Where does KAI R&D Center Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), KAI R&D Center Co., Ltd. ranks #7,580 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does KAI R&D Center Co., Ltd. hold?

KAI R&D Center Co., Ltd. holds 43 US utility patents granted between 2015 and 2025, spanning 20 technology areas.

What is KAI R&D Center Co., Ltd.'s Innovation Score?

KAI R&D Center Co., Ltd. has an Innovation Score of 37.9 out of 100 (top 42% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does KAI R&D Center Co., Ltd. focus on?

KAI R&D Center Co., Ltd.'s top technology area is B26B (Hand-held Cutting Tools NOT Otherwise Provided FOR) with 19 patents, ranking #20 of 239 assignees active in that subclass. Grants appear in 20 CPC subclasses total.

Is KAI R&D Center Co., Ltd.'s patent grant rate increasing or decreasing?

KAI R&D Center Co., Ltd.'s recent grant velocity is -40% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for KAI R&D Center Co., Ltd.'s patents?

KAI R&D Center Co., Ltd.'s patents average 5.9 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the KAI R&D Center Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

KAI R&D Center Co., Ltd.

USPTO PatentsView assignee record - 43 granted patents across 20 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B26B (Hand-held Cutting Tools NOT Otherwise Provided FOR).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, KAI ranks #7,580 of 49,997 tracked US assignees by granted-patent volume, with 43 patents across 20 technology areas.

#7,580
of 49,997 US assignees by volume: Top 42%
by Innovation Score (37.9/100): 5.9
avg claims per patent: -40%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R7580 · Foreign Corporation #7,580 · 43 grants

GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DOWN · BOOK-FULL

GRANTS-SMALL 43 grants
UPPER-Q #7,580/49,997
PHOTO-FINISH Inveniam Capital…
CPC-FOCUS B26B · 20 areas
INNOV-THIN 37.9/100
CLAIMS-SPARSE 5.9 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DOWN -40% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Inveniam Capital Partners, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How KAI’s 37.9 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 13.1 pts (35%) Velocity 5.5 pts (15%) Breadth 15.8 pts (42%) Claim depth 3.5 pts (9%)

Qualcomm Incorporated · highest

85
KAI R&D Center · this assignee

38
Krohne · near

38
Omicron · near

38
Skyline Partners… · near

38
Valeo Kapec · near

38
3D Lighting… · lowest

7

What this shows KAI's Innovation Score is 37.9/100 (top 42% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for KAI?

Each dot is one of KAI’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). KAI’s own 5.9 claims/patent is at or below the 10.7 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

KAI vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where KAI's grants concentrate

KAI R&D Center Co., Ltd. is a focused PatentsView assignee: 20 CPC subclasses with 44.2% of grants classified under B26B (Hand-held Cutting Tools NOT Otherwise Provided FOR). Peak complete grant year is 2015 (6 grants) versus a trough of 2 in 2023. By volume, KAI sits between Inveniam Capital Partners, Inc. and Leer Group.

KAI's three-year grant acceleration

KAI R&D Center Co., Ltd. shows 9 grants in 2022–2024 against only 11 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Inveniam Capital…

43
Japan Petroleum E…

43
Jiangsu Xcmg Cons…

43
Johnson Matthey D…

43
Karl Leibinger Me…

43
KEY Foundry

43
Kito

43
Leer Group

43
KAI R&D Center ◀

43

What this shows KAI holds 43 patents at rank #7,580, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near KAI

By rank, the assignees closest to #7,580 in granted patent volume.

Leaders in B26B (Hand-held Cutting Tools)

Other assignees with the most granted patents in KAI's primary technology class.

Assignees with similar portfolio profiles

Two PlainPatent-derived peer sets for KAI, neither rank-band nor same-CPC leaders (those blocks stay above). In B26B (Hand-held Cutting Tools), KAI ranks #20 of 239 assignees by patent count in that subclass.

Similar innovation score

Nearest assignees by Innovation Score (38 here).

Omicron electronics GmbH 38 Krohne AG 38 Skyline Partners Technology LLC 38 Valeo Kapec Co., Ltd. 38

KAI's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

38 Top 42% higher than 58% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

KAI R&D Center Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	6	14.0%
2016	6	14.0%
2017	3	7.0%
2018	5	11.6%
2019	5	11.6%
2021	6	14.0%
2022	4	9.3%
2023	2	4.7%
2024	3	7.0%
2025partial year	3	7.0%

Which technologies does KAI R&D Center Co., Ltd. patent most?

B26B - Hand-held Cutting Tools NOT Otherwise Provided FOR 19

A61B - DIAGNOSIS; SURGERY; Identification 4

Y10T - Technical Subjects Covered BY Former US Classification 2

F04C - Rotary-piston, OR Oscillating-piston, Positive-displacement Machines FOR Liquids ; Rotary-piston, OR Oscillating-piston, Positive-displacement Pumps 2

A61F - Filters Implantable Into Blood VESSELS; PROSTHESES; Devices Providing Patency TO, OR Preventing Collapsing OF, Tubular Structures OF THE Body, e.g. STENTS; Orthopaedic, Nursing OR Contraceptive DEVICES; FOMENTATION; Treatment OR Protection OF Eyes OR EARS; Bandages, Dressings OR Absorbent PADS; Firs 2

A47G - Household OR Table Equipment 2

A47J - Kitchen EQUIPMENT; Coffee MILLS; Spice MILLS; Apparatus FOR Making Beverages 2

B26D - CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing 1

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 1

C23F - Non-mechanical Removal OF Metallic Material From Surface ; Inhibiting Corrosion OF Metallic Material OR Incrustation IN GENERAL; Multi-step Processes FOR Surface Treatment OF Metallic Material Involving AT Least ONE Process Provided FOR IN Class C23 AND AT Least ONE Process Covered BY Subclass C21d 1

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 1

G06Q - Information AND Communication Technology [ICT] Specially Adapted FOR Administrative, Commercial, Financial, Managerial OR Supervisory PURPOSES; Systems OR Methods Specially Adapted FOR Administrative, Commercial, Financial, Managerial OR Supervisory Purposes, NOT Otherwise Provided FOR 1

F16M - Frames, Casings OR Beds OF Engines, Machines OR Apparatus, NOT Specific TO Engines, Machines OR Apparatus Provided FOR ELSEWHERE; STANDS; Supports 1

A47L - Domestic Washing OR Cleaning ; Suction Cleaners IN General 1

A45D - Hairdressing OR Shaving Equipment ; Equipment FOR Cosmetics OR Cosmetic Treatments, e.g. FOR Manicuring OR Pedicuring 1

Top 15 of 20 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

KAI R&D Center Co., Ltd.'s patent record in context - here's where to go next.

KAI R&D Center Co., Ltd.'s lead technology class is B26B (Hand-held Cutting Tools NOT Otherwise Provided FOR), 44.2% of its portfolio - see every assignee active in that class. Explore B26B
Ranked #7,580 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare KAI R&D Center Co., Ltd. against Inveniam Capital Partners, Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 37.9/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.