Where does Highcon Systems Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Highcon Systems Ltd. ranks #16,080 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Highcon Systems Ltd. hold?

Highcon Systems Ltd. holds 18 US utility patents granted between 2015 and 2025, spanning 21 technology areas.

What is Highcon Systems Ltd.'s Innovation Score?

Highcon Systems Ltd. has an Innovation Score of 42.0 out of 100 (top 32% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Highcon Systems Ltd. focus on?

Highcon Systems Ltd.'s top technology area is B31B (Making Containers OF Paper, Cardboard OR Material Worked IN A Manner Analogous TO Paper) with 7 patents, ranking #37 of 282 assignees active in that subclass. Grants appear in 21 CPC subclasses total.

Is Highcon Systems Ltd.'s patent grant rate increasing or decreasing?

Highcon Systems Ltd.'s recent grant velocity is +29% compared to the prior five-year period (grant years, not application filing dates). The company is maintaining or growing its granted-patent output.

What does claim depth mean for Highcon Systems Ltd.'s patents?

Highcon Systems Ltd.'s patents average 21.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Highcon Systems Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Highcon Systems Ltd.

USPTO PatentsView assignee record - 18 granted patents across 21 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B31B (Making Containers OF Paper, Cardboard OR Material Worked IN A Manner Analogous TO Paper).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Highcon ranks #16,080 of 49,997 tracked US assignees by granted-patent volume, with 18 patents across 21 technology areas.

#16,080
of 49,997 US assignees by volume: Top 32%
by Innovation Score (42.0/100): 21.3
avg claims per patent: +29%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R16080 · Foreign Corporation #16,080 · 18 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-DENSE · TYPE-FRNCORP · VEL-UP · BOOK-FULL

GRANTS-MICRO 18 grants
MID-PACK #16,080/49,997
PHOTO-FINISH Hbpo
CPC-FOCUS B31B · 21 areas
INNOV-PAR 42.0/100
CLAIMS-DENSE 21.3 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-UP +29% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Hbpo GmbH (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Highcon’s 42.0 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 10.2 pts (24%) Velocity 2.9 pts (7%) Breadth 16.2 pts (38%) Claim depth 12.8 pts (30%)

Qualcomm Incorporated · highest

85
Highcon Systems · this assignee

42
3D Lighting… · lowest

7

What this shows Highcon's Innovation Score is 42.0/100 (top 32% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Highcon?

Each dot is one of Highcon’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Highcon’s own 21.3 claims/patent is ABOVE the 14.6 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Highcon vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Highcon's grants concentrate

Highcon Systems Ltd. is a focused PatentsView assignee: 21 CPC subclasses with 38.9% of grants classified under B31B (Making Containers OF Paper, Cardboard OR Material Worked IN A Manner Analogous TO Paper). Peak complete grant year is 2016 (3 grants) versus a trough of 1 in 2017. By volume, Highcon sits between Hbpo GmbH and Hoyu Co., Ltd..

Highcon's three-year grant acceleration

Highcon Systems Ltd. shows 3 grants in 2022–2024 against only 7 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Hbpo

18
HDT Expeditionary…

18
Heartsine

18
Hefei Midea Heati…

18
Hilverda Kooij B V

18
Horizon Orphan

18
Horsch Leeb Appli…

18
Hoyu

18
Highcon Systems ◀

18

What this shows Highcon holds 18 patents at rank #16,073, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Highcon

By rank, the assignees closest to #16,073 in granted patent volume.

Leaders in B31B (Making Containers OF Paper)

Other assignees with the most granted patents in Highcon's primary technology class.

Highcon's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

42 Top 32% higher than 68% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Highcon Systems Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	2	11.1%
2016	3	16.7%
2017	1	5.6%
2019	1	5.6%
2020	3	16.7%
2021	3	16.7%
2023	2	11.1%
2024	1	5.6%
2025partial year	2	11.1%

Which technologies does Highcon Systems Ltd. patent most?

B31B - Making Containers OF Paper, Cardboard OR Material Worked IN A Manner Analogous TO Paper 7

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 6

B31F - Mechanical Working OR Deformation OF Paper, Cardboard OR Material Worked IN A Manner Analogous TO Paper 6

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 5

B26F - PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; Severing BY Means Other Than Cutting 4

B26D - CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing 3

C08K - Use of inorganic or non-macromolecular organic substances as compounding ingredients 3

B44B - Machines, Apparatus OR Tools FOR Artistic Work, e.g. FOR Sculpturing, Guilloching, Carving, Branding, Inlaying 2

C08L - Compositions OF Macromolecular Compounds 2

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 2

C08F - Macromolecular Compounds Obtained BY Reactions Only Involving Carbon-to-carbon Unsaturated Bonds 2

C09J - ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives 2

B65H - Handling Thin OR Filamentary Material, e.g. Sheets, Webs, Cables 2

B33Y - Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering 1

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 1

Top 15 of 21 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Highcon Systems Ltd.'s patent record in context - here's where to go next.

Highcon Systems Ltd.'s lead technology class is B31B (Making Containers OF Paper, Cardboard OR Material Worked IN A Manner Analogous TO Paper), 38.9% of its portfolio - see every assignee active in that class. Explore B31B
Ranked #16,080 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Highcon Systems Ltd. against Hbpo GmbH, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 42.0/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.