Where does Hokuetsu Corporation rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hokuetsu Corporation ranks #40,726 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hokuetsu Corporation hold?

Hokuetsu Corporation holds 6 US utility patents granted between 2019 and 2025, spanning 17 technology areas.

What is Hokuetsu Corporation's Innovation Score?

Hokuetsu Corporation has an Innovation Score of 32.4 out of 100 (41st percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Hokuetsu Corporation's patent grant rate increasing or decreasing?

Hokuetsu Corporation's recent grant velocity is +200% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Hokuetsu Corporation's patents?

Hokuetsu Corporation's patents average 7.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Hokuetsu Corporation patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Hokuetsu Corporation

Q: What technology areas does Hokuetsu Corporation focus on?

Hokuetsu Corporation's top technology area is C08J (WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h) with 4 patents. Grants appear in 17 CPC subclasses total.

USPTO PatentsView assignee record - 6 granted patents across 17 technology areas, recorded in grant years 2019–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: C08J (WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Hokuetsu ranks #40,726 of 49,997 tracked US assignees by granted-patent volume, with 6 patents across 17 technology areas.

#40,726
of 49,997 US assignees by volume: 41st percentile
by Innovation Score (32.4/100): 7.3
avg claims per patent: +200%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R40726 · Foreign Corporation #40,726 · 6 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 6 grants
LOWER-Q #40,726/49,997
PHOTO-FINISH Hmdyh Holding
CPC-FOCUS C08J · 17 areas
INNOV-THIN 32.4/100
CLAIMS-SPARSE 7.3 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +200% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Hmdyh Holding Company, LLC (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Hokuetsu · this assignee

32
3D Lighting… · lowest

7

What this shows Hokuetsu's Innovation Score is 32.4/100 (41st percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Hokuetsu's grants concentrate

Hokuetsu Corporation is a focused PatentsView assignee: 17 CPC subclasses with 66.7% of grants classified under C08J (WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h). Peak complete grant year is 2024 (2 grants) versus a trough of 1 in 2019. By volume, Hokuetsu sits between Hmdyh Holding Company, LLC and Holystone USA, Inc..

Hokuetsu's three-year grant acceleration

Hokuetsu Corporation shows 2 grants in 2022–2024 against only 2 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Hmdyh Holding

6
HO Cheng Garden T…

6
Hoerbiger Automot…

6
Hogue Tool & Mach…

6
Holden Forests AN…

6
Holmbergs Safety…

6
Holo Surgical

6
Holystone USA

6
Hokuetsu ◀

6

What this shows Hokuetsu holds 6 patents at rank #40,649, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hokuetsu

By rank, the assignees closest to #40,649 in granted patent volume.

Leaders in C08J (Working-up)

Other assignees with the most granted patents in Hokuetsu's primary technology class.

Hokuetsu's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

32 41st percentile higher than 41% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2019–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2019–2019 baseline. Full figures in the table below.

View data table

Hokuetsu Corporation patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2019	1	16.7%
2020	1	16.7%
2024	2	33.3%
2025partial year	2	33.3%

Which technologies does Hokuetsu Corporation patent most?

C08J - WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h 4

D21H - Pulp COMPOSITIONS; Preparation Thereof NOT Covered BY Subclasses D21c OR D21D; Impregnating OR Coating OF PAPER; Treatment OF Finished Paper NOT Covered BY Class B31 OR Subclass D21G; Paper NOT Otherwise Provided FOR 4

B82Y - Specific Uses OR Applications OF NANOSTRUCTURES; Measurement OR Analysis OF NANOSTRUCTURES; Manufacture OR Treatment OF Nanostructures 3

B01D - Separation 3

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 2

C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients 2

C01B - Non-metallic ELEMENTS; Compounds THEREOF; ; Metalloids OR Compounds Thereof NOT Covered BY Subclass C01c 2

C08L - Compositions OF Macromolecular Compounds 2

D06M - Treatment, NOT Provided FOR Elsewhere IN Class D06, OF Fibres, Threads, Yarns, Fabrics, Feathers OR Fibrous Goods Made From Such Materials 2

C09D - Coating Compositions, e.g. Paints, Varnishes OR LACQUERS; Filling PASTES; Chemical Paint OR INK REMOVERS; INKS; Correcting FLUIDS; WOODSTAINS; Pastes OR Solids FOR Colouring OR PRINTING; USE OF Materials Therefor 2

D04H - Making Textile Fabrics, e.g. From Fibres OR Filamentary Material ; Fabrics Made BY Such Processes OR Apparatus, e.g. Felts, Non-woven FABRICS; COTTON-WOOL; Wadding ; ; Non-woven Fabrics From Staple Fibres, Filaments OR Yarns, Bonded With AT Least ONE Web-like Material During Their Consolidation 1

Y10T - Technical Subjects Covered BY Former US Classification 1

D21F - Paper-making MACHINES; Methods OF Producing Paper Thereon 1

C09K - Materials FOR Miscellaneous Applications, NOT Provided FOR Elsewhere 1

C08G - Macromolecular Compounds Obtained Otherwise Than BY Reactions Only Involving Unsaturated Carbon-to-carbon Bonds 1

Top 15 of 17 technology areas

Where it ranks

Overall rank by patents

#40,726

of 49,997 tracked assignees

Innovation Score

32.4 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Hokuetsu Corporation's patent record in context - here's where to go next.

Hokuetsu Corporation's lead technology class is C08J (WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h), 66.7% of its portfolio - see every assignee active in that class. Explore C08J
Ranked #40,726 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Hokuetsu Corporation against Hmdyh Holding Company, LLC, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 32.4/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.