Where does Hi Rel Connectors, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hi Rel Connectors, Inc. ranks #24,469 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hi Rel Connectors, Inc. hold?

Hi Rel Connectors, Inc. holds 11 US utility patents granted between 2015 and 2025, spanning 1 technology areas.

What is Hi Rel Connectors, Inc.'s Innovation Score?

Hi Rel Connectors, Inc. has an Innovation Score of 26.2 out of 100 (20th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Hi Rel Connectors, Inc.'s patent grant rate increasing or decreasing?

Hi Rel Connectors, Inc.'s recent grant velocity is -20% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Hi Rel Connectors, Inc.'s patents?

Hi Rel Connectors, Inc.'s patents average 16.1 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Hi Rel Connectors, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Hi Rel Connectors, Inc.

Q: What technology areas does Hi Rel Connectors, Inc. focus on?

Hi Rel Connectors, Inc.'s top technology area is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors) with 11 patents, ranking #278 of 2,265 assignees active in that subclass. Grants appear in 1 CPC subclasses total.

USPTO PatentsView assignee record - 11 granted patents across 1 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Hi ranks #24,469 of 49,997 tracked US assignees by granted-patent volume, with 11 patents across 1 technology areas.

#24,469
of 49,997 US assignees by volume: 20th percentile
by Innovation Score (26.2/100): 16.1
avg claims per patent: -20%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R24469 · US Corporation #24,469 · 11 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-RICH · TYPE-USCORP · VEL-DOWN · BOOK-FULL

GRANTS-MICRO 11 grants
MID-PACK #24,469/49,997
PHOTO-FINISH Hesse
CPC-NARROW H01R · 1 areas
INNOV-THIN 26.2/100
CLAIMS-RICH 16.1 claims/avg
TYPE-USCORP US Corporation
VEL-DOWN -20% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Hesse GmbH (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Hi’s 26.2 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 8.6 pts (33%) Velocity 4.4 pts (17%) Breadth 3.5 pts (13%) Claim depth 9.7 pts (37%)

Qualcomm Incorporated · highest

85
Hi Rel Connectors · this assignee

26
3D Lighting… · lowest

7

What this shows Hi's Innovation Score is 26.2/100 (20th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Hi?

Each dot is one of Hi’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Hi’s own 16.1 claims/patent is ABOVE the 10.4 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Hi vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Hi's grants concentrate

Hi Rel Connectors, Inc. is a focused PatentsView assignee: 1 CPC subclasses with 100% of grants classified under H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors). Peak complete grant year is 2015 (4 grants) versus a trough of 1 in 2019. By volume, Hi sits between Hesse GmbH and Home Racer LLC.

Hi's three-year grant acceleration

Hi Rel Connectors, Inc. shows 2 grants in 2022–2024 against only 3 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Hesse

11
Heuron

11
Hewett-packard De…

11
Hewy Wine Chillers

11
Higgins Research…

11
Hobie Cat

11
Hohmann & Barnard

11
Home Racer

11
Hi Rel Connectors ◀

11

What this shows Hi holds 11 patents at rank #24,485, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hi

By rank, the assignees closest to #24,485 in granted patent volume.

Leaders in H01R (Electrically-conductive Connections)

Other assignees with the most granted patents in Hi's primary technology class.

Hi's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

26 20th percentile higher than 20% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Hi Rel Connectors, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	4	36.4%
2019	1	9.1%
2021	2	18.2%
2023	1	9.1%
2024	1	9.1%
2025partial year	2	18.2%

Which technologies does Hi Rel Connectors, Inc. patent most?

H01R - Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors 11

Top 1 of 1 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Hi Rel Connectors, Inc.'s patent record in context - here's where to go next.

Hi Rel Connectors, Inc.'s lead technology class is H01R (Electrically-conductive CONNECTIONS; Structural Associations OF A Plurality OF Mutually-insulated Electrical Connecting ELEMENTS; Coupling DEVICES; Current Collectors), 100% of its portfolio - see every assignee active in that class. Explore H01R
Ranked #24,469 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Hi Rel Connectors, Inc. against Hesse GmbH, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 26.2/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.