Where does Intermet Technologies Chengdu Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Intermet Technologies Chengdu Co., Ltd. ranks #35,930 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Intermet Technologies Chengdu Co., Ltd. hold?

Intermet Technologies Chengdu Co., Ltd. holds 7 US utility patents granted between 2017 and 2021, spanning 9 technology areas.

What is Intermet Technologies Chengdu Co., Ltd.'s Innovation Score?

Intermet Technologies Chengdu Co., Ltd. has an Innovation Score of 21.6 out of 100 (9th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Intermet Technologies Chengdu Co., Ltd.'s patent grant rate increasing or decreasing?

Intermet Technologies Chengdu Co., Ltd.'s recent grant velocity is -25% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Intermet Technologies Chengdu Co., Ltd.'s patents?

Intermet Technologies Chengdu Co., Ltd.'s patents average 6.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Intermet Technologies Chengdu Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Intermet Technologies Chengdu Co., Ltd.

Q: What technology areas does Intermet Technologies Chengdu Co., Ltd. focus on?

Intermet Technologies Chengdu Co., Ltd.'s top technology area is B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder) with 4 patents, ranking #291 of 926 assignees active in that subclass. Grants appear in 9 CPC subclasses total.

USPTO PatentsView assignee record - 7 granted patents across 9 technology areas, recorded in grant years 2017–2021. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Intermet ranks #35,930 of 49,997 tracked US assignees by granted-patent volume, with 7 patents across 9 technology areas.

#35,930
of 49,997 US assignees by volume: 9th percentile
by Innovation Score (21.6/100): 6.3
avg claims per patent: -25%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R35930 · Foreign Corporation #35,930 · 7 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DOWN · BOOK-FULL

GRANTS-MICRO 7 grants
MID-PACK #35,930/49,997
PHOTO-FINISH Inter-Global
CPC-NARROW B22F · 9 areas
INNOV-THIN 21.6/100
CLAIMS-SPARSE 6.3 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DOWN -25% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Inter-Global, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Intermet’s 21.6 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 7.2 pts (33%) Velocity 0.0 pts (0%) Breadth 10.6 pts (49%) Claim depth 3.8 pts (18%)

Qualcomm Incorporated · highest

85
Intermet Chengdu · this assignee

22
3D Lighting… · lowest

7

What this shows Intermet's Innovation Score is 21.6/100 (9th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Intermet?

Each dot is one of Intermet’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Intermet’s own 6.3 claims/patent is at or below the 13.7 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Intermet vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Intermet's grants concentrate

Intermet Technologies Chengdu Co., Ltd. is a focused PatentsView assignee: 9 CPC subclasses with 57.1% of grants classified under B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder). Peak complete grant year is 2018 (2 grants) versus a trough of 1 in 2017. By volume, Intermet sits between Inter-Global, Inc. and International Microsystems, Inc..

Inter-global

7
Intervalve

7
Interana

7
Intercom

7
International Con…

7
International Lif…

7
International Med…

7
International Mic…

7
Intermet Chengdu ◀

7

What this shows Intermet holds 7 patents at rank #35,959, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Intermet

By rank, the assignees closest to #35,959 in granted patent volume.

Leaders in B22F (Working Metallic Powder)

Other assignees with the most granted patents in Intermet's primary technology class.

Intermet's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

22 9th percentile higher than 9% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2017–2021

Grants by year

Teal-shaded recent years (2020–present) versus the 2017–2019 baseline. Full figures in the table below.

View data table

Intermet Technologies Chengdu Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2017	1	14.3%
2018	2	28.6%
2019	1	14.3%
2020	2	28.6%
2021	1	14.3%

Which technologies does Intermet Technologies Chengdu Co., Ltd. patent most?

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 4

B01D - Separation 4

C22C - Alloys 3

C04B - Lime, MAGNESIA; SLAG; CEMENTS; Compositions Thereof, e.g. Mortars, Concrete OR Like Building MATERIALS; Artificial Stone ; Ceramics ; REFRACTORIES; Treatment OF Natural Stone 1

Y10T - Technical Subjects Covered BY Former US Classification 1

B05D - Processes FOR Applying Fluent Materials TO Surfaces, IN General 1

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 1

C01B - Non-metallic ELEMENTS; Compounds THEREOF; ; Metalloids OR Compounds Thereof NOT Covered BY Subclass C01c 1

B01J - Chemical OR Physical Processes, e.g. Catalysis OR Colloid CHEMISTRY; Their Relevant Apparatus 1

Top 9 of 9 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Intermet Technologies Chengdu Co., Ltd.'s patent record in context - here's where to go next.

Intermet Technologies Chengdu Co., Ltd.'s lead technology class is B22F (Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder), 57.1% of its portfolio - see every assignee active in that class. Explore B22F
Ranked #35,930 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Intermet Technologies Chengdu Co., Ltd. against Inter-Global, Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 21.6/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.