Where does Essentium Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Essentium Inc. ranks #19,734 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Essentium Inc. hold?

Essentium Inc. holds 14 US utility patents granted between 2020 and 2022, spanning 14 technology areas.

What is Essentium Inc.'s Innovation Score?

Essentium Inc. has an Innovation Score of 37.4 out of 100 (top 44% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Essentium Inc.'s patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for Essentium Inc..

What does claim depth mean for Essentium Inc.'s patents?

Essentium Inc.'s patents average 16.4 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Essentium Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Essentium Inc.

Q: What technology areas does Essentium Inc. focus on?

Essentium Inc.'s top technology area is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing) with 10 patents, ranking #607 of 4,378 assignees active in that subclass. Grants appear in 14 CPC subclasses total.

USPTO PatentsView assignee record - 14 granted patents across 14 technology areas, recorded in grant years 2020–2022. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Essentium ranks #19,734 of 49,997 tracked US assignees by granted-patent volume, with 14 patents across 14 technology areas.

#19,734
of 49,997 US assignees by volume: Top 44%
by Innovation Score (37.4/100): 16.4
avg claims per patent

USPTO PatentsView assignee plate

Corpus R19734 · US Corporation #19,734 · 14 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-RICH · TYPE-USCORP · SPAN-YRS · BOOK-RICH

GRANTS-MICRO 14 grants
MID-PACK #19,734/49,997
PHOTO-FINISH Epitel
CPC-FOCUS B29C · 14 areas
INNOV-THIN 37.4/100
CLAIMS-RICH 16.4 claims/avg
TYPE-USCORP US Corporation
SPAN-YRS 2020–2022 · 3y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: Epitel, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Essentium’s 37.4 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 9.4 pts (25%) Velocity 5.0 pts (13%) Breadth 13.2 pts (35%) Claim depth 9.9 pts (26%)

Qualcomm Incorporated · highest

85
Essentium · this assignee

37
3D Lighting… · lowest

7

What this shows Essentium's Innovation Score is 37.4/100 (top 44% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Essentium?

Each dot is one of Essentium’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Essentium’s own 16.4 claims/patent is ABOVE the 16.3 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Essentium vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Essentium's grants concentrate

Essentium Inc. is a focused PatentsView assignee: 14 CPC subclasses with 71.4% of grants classified under B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing). Peak complete grant year is 2022 (6 grants) versus a trough of 3 in 2020. By volume, Essentium sits between Epitel, Inc. and Evans Consoles Corporation.

Essentium's three-year grant acceleration

Essentium Inc. shows 6 grants in 2022–2024 against only 8 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Epitel

14
Epoca Internation…

14
Erdman Automation

14
Eriez Manufacturi…

14
Etablissements Ca…

14
Euclid Discoveries

14
Euclid Techlabs

14
Evans Consoles

14
Essentium ◀

14

What this shows Essentium holds 14 patents at rank #19,744, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Essentium

By rank, the assignees closest to #19,744 in granted patent volume.

Leaders in B29C (Shaping OR Joining OF Plastics)

Other assignees with the most granted patents in Essentium's primary technology class.

Essentium's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

37 Top 44% higher than 56% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2020–2022

Grants by year

Teal-shaded recent years (2020–present) versus the 2020–2019 baseline. Full figures in the table below.

View data table

Essentium Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2020	3	21.4%
2021	5	35.7%
2022	6	42.9%

Which technologies does Essentium Inc. patent most?

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 10

B33Y - Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering 9

C08J - WORKING-UP; General Processes OF COMPOUNDING; After-treatment NOT Covered BY Subclasses C08b, C08c, C08f, C08g or C08h 3

C08L - Compositions OF Macromolecular Compounds 3

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 2

C08F - Macromolecular Compounds Obtained BY Reactions Only Involving Carbon-to-carbon Unsaturated Bonds 2

C09D - Coating Compositions, e.g. Paints, Varnishes OR LACQUERS; Filling PASTES; Chemical Paint OR INK REMOVERS; INKS; Correcting FLUIDS; WOODSTAINS; Pastes OR Solids FOR Colouring OR PRINTING; USE OF Materials Therefor 2

B82Y - Specific Uses OR Applications OF NANOSTRUCTURES; Measurement OR Analysis OF NANOSTRUCTURES; Manufacture OR Treatment OF Nanostructures 2

B65H - Handling Thin OR Filamentary Material, e.g. Sheets, Webs, Cables 1

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 1

C08B - POLYSACCHARIDES; Derivatives Thereof 1

H05B - Electric HEATING; Electric Light Sources NOT Otherwise Provided FOR; Circuit Arrangements FOR Electric Light Sources, IN General 1

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 1

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 1

Top 14 of 14 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Essentium Inc.'s patent record in context - here's where to go next.

Essentium Inc.'s lead technology class is B29C (Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing), 71.4% of its portfolio - see every assignee active in that class. Explore B29C
Ranked #19,734 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Essentium Inc. against Epitel, Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 37.4/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.