Where does Hosokawa Alpine Aktiengesellschaft rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hosokawa Alpine Aktiengesellschaft ranks #31,944 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hosokawa Alpine Aktiengesellschaft hold?

Hosokawa Alpine Aktiengesellschaft holds 8 US utility patents granted between 2018 and 2025, spanning 7 technology areas.

What is Hosokawa Alpine Aktiengesellschaft's Innovation Score?

Hosokawa Alpine Aktiengesellschaft has an Innovation Score of 46.2 out of 100 (top 21% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Hosokawa Alpine Aktiengesellschaft's patent grant rate increasing or decreasing?

Hosokawa Alpine Aktiengesellschaft's recent grant velocity is +100% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Hosokawa Alpine Aktiengesellschaft's patents?

Hosokawa Alpine Aktiengesellschaft's patents average 15.4 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Hosokawa Alpine Aktiengesellschaft patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Hosokawa Alpine Aktiengesellschaft

Q: What technology areas does Hosokawa Alpine Aktiengesellschaft focus on?

Hosokawa Alpine Aktiengesellschaft's top technology area is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing) with 5 patents, ranking #1,113 of 4,378 assignees active in that subclass. Grants appear in 7 CPC subclasses total.

USPTO PatentsView assignee record - 8 granted patents across 7 technology areas, recorded in grant years 2018–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Hosokawa ranks #31,944 of 49,997 tracked US assignees by granted-patent volume, with 8 patents across 7 technology areas.

#31,944
of 49,997 US assignees by volume: Top 21%
by Innovation Score (46.2/100): 15.4
avg claims per patent: +100%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R31944 · Foreign Corporation #31,944 · 8 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 8 grants
MID-PACK #31,944/49,997
PHOTO-FINISH Holweg Group
CPC-NARROW B29C · 7 areas
INNOV-PAR 46.2/100
CLAIMS-RICH 15.4 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +100% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Holweg Group (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Hosokawa’s 46.2 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 7.6 pts (16%) Velocity 20.0 pts (43%) Breadth 9.4 pts (20%) Claim depth 9.2 pts (20%)

Qualcomm Incorporated · highest

85
Hosokawa Alpine… · this assignee

46
3D Lighting… · lowest

7

What this shows Hosokawa's Innovation Score is 46.2/100 (top 21% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Hosokawa?

Each dot is one of Hosokawa’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Hosokawa’s own 15.4 claims/patent is ABOVE the 13.0 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Hosokawa vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Hosokawa's grants concentrate

Hosokawa Alpine Aktiengesellschaft is a focused PatentsView assignee: 7 CPC subclasses with 62.5% of grants classified under B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing). Peak complete grant year is 2023 (2 grants) versus a trough of 1 in 2018. By volume, Hosokawa sits between Holweg Group and HS Labs, Inc..

Hosokawa's three-year grant acceleration

Hosokawa Alpine Aktiengesellschaft shows 4 grants in 2022–2024 against only 1 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Holweg Group

8
Honda Tsushin Kog…

8
Hoppecke Batterie…

8
Horiba France SAS

8
Howa Plastics

8
HRM Enterprises

8
Hrst

8
HS Labs

8
Hosokawa Alpine A… ◀

8

What this shows Hosokawa holds 8 patents at rank #31,899, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hosokawa

By rank, the assignees closest to #31,899 in granted patent volume.

Leaders in B29C (Shaping OR Joining OF Plastics)

Other assignees with the most granted patents in Hosokawa's primary technology class.

Hosokawa's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

46 Top 21% higher than 79% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2018–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2018–2019 baseline. Full figures in the table below.

View data table

Hosokawa Alpine Aktiengesellschaft patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2018	1	12.5%
2019	1	12.5%
2022	1	12.5%
2023	2	25.0%
2024	1	12.5%
2025partial year	2	25.0%

Which technologies does Hosokawa Alpine Aktiengesellschaft patent most?

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 5

B07B - Separating Solids From Solids BY Sieving, Screening, Sifting OR BY Using GAS CURRENTS; Separating BY Other DRY Methods Applicable TO Bulk Material, e.g. Loose Articles FIT TO BE Handled Like Bulk Material 1

B01D - Separation 1

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 1

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 1

B65H - Handling Thin OR Filamentary Material, e.g. Sheets, Webs, Cables 1

B02C - Crushing, Pulverising, OR Disintegrating IN GENERAL; Milling Grain 1

Top 7 of 7 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Hosokawa Alpine Aktiengesellschaft's patent record in context - here's where to go next.

Hosokawa Alpine Aktiengesellschaft's lead technology class is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing), 62.5% of its portfolio - see every assignee active in that class. Explore B29C
Ranked #31,944 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Hosokawa Alpine Aktiengesellschaft against Holweg Group, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 46.2/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.