Overall rank by patents
#47,386
of 49,997 tracked assignees
USPTO PatentsView assignee record - 5 granted patents across 5 technology areas, recorded in grant years 2017–2021. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H04L (Transmission OF Digital Information, e.g. Telegraphic Communication).
The verdict
According to USPTO PatentsView, Helium ranks #47,386 of 49,997 tracked US assignees by granted-patent volume, with 5 patents across 5 technology areas.
USPTO PatentsView assignee plate
Corpus R47386 · US Corporation #47,386 · 5 grants
GRANTS-MICRO · BOTTOM-DECILE · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-RICH · TYPE-USCORP · VEL-DOWN · BOOK-FULL
Nearest grant-volume peer: Heiwa Kagaku Industry Co., Ltd. (±0 grants)
Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.
Lowest and highest poles plus nearest Innovation Score peers, not a full corpus board reprint.
Qualcomm Incorporated · highest
85 score
Dupont Teijin… · near
25 score
Shenzhen Qianhai… · near
25 score
Helium Systems · this assignee
25 score
Joyin · near
25 score
Sega Sammy Creation · near
25 score
3D Lighting… · lowest
7 score
What this shows Helium's Innovation Score is 25.4/100 (17th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.
Helium Systems, Inc. is a focused PatentsView assignee: 5 CPC subclasses with 100% of grants classified under H04L (Transmission OF Digital Information, e.g. Telegraphic Communication). Peak complete grant year is 2019 (2 grants) versus a trough of 1 in 2017. By volume, Helium sits between Heiwa Kagaku Industry Co., Ltd. and Henry S. Owen LLC.
Granted US patents 2015–2025 versus its nearest-ranked assignees by volume, this company marked ◀
Heiwa Kagaku Industry Co., Ltd.
5 patents
Hekuma GMBH
5 patents
Heleng Inc.
5 patents
Helion Concepts, Inc.
5 patents
Helmer, Inc.
5 patents
Hemcon Medical Technologies, Inc.
5 patents
HEN Nozzles Inc.
5 patents
Henry S. Owen LLC
5 patents
Helium Systems, Inc.
5 patents
What this shows Helium holds 5 patents at rank #47,341, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.
By rank, the assignees closest to #47,341 in granted patent volume.
Other assignees with the most granted patents in Helium's primary technology class.
Two PlainPatent-derived peer sets for Helium, neither rank-band nor same-CPC leaders (those blocks stay above).
Nearest assignees by Innovation Score (25 here).
Helium's Innovation Score vs. every tracked assignee
Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)
25 17th percentile higher than 17% of 49,997 US assignees
Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.
Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025
Teal-shaded recent years (2020–present) versus the 2017–2019 baseline. Full figures in the table below.
| Year | Patents Granted | Share of Period |
|---|---|---|
| 2017 | 1 | 20.0% |
| 2019 | 2 | 40.0% |
| 2021 | 2 | 40.0% |
Top 5 of 5 technology areas
Overall rank by patents
#47,386
of 49,997 tracked assignees
25.4 out of 100
What to do with this data
Helium Systems, Inc.'s patent record in context - here's where to go next.
Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.
Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.