Where does Ecole Nationale Superieure D'arts ET Metiers (ENSAM) rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Ecole Nationale Superieure D'arts ET Metiers (ENSAM) ranks #28,634 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Ecole Nationale Superieure D'arts ET Metiers (ENSAM) hold?

Ecole Nationale Superieure D'arts ET Metiers (ENSAM) holds 9 US utility patents granted between 2015 and 2025, spanning 22 technology areas.

What is Ecole Nationale Superieure D'arts ET Metiers (ENSAM)'s Innovation Score?

Ecole Nationale Superieure D'arts ET Metiers (ENSAM) has an Innovation Score of 42.1 out of 100 (top 31% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Ecole Nationale Superieure D'arts ET Metiers (ENSAM)'s patent grant rate increasing or decreasing?

Ecole Nationale Superieure D'arts ET Metiers (ENSAM)'s recent grant velocity is +100% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Ecole Nationale Superieure D'arts ET Metiers (ENSAM)'s patents?

Ecole Nationale Superieure D'arts ET Metiers (ENSAM)'s patents average 12.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Ecole Nationale Superieure D'arts ET Metiers (ENSAM)

Q: What technology areas does Ecole Nationale Superieure D'arts ET Metiers (ENSAM) focus on?

Ecole Nationale Superieure D'arts ET Metiers (ENSAM)'s top technology area is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering) with 1 patents. Grants appear in 22 CPC subclasses total.

Q: How is the Ecole Nationale Superieure D'arts ET Metiers (ENSAM) patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO PatentsView assignee record - 9 granted patents across 22 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Ecole ranks #28,634 of 49,997 tracked US assignees by granted-patent volume, with 9 patents across 22 technology areas.

#28,634
of 49,997 US assignees by volume: Top 31%
by Innovation Score (42.1/100): 12.7
avg claims per patent: +100%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R28634 · Foreign Corporation #28,634 · 9 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-RICH · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 9 grants
MID-PACK #28,634/49,997
PHOTO-FINISH ECC TEC MSJ…
CPC-FOCUS B33Y · 22 areas
INNOV-PAR 42.1/100
CLAIMS-RICH 12.7 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +100% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: ECC TEC MSJ Incorporated (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Ecole Nationale… · this assignee

42
3D Lighting… · lowest

7

What this shows Ecole's Innovation Score is 42.1/100 (top 31% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Ecole's grants concentrate

Ecole Nationale Superieure D'arts ET Metiers (ENSAM) is a focused PatentsView assignee: 22 CPC subclasses with 11.1% of grants classified under B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ). By volume, Ecole sits between ECC TEC MSJ Incorporated and Eggtronic Engineering S.P.A..

Ecole's three-year grant acceleration

Ecole Nationale Superieure D'arts ET Metiers (ENSAM) shows 3 grants in 2022–2024 against only 2 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

ECC TEC MSJ Incor…

9
Echowell

9
ECI Pharmaceutica…

9
Ecole Centrale DE…

9
Economic Alchemy

9
Edgewise Therapeu…

9
Edward Vinson

9
Eggtronic Enginee…

9
Ecole Nationale S… ◀

9

What this shows Ecole holds 9 patents at rank #28,623, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Ecole

By rank, the assignees closest to #28,623 in granted patent volume.

Leaders in B33Y (Additive Manufacturing)

Other assignees with the most granted patents in Ecole's primary technology class.

Ecole's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

42 Top 31% higher than 69% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Ecole Nationale Superieure D'arts ET Metiers (ENSAM) patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	1	11.1%
2019	1	11.1%
2020	1	11.1%
2022	1	11.1%
2023	1	11.1%
2024	1	11.1%
2025partial year	3	33.3%

Which technologies does Ecole Nationale Superieure D'arts ET Metiers (ENSAM) patent most?

B33Y - Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering 1

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 1

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 1

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 1

H10N - Electric Solid-state Devices NOT Otherwise Provided FOR 1

H02M - Apparatus FOR Conversion Between AC AND AC, Between AC AND DC, OR Between DC AND DC, AND FOR USE With Mains OR Similar Power Supply SYSTEMS; Conversion OF DC OR AC Input Power Into Surge Output POWER; Control OR Regulation Thereof 1

H02N - Electric Machines NOT Otherwise Provided FOR 1

B26D - CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing 1

B26F - PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; Severing BY Means Other Than Cutting 1

B23C - Milling 1

B23B - TURNING; Boring 1

Y10T - Technical Subjects Covered BY Former US Classification 1

B23Q - Details, Components, OR Accessories FOR Machine Tools, e.g. Arrangements FOR Copying OR Controlling ; Machine Tools IN General Characterised BY THE Construction OF Particular Details OR COMPONENTS; Combinations OR Associations OF Metal-working Machines, NOT Directed TO A Particular Result 1

G01N - Investigating OR Analysing Materials BY Determining Their Chemical OR Physical Properties 1

H01S - Devices Using THE Process OF Light Amplification BY Stimulated Emission OF Radiation [LASER] TO Amplify OR Generate LIGHT; Devices Using Stimulated Emission OF Electromagnetic Radiation IN Wave Ranges Other Than Optical 1

Top 15 of 22 technology areas

Where it ranks

Overall rank by patents

#28,634

of 49,997 tracked assignees

Innovation Score

42.1 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Ecole Nationale Superieure D'arts ET Metiers (ENSAM)'s patent record in context - here's where to go next.

Ecole Nationale Superieure D'arts ET Metiers (ENSAM)'s lead technology class is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ), 11.1% of its portfolio - see every assignee active in that class. Explore B33Y
Ranked #28,634 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Ecole Nationale Superieure D'arts ET Metiers (ENSAM) against ECC TEC MSJ Incorporated, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 42.1/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.