Where does Seoul Laser Dieboard System Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Seoul Laser Dieboard System Co., Ltd. ranks #20,390 of 50,000 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Seoul Laser Dieboard System Co., Ltd. hold?

Seoul Laser Dieboard System Co., Ltd. holds 14 US utility patents granted between 2015 and 2024, spanning 17 technology areas.

What is Seoul Laser Dieboard System Co., Ltd.'s Innovation Score?

Seoul Laser Dieboard System Co., Ltd. has an Innovation Score of 33.6 out of 100 (top 55% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Seoul Laser Dieboard System Co., Ltd.'s patent grant rate increasing or decreasing?

Seoul Laser Dieboard System Co., Ltd.'s recent grant velocity is +0% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Seoul Laser Dieboard System Co., Ltd.'s patents?

Seoul Laser Dieboard System Co., Ltd.'s patents average 9.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Seoul Laser Dieboard System Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Seoul Laser Dieboard System Co., Ltd.

Q: What technology areas does Seoul Laser Dieboard System Co., Ltd. focus on?

Seoul Laser Dieboard System Co., Ltd.'s top technology area is B21D (WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL) with 11 patents. Grants appear in 17 CPC subclasses total.

USPTO PatentsView assignee record - 14 granted patents across 17 technology areas, recorded in grant years 2015–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B21D (WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL).

Compiled by PlainPatent · May 15, 2026

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Seoul ranks #20,390 of 50,000 tracked US assignees by granted-patent volume, with 14 patents across 17 technology areas.

#20,390
of 50,000 US assignees by volume: Top 55%
by Innovation Score (33.6/100): 9.7
avg claims per patent: +0%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R20390 · Foreign Corporation #20,390 · 14 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-PAR · TYPE-FRNCORP · VEL-FLAT · BOOK-FULL

GRANTS-MICRO 14 grants
MID-PACK #20,390/50,000
PHOTO-FINISH SEKO S p A
CPC-FOCUS B21D · 17 areas
INNOV-THIN 33.6/100
CLAIMS-PAR 9.7 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-FLAT +0% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: SEKO S.p.a. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Seoul Laser Dieboard… · this assignee

34
3D Lighting Innovati… · lowest

7

What this shows Seoul Laser Dieboard System Co., Ltd. stamps GRANTS-MICRO, MID-PACK, PHOTO-FINISH, CPC-FOCUS, INNOV-THIN, CLAIMS-PAR, TYPE-FRNCORP, VEL-FLAT, BOOK-FULL. Volume places it #20,390 of 50,000; Innovation Score 33.6/100 sits in the top 55% of the PatentsView-derived corpus. Closest grant-volume peer on this plate is SEKO S.p.a. (±0 grants).

Portfolio overview

Seoul Laser Dieboard System Co., Ltd. has been granted 14 US utility patents between 2015 and 2024, placing Seoul Laser Dieboard System Co., Ltd. at #20,390 of 50,000 across all assignees tracked by PlainPatent. This portfolio spans 17 distinct Cooperative Patent Classification (CPC) subclasses, averaging 9.7 claims per patent with primary concentration in B21D (WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL). As a Foreign Corporation, Seoul Laser Dieboard System Co., Ltd. is one of the more focused assignees in the PatentsView dataset. By volume, Seoul sits between SEKO S.p.a. (14 patents, rank #20,359) and Shaanxi Normal University (14 patents, rank #20,367) - the closest US assignees by grant volume. The composite Innovation Score of 33.6/100 blends portfolio volume, grant velocity, technology breadth, and claim depth into a single comparable measure drawn directly from USPTO PatentsView records.

Grant cadence records the difference between two grant-year windows. Between 2020 and 2024 the company received 7 grants, compared with 7 in the 2015–2019 window, a +0% shift in five-year grant velocity. Both windows cover five complete grant years; the latest PatentsView year is a partial release and is excluded from this comparison, though it still appears in the yearly table and chart below. Grant timing can lag the related application by years, so this comparison does not establish current R&D spending, strategic intent, or a company’s application activity. The Foreign Corporation classification provides context for the assignee record, not a conclusion about its business strategy.

Claim depth and technology breadth describe this aggregate record. Seoul Laser Dieboard System Co., Ltd.'s 9.7 average claims per patent is an average count, not a measure of claim scope, legal strength, enforceability, or design-around risk. The record spans 17 CPC subclasses. Combined with portfolio volume, these figures let readers compare the documented grant records of assignees in similar technology classes.

SEKO S p A

14
SEM AB

14
Sensile Medical

14
Sensus USA

14
Sernet (Suzhou)

14
Servicio Andaluz…

14
Sgrouples

14
Shaanxi Normal Un…

14
Seoul Laser Diebo… ◀

14

What this shows Seoul holds 14 patents at rank #20,363, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Seoul

By rank, the assignees closest to #20,363 in granted patent volume.

Leaders in B21D (Working OR Processing OF Sheet Metal OR Metal Tubes)

Other assignees with the most granted patents in Seoul's primary technology class.

Seoul's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

34 Top 55% higher than 45% of 50,000 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Seoul Laser Dieboard System Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	1	7.1%
2016	1	7.1%
2017	1	7.1%
2019	4	28.6%
2020	2	14.3%
2021	1	7.1%
2022	3	21.4%
2024	1	7.1%

Which technologies does Seoul Laser Dieboard System Co., Ltd. patent most?

B21D - WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL 11

G09F - DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS 8

Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION 7

B23D - PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR 4

B26D - CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING 3

B31B - MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER 3

B26F - PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING 3

B23P - METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 3

B24B - MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS 1

B31F - MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER 1

B29C - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1

B23Q - DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING ; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT 1

F16B - DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING 1

B30B - PRESSES IN GENERAL 1

B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1

Top 15 of 17 technology areas

Where it ranks

Overall rank by patents

#20,390

of 50,000 tracked assignees

Innovation Score

33.6 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.