Where does Bond High Performance 3D Technology B.V. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Bond High Performance 3D Technology B.V. ranks #34,557 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Bond High Performance 3D Technology B.V. hold?

Bond High Performance 3D Technology B.V. holds 7 US utility patents granted between 2021 and 2024, spanning 5 technology areas.

What is Bond High Performance 3D Technology B.V.'s Innovation Score?

Bond High Performance 3D Technology B.V. has an Innovation Score of 30.4 out of 100 (34th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Bond High Performance 3D Technology B.V.'s patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for Bond High Performance 3D Technology B.V..

What does claim depth mean for Bond High Performance 3D Technology B.V.'s patents?

Bond High Performance 3D Technology B.V.'s patents average 21.1 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Bond High Performance 3D Technology B.V. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Bond High Performance 3D Technology B.V.

Q: What technology areas does Bond High Performance 3D Technology B.V. focus on?

Bond High Performance 3D Technology B.V.'s top technology area is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering) with 7 patents, ranking #237 of 1,250 assignees active in that subclass. Grants appear in 5 CPC subclasses total.

USPTO PatentsView assignee record - 7 granted patents across 5 technology areas, recorded in grant years 2021–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Bond ranks #34,557 of 49,997 tracked US assignees by granted-patent volume, with 7 patents across 5 technology areas.

#34,557
of 49,997 US assignees by volume: 34th percentile
by Innovation Score (30.4/100): 21.1
avg claims per patent

USPTO PatentsView assignee plate

Corpus R34557 · Foreign Corporation #34,557 · 7 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-DENSE · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH

GRANTS-MICRO 7 grants
MID-PACK #34,557/49,997
PHOTO-FINISH Blueprint Acoustics…
CPC-NARROW B33Y · 5 areas
INNOV-THIN 30.4/100
CLAIMS-DENSE 21.1 claims/avg
TYPE-FRNCORP Foreign Corp
SPAN-YRS 2021–2024 · 4y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: Blueprint Acoustics PTY Ltd (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Bond’s 30.4 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 7.2 pts (24%) Velocity 2.7 pts (9%) Breadth 7.9 pts (26%) Claim depth 12.7 pts (42%)

Qualcomm Incorporated · highest

85
Bond High Performanc… · this assignee

30
3D Lighting… · lowest

7

What this shows Bond's Innovation Score is 30.4/100 (34th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Bond?

Each dot is one of Bond’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Bond’s own 21.1 claims/patent is ABOVE the 13.6 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Bond vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Bond's grants concentrate

Bond High Performance 3D Technology B.V. is a focused PatentsView assignee: 5 CPC subclasses with 100% of grants classified under B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ). Peak complete grant year is 2021 (5 grants) versus a trough of 1 in 2023. By volume, Bond sits between Blueprint Acoustics PTY Ltd and Briefcam Ltd..

Bond's three-year grant acceleration

Bond High Performance 3D Technology B.V. shows 2 grants in 2022–2024 against only 5 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Blueprint Acousti…

7
BNR Technology De…

7
Bnsoft

7
Boehlerit & KG

7
Boostheat

7
BP Pulse Fleet No…

7
Bridon Internatio…

7
Briefcam

7
Bond High Perform… ◀

7

What this shows Bond holds 7 patents at rank #34,470, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Bond

By rank, the assignees closest to #34,470 in granted patent volume.

Leaders in B33Y (Additive Manufacturing)

Other assignees with the most granted patents in Bond's primary technology class.

Bond's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

30 34th percentile higher than 34% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2021–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2021–2019 baseline. Full figures in the table below.

View data table

Bond High Performance 3D Technology B.V. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2021	5	71.4%
2023	1	14.3%
2024	1	14.3%

Which technologies does Bond High Performance 3D Technology B.V. patent most?

B33Y - Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering 7

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 7

C25D - Processes FOR THE Electrolytic OR Electrophoretic Production OF COATINGS; ELECTROFORMING; Apparatus Therefor 2

G06F - Electric Digital Data Processing 2

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 1

Top 5 of 5 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Bond High Performance 3D Technology B.V.'s patent record in context - here's where to go next.

Bond High Performance 3D Technology B.V.'s lead technology class is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ), 100% of its portfolio - see every assignee active in that class. Explore B33Y
Ranked #34,557 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Bond High Performance 3D Technology B.V. against Blueprint Acoustics PTY Ltd, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 30.4/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.