Where does Seoul Laser Dieboard System Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Seoul Laser Dieboard System Co., Ltd. ranks #20,390 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Seoul Laser Dieboard System Co., Ltd. hold?

Seoul Laser Dieboard System Co., Ltd. holds 14 US utility patents granted between 2015 and 2024, spanning 17 technology areas.

What is Seoul Laser Dieboard System Co., Ltd.'s Innovation Score?

Seoul Laser Dieboard System Co., Ltd. has an Innovation Score of 33.6 out of 100 (45th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Seoul Laser Dieboard System Co., Ltd.'s patent grant rate increasing or decreasing?

Seoul Laser Dieboard System Co., Ltd.'s recent grant velocity is +0% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Seoul Laser Dieboard System Co., Ltd.'s patents?

Seoul Laser Dieboard System Co., Ltd.'s patents average 9.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Seoul Laser Dieboard System Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Seoul Laser Dieboard System Co., Ltd.

Q: What technology areas does Seoul Laser Dieboard System Co., Ltd. focus on?

Seoul Laser Dieboard System Co., Ltd.'s top technology area is B21D (Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal) with 11 patents, ranking #57 of 818 assignees active in that subclass. Grants appear in 17 CPC subclasses total.

USPTO PatentsView assignee record - 14 granted patents across 17 technology areas, recorded in grant years 2015–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B21D (Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Seoul ranks #20,390 of 49,997 tracked US assignees by granted-patent volume, with 14 patents across 17 technology areas.

#20,390
of 49,997 US assignees by volume: 45th percentile
by Innovation Score (33.6/100): 9.7
avg claims per patent: +0%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R20390 · Foreign Corporation #20,390 · 14 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-PAR · TYPE-FRNCORP · VEL-FLAT · BOOK-FULL

GRANTS-MICRO 14 grants
MID-PACK #20,390/49,997
PHOTO-FINISH Seko S p A
CPC-FOCUS B21D · 17 areas
INNOV-THIN 33.6/100
CLAIMS-PAR 9.7 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-FLAT +0% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Seko S.p.A. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Seoul’s 33.6 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 9.4 pts (28%) Velocity 3.8 pts (11%) Breadth 14.6 pts (43%) Claim depth 5.8 pts (17%)

Qualcomm Incorporated · highest

85
Seoul Laser… · this assignee

34
3D Lighting… · lowest

7

What this shows Seoul's Innovation Score is 33.6/100 (45th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Seoul?

Each dot is one of Seoul’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Seoul’s own 9.7 claims/patent is at or below the 13.1 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Seoul vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Seoul's grants concentrate

Seoul Laser Dieboard System Co., Ltd. is a focused PatentsView assignee: 17 CPC subclasses with 78.6% of grants classified under B21D (Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal). Peak complete grant year is 2019 (4 grants) versus a trough of 1 in 2015. By volume, Seoul sits between Seko S.p.A. and Shaanxi Normal University.

Seoul's three-year grant acceleration

Seoul Laser Dieboard System Co., Ltd. shows 4 grants in 2022–2024 against only 7 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Seko S p A

14
SEM AB

14
Sensile Medical

14
Sensus USA

14
Sernet (Suzhou)

14
Servicio Andaluz…

14
Sgrouples

14
Shaanxi Normal Un…

14
Seoul Laser Diebo… ◀

14

What this shows Seoul holds 14 patents at rank #20,363, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Seoul

By rank, the assignees closest to #20,363 in granted patent volume.

Leaders in B21D (Working OR Processing OF Sheet Metal OR Metal Tubes)

Other assignees with the most granted patents in Seoul's primary technology class.

Seoul's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

34 45th percentile higher than 45% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Seoul Laser Dieboard System Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	1	7.1%
2016	1	7.1%
2017	1	7.1%
2019	4	28.6%
2020	2	14.3%
2021	1	7.1%
2022	3	21.4%
2024	1	7.1%

Which technologies does Seoul Laser Dieboard System Co., Ltd. patent most?

B21D - Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal 11

G09F - DISPLAYING; ADVERTISING; SIGNS; Labels OR NAME-PLATES; Seals 8

Y10T - Technical Subjects Covered BY Former US Classification 7

B23D - PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; Like Operations FOR Working Metal BY Removing Material, NOT Otherwise Provided FOR 4

B26D - CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing 3

B31B - Making Containers OF Paper, Cardboard OR Material Worked IN A Manner Analogous TO Paper 3

B26F - PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; Severing BY Means Other Than Cutting 3

B23P - Metal-working NOT Otherwise Provided FOR; Combined OPERATIONS; Universal Machine Tools 3

B24B - Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents 1

B31F - Mechanical Working OR Deformation OF Paper, Cardboard OR Material Worked IN A Manner Analogous TO Paper 1

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 1

B23Q - Details, Components, OR Accessories FOR Machine Tools, e.g. Arrangements FOR Copying OR Controlling ; Machine Tools IN General Characterised BY THE Construction OF Particular Details OR COMPONENTS; Combinations OR Associations OF Metal-working Machines, NOT Directed TO A Particular Result 1

F16B - Devices FOR Fastening OR Securing Constructional Elements OR Machine Parts Together, e.g. Nails, Bolts, Circlips, Clamps, Clips OR WEDGES; Joints OR Jointing 1

B30B - Presses IN General 1

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 1

Top 15 of 17 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Seoul Laser Dieboard System Co., Ltd.'s patent record in context - here's where to go next.

Seoul Laser Dieboard System Co., Ltd.'s lead technology class is B21D (Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal), 78.6% of its portfolio - see every assignee active in that class. Explore B21D
Ranked #20,390 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Seoul Laser Dieboard System Co., Ltd. against Seko S.p.A., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 33.6/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.