Where does Hefei Eswin IC Technology Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hefei Eswin IC Technology Co., Ltd. ranks #47,372 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hefei Eswin IC Technology Co., Ltd. hold?

Hefei Eswin IC Technology Co., Ltd. holds 5 US utility patents granted between 2022 and 2024, spanning 6 technology areas.

What is Hefei Eswin IC Technology Co., Ltd.'s Innovation Score?

Hefei Eswin IC Technology Co., Ltd. has an Innovation Score of 45.2 out of 100 (top 24% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Hefei Eswin IC Technology Co., Ltd. focus on?

Hefei Eswin IC Technology Co., Ltd.'s top technology area is H03K (Pulse Technique) with 3 patents, ranking #608 of 1,682 assignees active in that subclass. Grants appear in 6 CPC subclasses total.

Is Hefei Eswin IC Technology Co., Ltd.'s patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for Hefei Eswin IC Technology Co., Ltd..

What does claim depth mean for Hefei Eswin IC Technology Co., Ltd.'s patents?

Hefei Eswin IC Technology Co., Ltd.'s patents average 17.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Hefei Eswin IC Technology Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Hefei Eswin IC Technology Co., Ltd.

USPTO PatentsView assignee record - 5 granted patents across 6 technology areas, recorded in grant years 2022–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H03K (Pulse Technique).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Hefei ranks #47,372 of 49,997 tracked US assignees by granted-patent volume, with 5 patents across 6 technology areas.

#47,372
of 49,997 US assignees by volume: Top 24%
by Innovation Score (45.2/100): 17.2
avg claims per patent

USPTO PatentsView assignee plate

Corpus R47372 · Foreign Corporation #47,372 · 5 grants

GRANTS-MICRO · BOTTOM-DECILE · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH

GRANTS-MICRO 5 grants
BOTTOM-DECILE #47,372/49,997
PHOTO-FINISH Heat X
CPC-NARROW H03K · 6 areas
INNOV-PAR 45.2/100
CLAIMS-RICH 17.2 claims/avg
TYPE-FRNCORP Foreign Corp
SPAN-YRS 2022–2024 · 3y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: Heat X, LLC (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Hefei’s 45.2 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 6.2 pts (14%) Velocity 20.0 pts (44%) Breadth 8.7 pts (19%) Claim depth 10.3 pts (23%)

Qualcomm Incorporated · highest

85
Hefei Eswin IC… · this assignee

45
3D Lighting… · lowest

7

What this shows Hefei's Innovation Score is 45.2/100 (top 24% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Hefei?

Each dot is one of Hefei’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Hefei’s own 17.2 claims/patent is ABOVE the 11.4 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Hefei vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Hefei's grants concentrate

Hefei Eswin IC Technology Co., Ltd. is a focused PatentsView assignee: 6 CPC subclasses with 60% of grants classified under H03K (Pulse Technique). Peak complete grant year is 2022 (2 grants) versus a trough of 1 in 2024. By volume, Hefei sits between Heat X, LLC and Heilux, LLC.

Hefei's three-year grant acceleration

Hefei Eswin IC Technology Co., Ltd. shows 5 grants in 2022–2024 against only 0 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Heat X

5
Heateflex

5
Hebei Minmetals

5
Heeling Sports

5
Hefei Lifeon Phar…

5
Heff Industries

5
Heidelberg Engine…

5
Heilux

5
Hefei Eswin IC Te… ◀

5

What this shows Hefei holds 5 patents at rank #47,483, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hefei

By rank, the assignees closest to #47,483 in granted patent volume.

Leaders in H03K (Pulse Technique)

Other assignees with the most granted patents in Hefei's primary technology class.

Hefei's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

45 Top 24% higher than 76% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2022–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2022–2019 baseline. Full figures in the table below.

View data table

Hefei Eswin IC Technology Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2022	2	40.0%
2023	2	40.0%
2024	1	20.0%

Which technologies does Hefei Eswin IC Technology Co., Ltd. patent most?

H03K - Pulse Technique 3

G09G - Arrangements OR Circuits FOR Control OF Indicating Devices Using Static Means TO Present Variable Information 2

H03L - Automatic Control, Starting, Synchronisation OR Stabilisation OF Generators OF Electronic Oscillations OR Pulses 1

H02M - Apparatus FOR Conversion Between AC AND AC, Between AC AND DC, OR Between DC AND DC, AND FOR USE With Mains OR Similar Power Supply SYSTEMS; Conversion OF DC OR AC Input Power Into Surge Output POWER; Control OR Regulation Thereof 1

H02H - Emergency Protective Circuit Arrangements 1

G05F - Systems FOR Regulating Electric OR Magnetic Variables 1

Top 6 of 6 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Hefei Eswin IC Technology Co., Ltd.'s patent record in context - here's where to go next.

Hefei Eswin IC Technology Co., Ltd.'s lead technology class is H03K (Pulse Technique), 60% of its portfolio - see every assignee active in that class. Explore H03K
Ranked #47,372 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Hefei Eswin IC Technology Co., Ltd. against Heat X, LLC, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 45.2/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.