIA holds 13 patents at rank #21,989, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near VIA

By rank, the assignees closest to #21,989 in granted patent volume.

Leaders in B23K (Soldering OR Unsoldering)

Other assignees with the most granted patents in VIA's primary technology class.

VIA's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

37 Top 44% higher than 56% of 50,000 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

VIA Mechanics, Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	3	23.1%
2016	1	7.7%
2017	1	7.7%
2018	2	15.4%
2019	2	15.4%
2022	1	7.7%
2023	1	7.7%
2024	2	15.4%

Which technologies does VIA Mechanics, Ltd. patent most?

B23K - SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 8

H05K - PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4

G02B - OPTICAL ELEMENTS, SYSTEMS OR APPARATUS 3

H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL 3

C03C - CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS 2

G02F - OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS 2

H02K - DYNAMO-ELECTRIC MACHINES 2

B25H - WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS 1

C03B - MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES 1

G06Q - INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR 1

H03B - GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS 1

Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION 1

Top 12 of 12 technology areas

Where it ranks

Overall rank by patents

#22,001

of 50,000 tracked assignees

Innovation Score

37.3 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.