Where does Dai-ichi High Frequency Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Dai-ichi High Frequency Co., Ltd. ranks #26,089 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Dai-ichi High Frequency Co., Ltd. hold?

Dai-ichi High Frequency Co., Ltd. holds 10 US utility patents granted between 2019 and 2025, spanning 14 technology areas.

What is Dai-ichi High Frequency Co., Ltd.'s Innovation Score?

Dai-ichi High Frequency Co., Ltd. has an Innovation Score of 31.5 out of 100 (38th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Dai-ichi High Frequency Co., Ltd.'s patent grant rate increasing or decreasing?

Dai-ichi High Frequency Co., Ltd.'s recent grant velocity is +700% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Dai-ichi High Frequency Co., Ltd.'s patents?

Dai-ichi High Frequency Co., Ltd.'s patents average 7.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Dai-ichi High Frequency Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Dai-ichi High Frequency Co., Ltd.

Q: What technology areas does Dai-ichi High Frequency Co., Ltd. focus on?

Dai-ichi High Frequency Co., Ltd.'s top technology area is H05B (Electric HEATING; Electric Light Sources NOT Otherwise Provided FOR; Circuit Arrangements FOR Electric Light Sources, IN General) with 6 patents, ranking #508 of 2,247 assignees active in that subclass. Grants appear in 14 CPC subclasses total.

USPTO PatentsView assignee record - 10 granted patents across 14 technology areas, recorded in grant years 2019–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H05B (Electric HEATING; Electric Light Sources NOT Otherwise Provided FOR; Circuit Arrangements FOR Electric Light Sources, IN General).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Dai-ichi ranks #26,089 of 49,997 tracked US assignees by granted-patent volume, with 10 patents across 14 technology areas.

#26,089
of 49,997 US assignees by volume: 38th percentile
by Innovation Score (31.5/100): 7.7
avg claims per patent: +700%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R26089 · Foreign Corporation #26,089 · 10 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 10 grants
MID-PACK #26,089/49,997
PHOTO-FINISH Cypher Medical
CPC-FOCUS H05B · 14 areas
INNOV-THIN 31.5/100
CLAIMS-SPARSE 7.7 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +700% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Cypher Medical, LLC (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Dai-ichi’s 31.5 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 8.3 pts (26%) Velocity 5.3 pts (17%) Breadth 13.2 pts (42%) Claim depth 4.6 pts (15%)

Qualcomm Incorporated · highest

85
Dai-ichi High… · this assignee

31
3D Lighting… · lowest

7

What this shows Dai-ichi's Innovation Score is 31.5/100 (38th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Dai-ichi?

Each dot is one of Dai-ichi’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Dai-ichi’s own 7.7 claims/patent is at or below the 16.7 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Dai-ichi vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Dai-ichi's grants concentrate

Dai-ichi High Frequency Co., Ltd. is a focused PatentsView assignee: 14 CPC subclasses with 60% of grants classified under H05B (Electric HEATING; Electric Light Sources NOT Otherwise Provided FOR; Circuit Arrangements FOR Electric Light Sources, IN General). Peak complete grant year is 2020 (3 grants) versus a trough of 1 in 2019. By volume, Dai-ichi sits between Cypher Medical, LLC and Dalian Rongkepower Co., Ltd.

Dai-ichi's three-year grant acceleration

Dai-ichi High Frequency Co., Ltd. shows 4 grants in 2022–2024 against only 5 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Cypher Medical

10
Cysbio Aps

10
Dadesystems

10
Daehan Solution

10
Dainese S P A

10
Daiwa House Indus…

10
DAK Americas

10
Dalian Rongkepower

10
Dai-ichi High Fre… ◀

10

What this shows Dai-ichi holds 10 patents at rank #26,087, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Dai-ichi

By rank, the assignees closest to #26,087 in granted patent volume.

Leaders in H05B (Electric Heating)

Other assignees with the most granted patents in Dai-ichi's primary technology class.

Dai-ichi's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

31 38th percentile higher than 38% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2019–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2019–2019 baseline. Full figures in the table below.

View data table

Dai-ichi High Frequency Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2019	1	10.0%
2020	3	30.0%
2021	1	10.0%
2022	1	10.0%
2023	3	30.0%
2025partial year	1	10.0%

Which technologies does Dai-ichi High Frequency Co., Ltd. patent most?

H05B - Electric HEATING; Electric Light Sources NOT Otherwise Provided FOR; Circuit Arrangements FOR Electric Light Sources, IN General 6

H01F - MAGNETS; INDUCTANCES; TRANSFORMERS; Selection OF Materials FOR Their Magnetic Properties 5

C22C - Alloys 4

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 4

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 3

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 3

A61N - ELECTROTHERAPY; MAGNETOTHERAPY; Radiation THERAPY; Ultrasound Therapy 2

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 2

C21D - Modifying THE Physical Structure OF Ferrous METALS; General Devices FOR Heat Treatment OF Ferrous OR Non-ferrous Metals OR ALLOYS; Making Metal Malleable, e.g. BY Decarburisation OR Tempering 2

C01P - Indexing Scheme Relating TO Structural AND Physical Aspects OF Solid Inorganic Compounds 2

B01J - Chemical OR Physical Processes, e.g. Catalysis OR Colloid CHEMISTRY; Their Relevant Apparatus 2

C01G - Compounds Containing Metals NOT Covered BY Subclasses C01d OR C01f 2

F27D - Details OR Accessories OF Furnaces, Kilns, Ovens OR Retorts, IN SO FAR AS They ARE OF Kinds Occurring IN More Than ONE Kind OF Furnace 1

G01B - Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours 1

Top 14 of 14 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Dai-ichi High Frequency Co., Ltd.'s patent record in context - here's where to go next.

Dai-ichi High Frequency Co., Ltd.'s lead technology class is H05B (Electric HEATING; Electric Light Sources NOT Otherwise Provided FOR; Circuit Arrangements FOR Electric Light Sources, IN General), 60% of its portfolio - see every assignee active in that class. Explore H05B
Ranked #26,089 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Dai-ichi High Frequency Co., Ltd. against Cypher Medical, LLC, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 31.5/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.