Where does Tongtai Machine & Tool Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Tongtai Machine & Tool Co., Ltd. ranks #27,663 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Tongtai Machine & Tool Co., Ltd. hold?

Tongtai Machine & Tool Co., Ltd. holds 10 US utility patents granted between 2017 and 2021, spanning 16 technology areas.

What is Tongtai Machine & Tool Co., Ltd.'s Innovation Score?

Tongtai Machine & Tool Co., Ltd. has an Innovation Score of 27.4 out of 100 (23rd percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Tongtai Machine & Tool Co., Ltd.'s patent grant rate increasing or decreasing?

Tongtai Machine & Tool Co., Ltd.'s recent grant velocity is +50% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Tongtai Machine & Tool Co., Ltd.'s patents?

Tongtai Machine & Tool Co., Ltd.'s patents average 8.2 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Tongtai Machine & Tool Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Tongtai Machine & Tool Co., Ltd.

Q: What technology areas does Tongtai Machine & Tool Co., Ltd. focus on?

Tongtai Machine & Tool Co., Ltd.'s top technology area is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering) with 5 patents, ranking #333 of 1,250 assignees active in that subclass. Grants appear in 16 CPC subclasses total.

USPTO PatentsView assignee record - 10 granted patents across 16 technology areas, recorded in grant years 2017–2021. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ).

Compiled by PlainPatent · May 15, 2026

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Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Tongtai ranks #27,663 of 49,997 tracked US assignees by granted-patent volume, with 10 patents across 16 technology areas.

#27,663
of 49,997 US assignees by volume: 23rd percentile
by Innovation Score (27.4/100): 8.2
avg claims per patent: +50%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R27663 · Foreign Corporation #27,663 · 10 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-PAR · TYPE-FRNCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 10 grants
MID-PACK #27,663/49,997
PHOTO-FINISH Tigercat Industries
CPC-FOCUS B33Y · 16 areas
INNOV-THIN 27.4/100
CLAIMS-PAR 8.2 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-SURGE +50% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Tigercat Industries Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Tongtai’s 27.4 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 8.3 pts (30%) Velocity 0.0 pts (0%) Breadth 14.1 pts (52%) Claim depth 4.9 pts (18%)

Qualcomm Incorporated · highest

85
Tongtai Machine & Tool · this assignee

27
3D Lighting… · lowest

7

What this shows Tongtai's Innovation Score is 27.4/100 (23rd percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Tongtai?

Each dot is one of Tongtai’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Tongtai’s own 8.2 claims/patent is at or below the 15.4 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Tongtai vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Tongtai's grants concentrate

Tongtai Machine & Tool Co., Ltd. is a focused PatentsView assignee: 16 CPC subclasses with 50% of grants classified under B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ). Peak complete grant year is 2020 (5 grants) versus a trough of 1 in 2017. By volume, Tongtai sits between Tigercat Industries Inc. and Toyama Prefecture.

Tigercat Industri…

10
TLX

10
Tmrw Group IP

10
Toho Tenax

10
Toshiba Plant Sys…

10
Total Solar Inter…

10
Totalenergies SE

10
Toyama Prefecture

10
Tongtai Machine &… ◀

10

What this shows Tongtai holds 10 patents at rank #27,591, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Tongtai

By rank, the assignees closest to #27,591 in granted patent volume.

Leaders in B33Y (Additive Manufacturing)

Other assignees with the most granted patents in Tongtai's primary technology class.

Tongtai's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

27 23rd percentile higher than 23% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2017–2021

Grants by year

Teal-shaded recent years (2020–present) versus the 2017–2019 baseline. Full figures in the table below.

View data table

Tongtai Machine & Tool Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2017	1	10.0%
2018	3	30.0%
2020	5	50.0%
2021	1	10.0%

Which technologies does Tongtai Machine & Tool Co., Ltd. patent most?

B33Y - Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering 5

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 5

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 4

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 4

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 4

B23B - TURNING; Boring 3

B23Q - Details, Components, OR Accessories FOR Machine Tools, e.g. Arrangements FOR Copying OR Controlling ; Machine Tools IN General Characterised BY THE Construction OF Particular Details OR COMPONENTS; Combinations OR Associations OF Metal-working Machines, NOT Directed TO A Particular Result 3

B24B - Machines, Devices, OR Processes FOR Grinding OR Polishing ; Dressing OR Conditioning OF Abrading SURFACES; Feeding OF Grinding, Polishing, OR Lapping Agents 2

H10N - Electric Solid-state Devices NOT Otherwise Provided FOR 1

B25H - Workshop Equipment, e.g. FOR Marking-out WORK; Storage Means FOR Workshops 1

G02B - Optical Elements, Systems OR Apparatus 1

G01M - Testing Static OR Dynamic Balance OF Machines OR STRUCTURES; Testing OF Structures OR Apparatus, NOT Otherwise Provided FOR 1

B06B - Methods OR Apparatus FOR Generating OR Transmitting Mechanical Vibrations OF Infrasonic, Sonic, OR Ultrasonic Frequency, ; e.g.; FOR Performing Mechanical Work IN General 1

B23P - Metal-working NOT Otherwise Provided FOR; Combined OPERATIONS; Universal Machine Tools 1

G05B - Control OR Regulating Systems IN GENERAL; Functional Elements OF Such SYSTEMS; Monitoring OR Testing Arrangements FOR Such Systems OR Elements 1

Top 15 of 16 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Tongtai Machine & Tool Co., Ltd.'s patent record in context - here's where to go next.

Tongtai Machine & Tool Co., Ltd.'s lead technology class is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ), 50% of its portfolio - see every assignee active in that class. Explore B33Y
Ranked #27,663 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Tongtai Machine & Tool Co., Ltd. against Tigercat Industries Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 27.4/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.