Where does PackSys Global AG rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), PackSys Global AG ranks #49,451 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does PackSys Global AG hold?

PackSys Global AG holds 5 US utility patents granted between 2023 and 2025, spanning 7 technology areas.

What is PackSys Global AG's Innovation Score?

PackSys Global AG has an Innovation Score of 46.8 out of 100 (top 20% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is PackSys Global AG's patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for PackSys Global AG.

What does claim depth mean for PackSys Global AG's patents?

PackSys Global AG's patents average 18.8 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the PackSys Global AG patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

PackSys Global AG

Q: What technology areas does PackSys Global AG focus on?

PackSys Global AG's top technology area is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing) with 2 patents. Grants appear in 7 CPC subclasses total.

USPTO PatentsView assignee record - 5 granted patents across 7 technology areas, recorded in grant years 2023–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Packsys ranks #49,451 of 49,997 tracked US assignees by granted-patent volume, with 5 patents across 7 technology areas.

#49,451
of 49,997 US assignees by volume: Top 20%
by Innovation Score (46.8/100): 18.8
avg claims per patent

USPTO PatentsView assignee plate

Corpus R49451 · Foreign Corporation #49,451 · 5 grants

GRANTS-MICRO · BOTTOM-DECILE · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH

GRANTS-MICRO 5 grants
BOTTOM-DECILE #49,451/49,997
PHOTO-FINISH Pacaso
CPC-NARROW B29C · 7 areas
INNOV-PAR 46.8/100
CLAIMS-RICH 18.8 claims/avg
TYPE-FRNCORP Foreign Corp
SPAN-YRS 2023–2025 · 3y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: Pacaso Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
PackSys Global · this assignee

47
3D Lighting… · lowest

7

What this shows Packsys's Innovation Score is 46.8/100 (top 20% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Packsys's grants concentrate

PackSys Global AG is a focused PatentsView assignee: 7 CPC subclasses with 40% of grants classified under B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing). Peak complete grant year is 2024 (2 grants) versus a trough of 1 in 2023. By volume, Packsys sits between Pacaso Inc. and Paladin Labs Inc..

Packsys's three-year grant acceleration

PackSys Global AG shows 3 grants in 2022–2024 against only 0 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Pacaso

5
Pacific Berry Bre…

5
Pacific Scientifi…

5
Pacific Scientifi…

5
Packaging Progres…

5
Packetsled

5
Padaluma Ink-jet-…

5
Paladin Labs

5
Packsys Global ◀

5

What this shows PackSys holds 5 patents at rank #49,647, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near PackSys

By rank, the assignees closest to #49,647 in granted patent volume.

Leaders in B29C (Shaping OR Joining OF Plastics)

Other assignees with the most granted patents in PackSys's primary technology class.

Packsys's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

47 Top 20% higher than 80% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2023–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2023–2019 baseline. Full figures in the table below.

View data table

PackSys Global AG patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2023	1	20.0%
2024	2	40.0%
2025partial year	2	40.0%

Which technologies does PackSys Global AG patent most?

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 2

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 2

B26D - CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing 2

B26F - PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; Severing BY Means Other Than Cutting 2

B65B - Machines, Apparatus OR Devices FOR, OR Methods OF, Packaging Articles OR MATERIALS; Unpacking 1

G01N - Investigating OR Analysing Materials BY Determining Their Chemical OR Physical Properties 1

B65G - Transport OR Storage Devices, e.g. Conveyors FOR Loading OR Tipping, Shop Conveyor Systems OR Pneumatic Tube Conveyors 1

Top 7 of 7 technology areas

Where it ranks

Overall rank by patents

#49,451

of 49,997 tracked assignees

Innovation Score

46.8 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

PackSys Global AG's patent record in context - here's where to go next.

PackSys Global AG's lead technology class is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing), 40% of its portfolio - see every assignee active in that class. Explore B29C
Ranked #49,451 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare PackSys Global AG against Pacaso Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 46.8/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.