USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Beijing Aerospace Institute FOR Metrology AND Measurement Technology

Q: Where does Beijing Aerospace Institute FOR Metrology AND Measurement Technology rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Beijing Aerospace Institute FOR Metrology AND Measurement Technology ranks #28,217 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

Q: Is Beijing Aerospace Institute FOR Metrology AND Measurement Technology's patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for Beijing Aerospace Institute FOR Metrology AND Measurement Technology.

Q: How is the Beijing Aerospace Institute FOR Metrology AND Measurement Technology patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO PatentsView assignee record - 9 granted patents across 16 technology areas, recorded in grant years 2020–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: G01B (Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Beijing ranks #28,217 of 49,997 tracked US assignees by granted-patent volume, with 9 patents across 16 technology areas.

#28,217
of 49,997 US assignees by volume: Top 22%
by Innovation Score (45.8/100): 6.2
avg claims per patent

USPTO PatentsView assignee plate

Corpus R28217 · Foreign Corporation #28,217 · 9 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-PAR · CLAIMS-SPARSE · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH

GRANTS-MICRO 9 grants
MID-PACK #28,217/49,997
PHOTO-FINISH Banza Stamping…
CPC-FOCUS G01B · 16 areas
INNOV-PAR 45.8/100
CLAIMS-SPARSE 6.2 claims/avg
TYPE-FRNCORP Foreign Corp
SPAN-YRS 2020–2025 · 6y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: Banza Stamping Industry Corporation (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Beijing’s 45.8 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 8.0 pts (17%) Velocity 20.0 pts (44%) Breadth 14.1 pts (31%) Claim depth 3.7 pts (8%)

Qualcomm Incorporated · highest

85
Beijing Aerospace… · this assignee

46
3D Lighting… · lowest

7

What this shows Beijing's Innovation Score is 45.8/100 (top 22% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Beijing?

Each dot is one of Beijing’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Beijing’s own 6.2 claims/patent is at or below the 6.6 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Beijing vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Beijing's grants concentrate

Beijing Aerospace Institute FOR Metrology AND Measurement Technology is a focused PatentsView assignee: 16 CPC subclasses with 33.3% of grants classified under G01B (Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours). Peak complete grant year is 2024 (5 grants) versus a trough of 1 in 2020. By volume, Beijing sits between Banza Stamping Industry Corporation and Beijing Tsingmicro Intelligent Technology Co., Ltd..

Beijing's three-year grant acceleration

Beijing Aerospace Institute FOR Metrology AND Measurement Technology shows 6 grants in 2022–2024 against only 1 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Banza Stamping In…

9
Baotou Research I…

9
BBB

9
Beacon Lighting I…

9
Beijing CHJ Autom…

9
Beijing Edifier T…

9
Beijing Orion Sta…

9
Beijing Tsingmicr…

9
Beijing Aerospace… ◀

9

What this shows Beijing holds 9 patents at rank #28,205, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Beijing

By rank, the assignees closest to #28,205 in granted patent volume.

Leaders in G01B (Measuring Length)

Other assignees with the most granted patents in Beijing's primary technology class.

Beijing's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

46 Top 22% higher than 78% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2020–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2020–2019 baseline. Full figures in the table below.

View data table

Beijing Aerospace Institute FOR Metrology AND Measurement Technology patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2020	1	11.1%
2022	1	11.1%
2024	5	55.6%
2025partial year	2	22.2%

Which technologies does Beijing Aerospace Institute FOR Metrology AND Measurement Technology patent most?

G01B - Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours 3

G01S - Radio DIRECTION-FINDING; Radio NAVIGATION; Determining Distance OR Velocity BY USE OF Radio WAVES; Locating OR Presence-detecting BY USE OF THE Reflection OR Reradiation OF Radio WAVES; Analogous Arrangements Using Other Waves 3

G01M - Testing Static OR Dynamic Balance OF Machines OR STRUCTURES; Testing OF Structures OR Apparatus, NOT Otherwise Provided FOR 2

G06F - Electric Digital Data Processing 1

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 1

B64G - COSMONAUTICS; Vehicles OR Equipment Therefor 1

G01C - Measuring Distances, Levels OR BEARINGS; SURVEYING; NAVIGATION; Gyroscopic INSTRUMENTS; Photogrammetry OR Videogrammetry 1

F01D - Non-positive Displacement Machines OR Engines, e.g. Steam Turbines 1

F05D - Indexing Scheme FOR Aspects Relating TO Non-positive-displacement Machines OR Engines, Gas-turbines OR Jet-propulsion Plants 1

G06T - Image Data Processing OR Generation, IN General 1

Y02A - Technologies FOR Adaptation TO Climate Change 1

G01L - Measuring Force, Stress, Torque, Work, Mechanical Power, Mechanical Efficiency, OR Fluid Pressure 1

G01G - Weighing 1

G04F - Time-interval Measuring 1

H01S - Devices Using THE Process OF Light Amplification BY Stimulated Emission OF Radiation [LASER] TO Amplify OR Generate LIGHT; Devices Using Stimulated Emission OF Electromagnetic Radiation IN Wave Ranges Other Than Optical 1

Top 15 of 16 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Beijing Aerospace Institute FOR Metrology AND Measurement Technology's patent record in context - here's where to go next.

Beijing Aerospace Institute FOR Metrology AND Measurement Technology's lead technology class is G01B (Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours), 33.3% of its portfolio - see every assignee active in that class. Explore G01B
Ranked #28,217 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Beijing Aerospace Institute FOR Metrology AND Measurement Technology against Banza Stamping Industry Corporation, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 45.8/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.