TE Connectivity Japan G.K.
USPTO PatentsView assignee record - 9 granted patents across 1 technology areas, recorded in grant years 2025–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors).
The verdict
According to USPTO PatentsView, TE ranks #30,333 of 49,997 tracked US assignees by granted-patent volume, with 9 patents across 1 technology areas.
- #30,333
- of 49,997 US assignees by volume
- 6th percentile
- by Innovation Score (19.2/100)
- 12.8
- avg claims per patent
USPTO PatentsView assignee plate
Corpus R30333 · Foreign Corporation #30,333 · 9 grants
GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-LOW · CLAIMS-RICH · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH
- GRANTS-MICRO 9 grants
- MID-PACK #30,333/49,997
- PHOTO-FINISH Tchibo
- CPC-NARROW H01R · 1 areas
- INNOV-LOW 19.2/100
- CLAIMS-RICH 12.8 claims/avg
- TYPE-FRNCORP Foreign Corp
- SPAN-YRS 2025–2025 · 1y
- BOOK-RICH 9/10 fields
Nearest grant-volume peer: Tchibo GMBH (±0 grants)
Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.
How TE’s 19.2 Innovation Score adds up
The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.
Innovation-score neighbourhood around TE
Lowest and highest poles plus nearest Innovation Score peers, not a full corpus board reprint.
- Qualcomm Incorporated · highest
Qualcomm Incorporated · highest
85 score
- TE Connectivity… · this assignee 19
TE Connectivity… · this assignee
19 score
- 3D Lighting… · lowest 7
3D Lighting… · lowest
7 score
What this shows TE's Innovation Score is 19.2/100 (6th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.
Does more volume mean deeper claims for TE?
Each dot is one of TE’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). TE’s own 12.8 claims/patent is at or below the 14.4 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.
Where TE's grants concentrate
TE Connectivity Japan G.K. is a focused PatentsView assignee: 1 CPC subclasses with 66.7% of grants classified under H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors). By volume, TE sits between Tchibo GMBH and Techno Dynamics, Inc..
Who files at TE's volume?
Granted US patents 2015–2025 versus its nearest-ranked assignees by volume, this company marked ◀
- Tchibo
Tchibo GMBH
9 patents
- TD Tools
TD Tools, Inc.
9 patents
- Tdk-lambda UK
TDK-Lambda UK Limited
9 patents
- TDW Gesellschaft…
TDW Gesellschaft für Verteidigungstechnische Wirksysteme mbH
9 patents
- Team Group
Team Group Inc.
9 patents
- Tecat (Suzhou)
Tecat Technologies (SUZHOU) Limited
9 patents
- Tech Energy Produ…
Tech Energy Products, L.L.C.
9 patents
- Techno Dynamics
Techno Dynamics, Inc.
9 patents
- TE Connectivity J… ◀
TE Connectivity Japan G.K.
9 patents
What this shows TE holds 9 patents at rank #30,297, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.
Companies ranked near TE
By rank, the assignees closest to #30,297 in granted patent volume.
- Tchibo GMBH #30,293 · 9 patents
- TD Tools, Inc. #30,294 · 9 patents
- TDK-Lambda UK Limited #30,295 · 9 patents
- TDW Gesellschaft für Verteidigungstechnische Wirksysteme mbH #30,296 · 9 patents
- Team Group Inc. #30,298 · 9 patents
- Tecat Technologies (SUZHOU) Limited #30,299 · 9 patents
- Tech Energy Products, L.L.C. #30,300 · 9 patents
- Techno Dynamics, Inc. #30,301 · 9 patents
Leaders in H01R (Electrically-conductive Connections)
Other assignees with the most granted patents in TE's primary technology class.
- Sumitomo Wiring Systems, Ltd. 1,543 in class
- Yazaki Corporation 1,482 in class
- Foxconn Interconnect Technology Limited 847 in class
- Sumitomo Electric Industries, Ltd. 729 in class
- Autonetworks Technologies, Ltd. 694 in class
- Molex, LLC 599 in class
- Japan Aviation Electronics Industry, Limited 523 in class
- TE Connectivity Co. Ltd. 459 in class
TE's Innovation Score vs. every tracked assignee
Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)
19 6th percentile higher than 6% of 49,997 US assignees
Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.
Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025
Grants by year
Teal-shaded recent years (2020–present) versus the 2025–2019 baseline. Full figures in the table below.
View data table
| Year | Patents Granted | Share of Period |
|---|---|---|
| 2025partial year | 9 | 100.0% |
Which technologies does TE Connectivity Japan G.K. patent most?
Top 1 of 1 technology areas
Data Source
USPTO PatentsView, US granted patents 2015–2025
What to do with this data
TE Connectivity Japan G.K.'s patent record in context - here's where to go next.
- TE Connectivity Japan G.K.'s lead technology class is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors), 66.7% of its portfolio - see every assignee active in that class. Explore H01R
- Ranked #30,333 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
- Compare TE Connectivity Japan G.K. against Tchibo GMBH, an assignee filing at a similar volume. Compare portfolios
- Innovation Score of 19.2/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated
Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.
Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.