Where does Heiwa Kagaku Industry Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Heiwa Kagaku Industry Co., Ltd. ranks #47,380 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Heiwa Kagaku Industry Co., Ltd. hold?

Heiwa Kagaku Industry Co., Ltd. holds 5 US utility patents granted between 2019 and 2022, spanning 6 technology areas.

What is Heiwa Kagaku Industry Co., Ltd.'s Innovation Score?

Heiwa Kagaku Industry Co., Ltd. has an Innovation Score of 21.0 out of 100 (8th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Heiwa Kagaku Industry Co., Ltd.'s patent grant rate increasing or decreasing?

Heiwa Kagaku Industry Co., Ltd.'s recent grant velocity is +50% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Heiwa Kagaku Industry Co., Ltd.'s patents?

Heiwa Kagaku Industry Co., Ltd.'s patents average 7.4 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Heiwa Kagaku Industry Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Heiwa Kagaku Industry Co., Ltd.

Q: What technology areas does Heiwa Kagaku Industry Co., Ltd. focus on?

Heiwa Kagaku Industry Co., Ltd.'s top technology area is B29L (Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles) with 5 patents. Grants appear in 6 CPC subclasses total.

USPTO PatentsView assignee record - 5 granted patents across 6 technology areas, recorded in grant years 2019–2022. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B29L (Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Heiwa ranks #47,380 of 49,997 tracked US assignees by granted-patent volume, with 5 patents across 6 technology areas.

#47,380
of 49,997 US assignees by volume: 8th percentile
by Innovation Score (21.0/100): 7.4
avg claims per patent: +50%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R47380 · Foreign Corporation #47,380 · 5 grants

GRANTS-MICRO · BOTTOM-DECILE · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 5 grants
BOTTOM-DECILE #47,380/49,997
PHOTO-FINISH Hedgepath Pharmaceut…
CPC-NARROW B29L · 6 areas
INNOV-THIN 21.0/100
CLAIMS-SPARSE 7.4 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +50% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Hedgepath Pharmaceuticals, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Heiwa Kagaku Industry · this assignee

21
3D Lighting… · lowest

7

What this shows Heiwa's Innovation Score is 21.0/100 (8th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Heiwa's grants concentrate

Heiwa Kagaku Industry Co., Ltd. is a focused PatentsView assignee: 6 CPC subclasses with 100% of grants classified under B29L (Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles). Peak complete grant year is 2019 (2 grants) versus a trough of 1 in 2020. By volume, Heiwa sits between Hedgepath Pharmaceuticals, Inc. and Helium Systems, Inc..

Heiwa's three-year grant acceleration

Heiwa Kagaku Industry Co., Ltd. shows 1 grants in 2022–2024 against only 4 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Hedgepath Pharmac…

5
Hedinn HF

5
Hefei Gotion High…

5
Heinrich Georg Ma…

5
Hekuma

5
Heleng

5
Helion Concepts

5
Helium Systems

5
Heiwa Kagaku Indu… ◀

5

What this shows Heiwa holds 5 patents at rank #47,337, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Heiwa

By rank, the assignees closest to #47,337 in granted patent volume.

Leaders in B29L (Indexing Scheme Associated With Subclass B29c)

Other assignees with the most granted patents in Heiwa's primary technology class.

Heiwa's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

21 8th percentile higher than 8% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2019–2022

Grants by year

Teal-shaded recent years (2020–present) versus the 2019–2019 baseline. Full figures in the table below.

View data table

Heiwa Kagaku Industry Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2019	2	40.0%
2020	1	20.0%
2021	1	20.0%
2022	1	20.0%

Which technologies does Heiwa Kagaku Industry Co., Ltd. patent most?

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 5

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 5

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 5

B65D - Containers FOR Storage OR Transport OF Articles OR Materials, e.g. Bags, Barrels, Bottles, Boxes, Cans, Cartons, Crates, Drums, Jars, Tanks, Hoppers, Forwarding CONTAINERS; Accessories, Closures, OR Fittings THEREFOR; Packaging ELEMENTS; Packages 5

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 4

B05B - Spraying APPARATUS; Atomising APPARATUS; Nozzles 1

Top 6 of 6 technology areas

Where it ranks

Overall rank by patents

#47,380

of 49,997 tracked assignees

Innovation Score

21.0 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Heiwa Kagaku Industry Co., Ltd.'s patent record in context - here's where to go next.

Heiwa Kagaku Industry Co., Ltd.'s lead technology class is B29L (Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles), 100% of its portfolio - see every assignee active in that class. Explore B29L
Ranked #47,380 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Heiwa Kagaku Industry Co., Ltd. against Hedgepath Pharmaceuticals, Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 21.0/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.