Where does Bond Formwork Systems, LLC rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Bond Formwork Systems, LLC ranks #25,907 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Bond Formwork Systems, LLC hold?

Bond Formwork Systems, LLC holds 10 US utility patents granted between 2020 and 2025, spanning 1 technology areas.

What is Bond Formwork Systems, LLC's Innovation Score?

Bond Formwork Systems, LLC has an Innovation Score of 32.5 out of 100 (41st percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Bond Formwork Systems, LLC's patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for Bond Formwork Systems, LLC.

What does claim depth mean for Bond Formwork Systems, LLC's patents?

Bond Formwork Systems, LLC's patents average 15.9 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Bond Formwork Systems, LLC patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Bond Formwork Systems, LLC

Q: What technology areas does Bond Formwork Systems, LLC focus on?

Bond Formwork Systems, LLC's top technology area is E04G (SCAFFOLDING; FORMS; SHUTTERING; Building Implements OR Aids, OR Their USE; Handling Building Materials ON THE SITE; Repairing, Breaking-up OR Other Work ON Existing Buildings) with 10 patents, ranking #19 of 310 assignees active in that subclass. Grants appear in 1 CPC subclasses total.

USPTO PatentsView assignee record - 10 granted patents across 1 technology areas, recorded in grant years 2020–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: E04G (SCAFFOLDING; FORMS; SHUTTERING; Building Implements OR Aids, OR Their USE; Handling Building Materials ON THE SITE; Repairing, Breaking-up OR Other Work ON Existing Buildings).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Bond ranks #25,907 of 49,997 tracked US assignees by granted-patent volume, with 10 patents across 1 technology areas.

#25,907
of 49,997 US assignees by volume: 41st percentile
by Innovation Score (32.5/100): 15.9
avg claims per patent

USPTO PatentsView assignee plate

Corpus R25907 · US Corporation #25,907 · 10 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-RICH · TYPE-USCORP · SPAN-YRS · BOOK-RICH

GRANTS-MICRO 10 grants
MID-PACK #25,907/49,997
PHOTO-FINISH Blue Skies Global
CPC-NARROW E04G · 1 areas
INNOV-THIN 32.5/100
CLAIMS-RICH 15.9 claims/avg
TYPE-USCORP US Corporation
SPAN-YRS 2020–2025 · 6y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: Blue Skies Global LLC (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Bond’s 32.5 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 8.3 pts (26%) Velocity 11.1 pts (34%) Breadth 3.5 pts (11%) Claim depth 9.5 pts (29%)

Qualcomm Incorporated · highest

85
Bond Formwork Systems · this assignee

32
3D Lighting… · lowest

7

What this shows Bond's Innovation Score is 32.5/100 (41st percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Bond?

Each dot is one of Bond’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Bond’s own 15.9 claims/patent is ABOVE the 15.0 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Bond vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Bond's grants concentrate

Bond Formwork Systems, LLC is a focused PatentsView assignee: 1 CPC subclasses with 100% of grants classified under E04G (SCAFFOLDING; FORMS; SHUTTERING; Building Implements OR Aids, OR Their USE; Handling Building Materials ON THE SITE; Repairing, Breaking-up OR Other Work ON Existing Buildings). Peak complete grant year is 2021 (2 grants) versus a trough of 1 in 2020. By volume, Bond sits between Blue Skies Global LLC and Boveda Inc..

Bond's three-year grant acceleration

Bond Formwork Systems, LLC shows 5 grants in 2022–2024 against only 3 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Blue Skies Global

10
Bluedata Software

10
Bocks

10
Bodymedia

10
Booginhead

10
Boreal Genomics

10
Bosch Rexroth

10
Boveda

10
Bond Formwork Sys… ◀

10

What this shows Bond holds 10 patents at rank #25,922, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Bond

By rank, the assignees closest to #25,922 in granted patent volume.

Leaders in E04G (Scaffolding)

Other assignees with the most granted patents in Bond's primary technology class.

Bond's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

32 41st percentile higher than 41% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2020–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2020–2019 baseline. Full figures in the table below.

View data table

Bond Formwork Systems, LLC patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2020	1	10.0%
2021	2	20.0%
2022	2	20.0%
2023	1	10.0%
2024	2	20.0%
2025partial year	2	20.0%

Which technologies does Bond Formwork Systems, LLC patent most?

E04G - SCAFFOLDING; FORMS; SHUTTERING; Building Implements OR Aids, OR Their USE; Handling Building Materials ON THE SITE; Repairing, Breaking-up OR Other Work ON Existing Buildings 10

Top 1 of 1 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Bond Formwork Systems, LLC's patent record in context - here's where to go next.

Bond Formwork Systems, LLC's lead technology class is E04G (SCAFFOLDING; FORMS; SHUTTERING; Building Implements OR Aids, OR Their USE; Handling Building Materials ON THE SITE; Repairing, Breaking-up OR Other Work ON Existing Buildings), 100% of its portfolio - see every assignee active in that class. Explore E04G
Ranked #25,907 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Bond Formwork Systems, LLC against Blue Skies Global LLC, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 32.5/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.