Where does Laser Engineering Applications rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Laser Engineering Applications ranks #32,310 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Laser Engineering Applications hold?

Laser Engineering Applications holds 8 US utility patents granted between 2019 and 2024, spanning 8 technology areas.

What is Laser Engineering Applications's Innovation Score?

Laser Engineering Applications has an Innovation Score of 47.8 out of 100 (top 18% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Laser Engineering Applications's patent grant rate increasing or decreasing?

Laser Engineering Applications's recent grant velocity is +600% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Laser Engineering Applications's patents?

Laser Engineering Applications's patents average 17.0 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Laser Engineering Applications patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Laser Engineering Applications

Q: What technology areas does Laser Engineering Applications focus on?

Laser Engineering Applications's top technology area is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam) with 8 patents, ranking #248 of 1,623 assignees active in that subclass. Grants appear in 8 CPC subclasses total.

USPTO PatentsView assignee record - 8 granted patents across 8 technology areas, recorded in grant years 2019–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Laser ranks #32,310 of 49,997 tracked US assignees by granted-patent volume, with 8 patents across 8 technology areas.

#32,310
of 49,997 US assignees by volume: Top 18%
by Innovation Score (47.8/100): 17.0
avg claims per patent: +600%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R32310 · Foreign Corporation #32,310 · 8 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 8 grants
MID-PACK #32,310/49,997
PHOTO-FINISH Lacrisciences
CPC-NARROW B23K · 8 areas
INNOV-PAR 47.8/100
CLAIMS-RICH 17.0 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +600% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Lacrisciences, LLC (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Laser’s 47.8 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 7.6 pts (16%) Velocity 20.0 pts (42%) Breadth 10.0 pts (21%) Claim depth 10.2 pts (21%)

Qualcomm Incorporated · highest

85
Laser Engineering… · this assignee

48
3D Lighting… · lowest

7

What this shows Laser's Innovation Score is 47.8/100 (top 18% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Laser?

Each dot is one of Laser’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Laser’s own 17.0 claims/patent is ABOVE the 10.6 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Laser vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Laser's grants concentrate

Laser Engineering Applications is a focused PatentsView assignee: 8 CPC subclasses with 100% of grants classified under B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam). Peak complete grant year is 2022 (4 grants) versus a trough of 1 in 2019. By volume, Laser sits between Lacrisciences, LLC and LDA Technologies Ltd..

Laser's three-year grant acceleration

Laser Engineering Applications shows 7 grants in 2022–2024 against only 1 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Lacrisciences

8
Laimu

8
Lake Country Nurs…

8
Landor Architectu…

8
Latitude 18

8
Laxense

8
Lc-tec Displays AB

8
LDA

8
Laser Engineering… ◀

8

What this shows Laser holds 8 patents at rank #32,295, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Laser

By rank, the assignees closest to #32,295 in granted patent volume.

Leaders in B23K (Soldering OR Unsoldering)

Other assignees with the most granted patents in Laser's primary technology class.

Laser's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

48 Top 18% higher than 82% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2019–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2019–2019 baseline. Full figures in the table below.

View data table

Laser Engineering Applications patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2019	1	12.5%
2022	4	50.0%
2024	3	37.5%

Which technologies does Laser Engineering Applications patent most?

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 8

G02B - Optical Elements, Systems OR Apparatus 4

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 2

G09B - Educational OR Demonstration APPLIANCES; Appliances FOR Teaching, OR Communicating With, THE Blind, Deaf OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; Diagrams 2

G06F - Electric Digital Data Processing 2

G05B - Control OR Regulating Systems IN GENERAL; Functional Elements OF Such SYSTEMS; Monitoring OR Testing Arrangements FOR Such Systems OR Elements 2

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 1

G01B - Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours 1

Top 8 of 8 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Laser Engineering Applications's patent record in context - here's where to go next.

Laser Engineering Applications's lead technology class is B23K (Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam), 100% of its portfolio - see every assignee active in that class. Explore B23K
Ranked #32,310 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Laser Engineering Applications against Lacrisciences, LLC, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 47.8/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.