Where does Telink Semiconductor (SHANGHAI) Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Telink Semiconductor (SHANGHAI) Co., Ltd. ranks #21,879 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Telink Semiconductor (SHANGHAI) Co., Ltd. hold?

Telink Semiconductor (SHANGHAI) Co., Ltd. holds 13 US utility patents granted between 2017 and 2025, spanning 15 technology areas.

What is Telink Semiconductor (SHANGHAI) Co., Ltd.'s Innovation Score?

Telink Semiconductor (SHANGHAI) Co., Ltd. has an Innovation Score of 40.0 out of 100 (top 37% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Telink Semiconductor (SHANGHAI) Co., Ltd. focus on?

Telink Semiconductor (SHANGHAI) Co., Ltd.'s top technology area is H04W (Wireless Communication Networks) with 9 patents, ranking #1,453 of 5,904 assignees active in that subclass. Grants appear in 15 CPC subclasses total.

Is Telink Semiconductor (SHANGHAI) Co., Ltd.'s patent grant rate increasing or decreasing?

Telink Semiconductor (SHANGHAI) Co., Ltd.'s recent grant velocity is +40% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Telink Semiconductor (SHANGHAI) Co., Ltd.'s patents?

Telink Semiconductor (SHANGHAI) Co., Ltd.'s patents average 10.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Telink Semiconductor (SHANGHAI) Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Telink Semiconductor (SHANGHAI) Co., Ltd.

USPTO PatentsView assignee record - 13 granted patents across 15 technology areas, recorded in grant years 2017–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H04W (Wireless Communication Networks).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Telink ranks #21,879 of 49,997 tracked US assignees by granted-patent volume, with 13 patents across 15 technology areas.

#21,879
of 49,997 US assignees by volume: Top 37%
by Innovation Score (40.0/100): 10.2
avg claims per patent: +40%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R21879 · Foreign Corporation #21,879 · 13 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · VEL-UP · BOOK-FULL

GRANTS-MICRO 13 grants
MID-PACK #21,879/49,997
PHOTO-FINISH Taylor-listug
CPC-FOCUS H04W · 15 areas
INNOV-PAR 40.0/100
CLAIMS-PAR 10.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-UP +40% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Taylor-listug, Inc (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Telink’s 40.0 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 9.1 pts (23%) Velocity 11.1 pts (28%) Breadth 13.7 pts (34%) Claim depth 6.1 pts (15%)

Qualcomm Incorporated · highest

85
Doheny EYE Institute · near

40
Intellectual… · near

40
Loyola University… · near

40
Medallia · near

40
Telink Semiconductor… · this assignee

40
3D Lighting… · lowest

7

What this shows Telink's Innovation Score is 40.0/100 (top 37% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Telink?

Each dot is one of Telink’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Telink’s own 10.2 claims/patent is at or below the 13.8 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Telink vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Telink's grants concentrate

Telink Semiconductor (SHANGHAI) Co., Ltd. is a focused PatentsView assignee: 15 CPC subclasses with 69.2% of grants classified under H04W (Wireless Communication Networks). Peak complete grant year is 2018 (3 grants) versus a trough of 1 in 2017. By volume, Telink sits between Taylor-listug, Inc and TES Co., Ltd.

Telink's three-year grant acceleration

Telink Semiconductor (SHANGHAI) Co., Ltd. shows 5 grants in 2022–2024 against only 3 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Taylor-listug

13
TD IP Holdco

13
Avancees ET Membr…

13
Tecnomatic S P A

13
Tentsile

13
Terralithium

13
Terranet AB

13
TES

13
Telink Semiconduc… ◀

13

What this shows Telink holds 13 patents at rank #21,872, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Telink

By rank, the assignees closest to #21,872 in granted patent volume.

Leaders in H04W (Wireless Communication Networks)

Other assignees with the most granted patents in Telink's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for Telink, neither rank-band nor same-CPC leaders (those blocks stay above). In H04W (Wireless Communication Networks), Telink ranks #1,453 of 5,904 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (40 here).

Loyola University of Chicago 40 Intellectual Property Innovation Corporation 40 Medallia, Inc. 40 Doheny EYE Institute 40

Telink's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

40 Top 37% higher than 63% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2017–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2017–2019 baseline. Full figures in the table below.

View data table

Telink Semiconductor (SHANGHAI) Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2017	1	7.7%
2018	3	23.1%
2019	1	7.7%
2020	2	15.4%
2022	3	23.1%
2024	2	15.4%
2025partial year	1	7.7%

Which technologies does Telink Semiconductor (SHANGHAI) Co., Ltd. patent most?

H04W - Wireless Communication Networks 9

H04L - Transmission OF Digital Information, e.g. Telegraphic Communication 8

H04R - Loudspeakers, Microphones, Gramophone Pick-ups OR Like Acoustic Electromechanical TRANSDUCERS; Deaf-aid SETS; Public Address Systems 4

G06F - Electric Digital Data Processing 3

G16Y - Information AND Communication Technology Specially Adapted FOR THE Internet OF Things [IoT] 2

H04M - Telephonic Communication 2

H04B - Transmission 2

G10K - Sound-producing DEVICES; Methods OR Devices FOR Protecting Against, OR FOR Damping, Noise OR Other Acoustic Waves IN GENERAL; Acoustics NOT Otherwise Provided FOR 2

G10L - Speech Analysis Techniques OR Speech SYNTHESIS; Speech RECOGNITION; Speech OR Voice Processing TECHNIQUES; Speech OR Audio Coding OR Decoding 2

H04J - Multiplex Communication 1

G01C - Measuring Distances, Levels OR BEARINGS; SURVEYING; NAVIGATION; Gyroscopic INSTRUMENTS; Photogrammetry OR Videogrammetry 1

H03D - Demodulation OR Transference OF Modulation From ONE Carrier TO Another 1

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 1

Y02D - Climate Change Mitigation Technologies IN Information AND Communication Technologies [ICT], I.E. Information AND Communication Technologies Aiming AT THE Reduction OF Their OWN Energy USE 1

H03F - Amplifiers 1

Top 15 of 15 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Telink Semiconductor (SHANGHAI) Co., Ltd.'s patent record in context - here's where to go next.

Telink Semiconductor (SHANGHAI) Co., Ltd.'s lead technology class is H04W (Wireless Communication Networks), 69.2% of its portfolio - see every assignee active in that class. Explore H04W
Ranked #21,879 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Telink Semiconductor (SHANGHAI) Co., Ltd. against Taylor-listug, Inc, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 40.0/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.