Radware Ltd.
USPTO PatentsView assignee record - 105 granted patents across 6 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H04L (Transmission OF Digital Information, e.g. Telegraphic Communication).
The verdict
According to USPTO PatentsView, Radware ranks #3,508 of 49,997 tracked US assignees by granted-patent volume, with 105 patents across 6 technology areas.
- #3,508
- of 49,997 US assignees by volume
- Top 19%
- by Innovation Score (47.0/100)
- 23.6
- avg claims per patent
- +33%
- grant velocity, last 5 yrs
USPTO PatentsView assignee plate
Corpus R3508 · Foreign Corporation #3,508 · 105 grants
GRANTS-MID · TOP-DECILE · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-DENSE · TYPE-FRNCORP · VEL-UP · BOOK-FULL
- GRANTS-MID 105 grants
- TOP-DECILE #3,508/49,997
- PHOTO-FINISH National University…
- CPC-NARROW H04L · 6 areas
- INNOV-PAR 47.0/100
- CLAIMS-DENSE 23.6 claims/avg
- TYPE-FRNCORP Foreign Corp
- VEL-UP +33% vel
- BOOK-FULL 10/10 fields
Nearest grant-volume peer: National University Corporation Chiba University (±0 grants)
Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.
How Radware’s 47.0 Innovation Score adds up
The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.
Innovation-score neighbourhood around Radware
Lowest and highest poles plus nearest Innovation Score peers, not a full corpus board reprint.
- Qualcomm Incorporated · highest
Qualcomm Incorporated · highest
85 score
- Dai-ichi Kogyo Seiyaku · near
Dai-ichi Kogyo Seiyaku · near
47 score
- DIO · near
DIO · near
47 score
- Radware · this assignee
Radware · this assignee
47 score
- Teradata US · near
Teradata US · near
47 score
- Trek Bicycle · near
Trek Bicycle · near
47 score
- 3D Lighting… · lowest 7
3D Lighting… · lowest
7 score
What this shows Radware's Innovation Score is 47.0/100 (top 19% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.
Does more volume mean deeper claims for Radware?
Each dot is one of Radware’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Radware’s own 23.6 claims/patent is ABOVE the 15.9 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.
Where Radware's grants concentrate
Radware Ltd. is a focused PatentsView assignee: 6 CPC subclasses with 92.4% of grants classified under H04L (Transmission OF Digital Information, e.g. Telegraphic Communication). Peak complete grant year is 2020 (13 grants) versus a trough of 6 in 2015. By volume, Radware sits between National University Corporation Chiba University and Tianma Japan, Ltd..
Radware's three-year grant acceleration
From 2019–2021 to 2022–2024, Radware Ltd. moved from 28 to 34 grants (1.21x the prior three-year total, a multiple, not a CAGR). Among 3,296 tracked assignees with ≥100 grants and ≥20 prior-period grants, that multiple ranks #766. See the growth leaderboard.
Who files at Radware's volume?
Granted US patents 2015–2025 versus its nearest-ranked assignees by volume, this company marked ◀
- National Universi…
National University Corporation Chiba University
105 patents
- Navitas Semicondu…
Navitas Semiconductor Limited
105 patents
- Prc-desoto Intern…
Prc-desoto International, Inc.
105 patents
- Raydium Semicondu…
Raydium Semiconductor Corporation
105 patents
- Sony Pictures Ent…
Sony Pictures Entertainment Inc.
105 patents
- Spirent Communica…
Spirent Communications, Inc.
105 patents
- Teledyne Scientif…
Teledyne Scientific & Imaging, LLC
105 patents
- Tianma Japan
Tianma Japan, Ltd.
105 patents
- Radware ◀
Radware Ltd.
105 patents
What this shows Radware holds 105 patents at rank #3,509, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.
Companies ranked near Radware
By rank, the assignees closest to #3,509 in granted patent volume.
- National University Corporation Chiba University #3,505 · 105 patents
- Navitas Semiconductor Limited #3,506 · 105 patents
- Prc-desoto International, Inc. #3,507 · 105 patents
- Raydium Semiconductor Corporation #3,508 · 105 patents
- Sony Pictures Entertainment Inc. #3,510 · 105 patents
- Spirent Communications, Inc. #3,511 · 105 patents
- Teledyne Scientific & Imaging, LLC #3,512 · 105 patents
- Tianma Japan, Ltd. #3,513 · 105 patents
Leaders in H04L (Transmission OF Digital Information)
Other assignees with the most granted patents in Radware's primary technology class.
- International Business Machines Corporation 15,969 in class
- Qualcomm Incorporated 13,594 in class
- Huawei Technologies Co., Ltd. 11,697 in class
- Samsung Electronics Co., Ltd. 10,543 in class
- LG Electronics Inc. 9,062 in class
- Telefonaktiebolaget LM Ericsson (Publ) 8,543 in class
- Cisco Technology, Inc. 7,502 in class
- Microsoft Technology Licensing, LLC 7,301 in class
Assignees with similar portfolio profiles
Two PlainPatent-derived peer sets for Radware, neither rank-band nor same-CPC leaders (those blocks stay above). In H04L (Transmission OF Digital Information), Radware ranks #396 of 8,956 assignees by patent count in that subclass.
Similar innovation score
Nearest assignees by Innovation Score (47 here).
Similar claim depth
Nearest assignees by average claims per patent (23.6 here).
Radware's Innovation Score vs. every tracked assignee
Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)
47 Top 19% higher than 81% of 49,997 US assignees
Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.
Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025
Grants by year
Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.
View data table
| Year | Patents Granted | Share of Period |
|---|---|---|
| 2015 | 6 | 5.7% |
| 2016 | 12 | 11.4% |
| 2017 | 12 | 11.4% |
| 2018 | 6 | 5.7% |
| 2019 | 6 | 5.7% |
| 2020 | 13 | 12.4% |
| 2021 | 9 | 8.6% |
| 2022 | 12 | 11.4% |
| 2023 | 12 | 11.4% |
| 2024 | 10 | 9.5% |
| 2025partial year | 7 | 6.7% |
Which technologies does Radware Ltd. patent most?
Top 6 of 6 technology areas
Data Source
USPTO PatentsView, US granted patents 2015–2025
What to do with this data
Radware Ltd.'s patent record in context - here's where to go next.
- Radware Ltd.'s lead technology class is H04L (Transmission OF Digital Information, e.g. Telegraphic Communication), 92.4% of its portfolio - see every assignee active in that class. Explore H04L
- Ranked #3,508 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
- Compare Radware Ltd. against National University Corporation Chiba University, an assignee filing at a similar volume. Compare portfolios
- Innovation Score of 47.0/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated
Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.
Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.