Where does Tang Yang Dies Co. Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Tang Yang Dies Co. Ltd. ranks #43,500 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Tang Yang Dies Co. Ltd. hold?

Tang Yang Dies Co. Ltd. holds 6 US utility patents granted between 2017 and 2021, spanning 2 technology areas.

What is Tang Yang Dies Co. Ltd.'s Innovation Score?

Tang Yang Dies Co. Ltd. has an Innovation Score of 12.9 out of 100 (2nd percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Tang Yang Dies Co. Ltd.'s patent grant rate increasing or decreasing?

Tang Yang Dies Co. Ltd.'s recent grant velocity is -80% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Tang Yang Dies Co. Ltd.'s patents?

Tang Yang Dies Co. Ltd.'s patents average 2.0 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Tang Yang Dies Co. Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Tang Yang Dies Co. Ltd.

Q: What technology areas does Tang Yang Dies Co. Ltd. focus on?

Tang Yang Dies Co. Ltd.'s top technology area is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors) with 1 patents, ranking #1,397 of 2,265 assignees active in that subclass. Grants appear in 2 CPC subclasses total.

USPTO PatentsView assignee record - 6 granted patents across 2 technology areas, recorded in grant years 2017–2021. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Tang ranks #43,500 of 49,997 tracked US assignees by granted-patent volume, with 6 patents across 2 technology areas.

#43,500
of 49,997 US assignees by volume: 2nd percentile
by Innovation Score (12.9/100): 2.0
avg claims per patent: -80%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R43500 · Foreign Corporation #43,500 · 6 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-NARROW · INNOV-LOW · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 6 grants
LOWER-Q #43,500/49,997
PHOTO-FINISH Taleris Global LLP
CPC-NARROW H01R · 2 areas
INNOV-LOW 12.9/100
CLAIMS-SPARSE 2.0 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DROP -80% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Taleris Global LLP (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Tang’s 12.9 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 6.7 pts (52%) Velocity 0.0 pts (0%) Breadth 5.0 pts (39%) Claim depth 1.2 pts (9%)

Qualcomm Incorporated · highest

85
Tang Yang Dies · this assignee

13
3D Lighting… · lowest

7

What this shows Tang's Innovation Score is 12.9/100 (2nd percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Tang?

Each dot is one of Tang’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Tang’s own 2.0 claims/patent is at or below the 17.2 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Tang vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Tang's grants concentrate

Tang Yang Dies Co. Ltd. is a focused PatentsView assignee: 2 CPC subclasses with 16.7% of grants classified under H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors). Peak complete grant year is 2018 (2 grants) versus a trough of 1 in 2017. By volume, Tang sits between Taleris Global LLP and Taniobis GMBH.

Taleris Global LLP

6
Taminco BV

6
Tampro

6
TAN DE Tech

6
Tangen Biosciences

6
Tangentix

6
Tangi0

6
Taniobis

6
Tang Yang Dies ◀

6

What this shows Tang holds 6 patents at rank #43,463, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Tang

By rank, the assignees closest to #43,463 in granted patent volume.

Leaders in H01R (Electrically-conductive Connections)

Other assignees with the most granted patents in Tang's primary technology class.

Tang's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

13 2nd percentile higher than 2% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2017–2021

Grants by year

Teal-shaded recent years (2020–present) versus the 2017–2019 baseline. Full figures in the table below.

View data table

Tang Yang Dies Co. Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2017	1	16.7%
2018	2	33.3%
2019	2	33.3%
2021	1	16.7%

Which technologies does Tang Yang Dies Co. Ltd. patent most?

H01R - Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors 1

B60N - Seats Specially Adapted FOR VEHICLES; Vehicle Passenger Accommodation NOT Otherwise Provided FOR 1

Top 2 of 2 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Tang Yang Dies Co. Ltd.'s patent record in context - here's where to go next.

Tang Yang Dies Co. Ltd.'s lead technology class is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors), 16.7% of its portfolio - see every assignee active in that class. Explore H01R
Ranked #43,500 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Tang Yang Dies Co. Ltd. against Taleris Global LLP, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 12.9/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.