USPTO 2015–2025 USPTO PatentsView US Corporation

Henry Molded Products, Inc.

USPTO PatentsView assignee record — 5 granted patents across 10 technology areas, active 2015–2022. Filing-trend and competitive-moat analysis cross-referenced to USPTO Patent Public Search. Primary class: D21H (PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERW).

5
Total patents granted
10
CPC technology areas
11.4
Avg claims per patent
-33%
5-year filing velocity

Portfolio overview

Henry Molded Products, Inc. has been granted 5 US utility patents between 2015 and 2022, placing Henry Molded Products, Inc. at rank #47,494 across all assignees tracked by PlainPatent. This portfolio spans 10 distinct Cooperative Patent Classification (CPC) subclasses, averaging 11.4 claims per patent with primary concentration in D21H (PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERW). As a US Corporation, Henry Molded Products, Inc. is one of the more focused assignees in the PatentsView dataset. The composite Innovation Score of 30.9/100 blends portfolio volume, filing velocity, technology breadth, and claim depth into a single comparable measure drawn directly from USPTO PatentsView records.

Filing cadence tells the strategic story. Between 2020 and 2025 the company received 2 grants, compared with 3 in the 2015–2019 window — a -33% shift in five-year velocity. A cooling filing rate may reflect portfolio consolidation, shifting priorities, or reduced R&D throughput. The US Corporation classification further shapes interpretation, since corporate, government, and individual filers pursue patents for materially different reasons.

Claim depth and technology breadth together indicate competitive posture. Henry Molded Products, Inc.'s 11.4 average claims per patent suggests focused, narrowly drawn claims typical of single-invention filings, while concentration in 10 subclasses points to a focused technical program. Combined with portfolio volume, these signals let analysts, investors, and licensing professionals benchmark Henry Molded Products, Inc. against peers pursuing similar technology classes.

How does Henry compare?

Granted US patents 2015–2025 versus the largest corporate holders — this company marked ◀

patents

What this shows Henry holds 5 patents — placing it at rank #47,494 overall, well behind the volume leaders but ahead of the tens of thousands of smaller assignees in the dataset.

Source USPTO PatentsView — granted utility patents As of 2015–2025

USPTO utility patent grants by year · 2015–2022

1 20152016201820202022 1
USPTO utility patent grants by year · 2015–2022

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table
Henry Molded Products, Inc. patent grants by year, 2015–2025
Year Patents Granted Share of Period
2015 1 20.0%
2016 1 20.0%
2018 1 20.0%
2020 1 20.0%
2022 1 20.0%

Patent Moat Analysis

Portfolio Volume Light
Tech Breadth Focused
Claim Depth Simple
Velocity Declining

Where it ranks

Overall rank by patents

#47,494

Across all tracked assignees

Innovation Score

30.9 out of 100

View all rankings →

Data Source

USPTO PatentsView — US granted patents 2015–2025

How is Innovation Score calculated?

Frequently Asked Questions

How many patents does Henry Molded Products, Inc. hold?
Henry Molded Products, Inc. holds 5 US granted patents filed between 2015 and 2022, spanning 10 technology areas.
What is Henry Molded Products, Inc.'s Innovation Score?
Henry Molded Products, Inc. has an Innovation Score of 30.9 out of 100. This composite metric weighs portfolio volume (40%), filing velocity (20%), technology breadth (25%), and claim depth (15%).
What technology areas does Henry Molded Products, Inc. focus on?
Henry Molded Products, Inc.'s top technology area is D21H (PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR) with 5 patents. The company has filed patents in 10 CPC subclasses total.
Is Henry Molded Products, Inc.'s patent filing rate increasing or decreasing?
Henry Molded Products, Inc.'s recent filing velocity is -33% compared to the prior five-year period. Filing activity has slowed relative to earlier years.
What does claim depth mean for Henry Molded Products, Inc.'s patents?
Henry Molded Products, Inc.'s patents average 11.4 claims each. This is relatively simple claim structure, typical for focused inventions.
How is the Henry Molded Products, Inc. patent data sourced?
All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

Learn More

Explore the patent dataset

Data sourced from USPTO PatentsView — official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent Editorial

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

All federal data sources used on this page
  • USPTO PatentsView — official U.S. Patent and Trademark Office bulk patent data. patentsview.org
  • USPTO Patent Application Information Retrieval (PAIR) — application status and file history. uspto.gov/patents/pair
  • USPTO Bulk Data Storage System — comprehensive patent text + claims dataset. bulkdata.uspto.gov
  • USPTO CPC Classification — Cooperative Patent Classification scheme for technology categorization. uspto.gov/cpc
  • SEC EDGAR — public filings cross-reference for assignee corporate entity matching. sec.gov/edgar
  • WIPO PATENTSCOPE — international patent context (related international filings). wipo.int/patentscope