Hconnect 2 GMBH
USPTO PatentsView assignee record - 10 granted patents across 9 technology areas, recorded in grant years 2020–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: C04B (Lime, MAGNESIA; SLAG; CEMENTS; Compositions Thereof, e.g. Mortars, Concrete OR Like Building MATERIALS; Artificial Stone ; Ceramics ; REFRACTORIES; Treatment OF Natural Stone).
The verdict
According to USPTO PatentsView, Hconnect ranks #26,449 of 49,997 tracked US assignees by granted-patent volume, with 10 patents across 9 technology areas.
- #26,449
- of 49,997 US assignees by volume
- Top 35%
- by Innovation Score (40.6/100)
- 25.4
- avg claims per patent
USPTO PatentsView assignee plate
Corpus R26449 · Foreign Corporation #26,449 · 10 grants
GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-DENSE · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH
- GRANTS-MICRO 10 grants
- MID-PACK #26,449/49,997
- PHOTO-FINISH Hangzhou Hikmicro…
- CPC-NARROW C04B · 9 areas
- INNOV-PAR 40.6/100
- CLAIMS-DENSE 25.4 claims/avg
- TYPE-FRNCORP Foreign Corp
- SPAN-YRS 2020–2024 · 5y
- BOOK-RICH 9/10 fields
Nearest grant-volume peer: Hangzhou Hikmicro Sensing Technology Co., Ltd. (±0 grants)
Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.
How Hconnect’s 40.6 Innovation Score adds up
The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.
Innovation-score neighbourhood around Hconnect
Lowest and highest poles plus nearest Innovation Score peers, not a full corpus board reprint.
- Qualcomm Incorporated · highest
Qualcomm Incorporated · highest
85 score
- Hconnect 2 · this assignee
Hconnect 2 · this assignee
41 score
- 3D Lighting… · lowest 7
3D Lighting… · lowest
7 score
What this shows Hconnect's Innovation Score is 40.6/100 (top 35% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.
Does more volume mean deeper claims for Hconnect?
Each dot is one of Hconnect’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Hconnect’s own 25.4 claims/patent is ABOVE the 7.7 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.
Where Hconnect's grants concentrate
Hconnect 2 GMBH is a focused PatentsView assignee: 9 CPC subclasses with 100% of grants classified under C04B (Lime, MAGNESIA; SLAG; CEMENTS; Compositions Thereof, e.g. Mortars, Concrete OR Like Building MATERIALS; Artificial Stone ; Ceramics ; REFRACTORIES; Treatment OF Natural Stone). Peak complete grant year is 2021 (4 grants) versus a trough of 1 in 2020. By volume, Hconnect sits between Hangzhou Hikmicro Sensing Technology Co., Ltd. and Healcerion Co., Ltd..
Hconnect's three-year grant acceleration
Hconnect 2 GMBH shows 5 grants in 2022–2024 against only 5 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.
Who files at Hconnect's volume?
Granted US patents 2015–2025 versus its nearest-ranked assignees by volume, this company marked ◀
- Hangzhou Hikmicro…
Hangzhou Hikmicro Sensing Technology Co., Ltd.
10 patents
- Hangzhou Lingban…
Hangzhou Lingban Technology Co. Ltd.
10 patents
- Hangzhou Qulian T…
Hangzhou Qulian Technology Co., Ltd.
10 patents
- Hangzhou Virtual…
Hangzhou Virtual AND Reality Technology Co., Ltd.
10 patents
- HCW Biologics
HCW Biologics, Inc.
10 patents
- HD Networks
HD Networks, LLC
10 patents
- Hdwb
Hdwb, LLC
10 patents
- Healcerion
Healcerion Co., Ltd.
10 patents
- Hconnect 2 ◀
Hconnect 2 GMBH
10 patents
What this shows Hconnect holds 10 patents at rank #26,428, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.
Companies ranked near Hconnect
By rank, the assignees closest to #26,428 in granted patent volume.
- Hangzhou Hikmicro Sensing Technology Co., Ltd. #26,424 · 10 patents
- Hangzhou Lingban Technology Co. Ltd. #26,425 · 10 patents
- Hangzhou Qulian Technology Co., Ltd. #26,426 · 10 patents
- Hangzhou Virtual AND Reality Technology Co., Ltd. #26,427 · 10 patents
- HCW Biologics, Inc. #26,429 · 10 patents
- HD Networks, LLC #26,430 · 10 patents
- Hdwb, LLC #26,431 · 10 patents
- Healcerion Co., Ltd. #26,432 · 10 patents
Leaders in C04B (Lime)
Other assignees with the most granted patents in Hconnect's primary technology class.
- NGK Insulators, Ltd. 451 in class
- Halliburton Energy Services, Inc. 417 in class
- Saudi Arabian OIL Company 271 in class
- Corning Incorporated 262 in class
- TDK Corporation 164 in class
- Rolls-Royce Corporation 135 in class
- United States Gypsum Company 132 in class
- Mitsubishi Materials Corporation 129 in class
Hconnect's Innovation Score vs. every tracked assignee
Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)
41 Top 35% higher than 65% of 49,997 US assignees
Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.
Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025
Grants by year
Teal-shaded recent years (2020–present) versus the 2020–2019 baseline. Full figures in the table below.
View data table
| Year | Patents Granted | Share of Period |
|---|---|---|
| 2020 | 1 | 10.0% |
| 2021 | 4 | 40.0% |
| 2022 | 1 | 10.0% |
| 2023 | 3 | 30.0% |
| 2024 | 1 | 10.0% |
Which technologies does Hconnect 2 GMBH patent most?
Top 9 of 9 technology areas
Data Source
USPTO PatentsView, US granted patents 2015–2025
What to do with this data
Hconnect 2 GMBH's patent record in context - here's where to go next.
- Hconnect 2 GMBH's lead technology class is C04B (Lime, MAGNESIA; SLAG; CEMENTS; Compositions Thereof, e.g. Mortars, Concrete OR Like Building MATERIALS; Artificial Stone ; Ceramics ; REFRACTORIES; Treatment OF Natural Stone), 100% of its portfolio - see every assignee active in that class. Explore C04B
- Ranked #26,449 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
- Compare Hconnect 2 GMBH against Hangzhou Hikmicro Sensing Technology Co., Ltd., an assignee filing at a similar volume. Compare portfolios
- Innovation Score of 40.6/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated
Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.
Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.