Where does Tanazawa Hakkosha Co., Ltd. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Tanazawa Hakkosha Co., Ltd. ranks #33,531 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Tanazawa Hakkosha Co., Ltd. hold?

Tanazawa Hakkosha Co., Ltd. holds 8 US utility patents granted between 2015 and 2025, spanning 7 technology areas.

What is Tanazawa Hakkosha Co., Ltd.'s Innovation Score?

Tanazawa Hakkosha Co., Ltd. has an Innovation Score of 34.3 out of 100 (47th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Tanazawa Hakkosha Co., Ltd.'s patent grant rate increasing or decreasing?

Tanazawa Hakkosha Co., Ltd.'s recent grant velocity is -25% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Tanazawa Hakkosha Co., Ltd.'s patents?

Tanazawa Hakkosha Co., Ltd.'s patents average 6.6 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Tanazawa Hakkosha Co., Ltd. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Tanazawa Hakkosha Co., Ltd.

Q: What technology areas does Tanazawa Hakkosha Co., Ltd. focus on?

Tanazawa Hakkosha Co., Ltd.'s top technology area is H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components) with 4 patents. Grants appear in 7 CPC subclasses total.

USPTO PatentsView assignee record - 8 granted patents across 7 technology areas, recorded in grant years 2015–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Tanazawa ranks #33,531 of 49,997 tracked US assignees by granted-patent volume, with 8 patents across 7 technology areas.

#33,531
of 49,997 US assignees by volume: 47th percentile
by Innovation Score (34.3/100): 6.6
avg claims per patent: -25%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R33531 · Foreign Corporation #33,531 · 8 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DOWN · BOOK-FULL

GRANTS-MICRO 8 grants
MID-PACK #33,531/49,997
PHOTO-FINISH Taiflex Scientific
CPC-NARROW H05K · 7 areas
INNOV-THIN 34.3/100
CLAIMS-SPARSE 6.6 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DOWN -25% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Taiflex Scientific Co., Ltd. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

Qualcomm Incorporated · highest

85
Tanazawa Hakkosha · this assignee

34
3D Lighting… · lowest

7

What this shows Tanazawa's Innovation Score is 34.3/100 (47th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Where Tanazawa's grants concentrate

Tanazawa Hakkosha Co., Ltd. is a focused PatentsView assignee: 7 CPC subclasses with 50% of grants classified under H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components). Peak complete grant year is 2018 (2 grants) versus a trough of 1 in 2015. By volume, Tanazawa sits between Taiflex Scientific Co., Ltd. and Tarveda Therapeutics, Inc..

Tanazawa's three-year grant acceleration

Tanazawa Hakkosha Co., Ltd. shows 2 grants in 2022–2024 against only 1 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Taiflex Scientific

8
Taiwan Chelic

8
Taiwan Shan YIN I…

8
Tamagawa Seiki

8
Tang Chou Industr…

8
Tapematic S P A

8
Target Systemelek…

8
Tarveda Therapeut…

8
Tanazawa Hakkosha ◀

8

What this shows Tanazawa holds 8 patents at rank #33,508, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Tanazawa

By rank, the assignees closest to #33,508 in granted patent volume.

Leaders in H05K (Printed Circuits)

Other assignees with the most granted patents in Tanazawa's primary technology class.

Tanazawa's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

34 47th percentile higher than 47% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Tanazawa Hakkosha Co., Ltd. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	1	12.5%
2016	1	12.5%
2018	2	25.0%
2020	1	12.5%
2023	1	12.5%
2024	1	12.5%
2025partial year	1	12.5%

Which technologies does Tanazawa Hakkosha Co., Ltd. patent most?

H05K - Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components 4

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 4

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 2

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 2

G01R - Measuring Electric VARIABLES; Measuring Magnetic Variables 1

G06F - Electric Digital Data Processing 1

G02B - Optical Elements, Systems OR Apparatus 1

Top 7 of 7 technology areas

Where it ranks

Overall rank by patents

#33,531

of 49,997 tracked assignees

Innovation Score

34.3 out of 100

View all rankings →

Data Source

USPTO PatentsView, US granted patents 2015–2025

How is Innovation Score calculated?

What to do with this data

Tanazawa Hakkosha Co., Ltd.'s patent record in context - here's where to go next.

Tanazawa Hakkosha Co., Ltd.'s lead technology class is H05K (Printed CIRCUITS; Casings OR Constructional Details OF Electric APPARATUS; Manufacture OF Assemblages OF Electrical Components), 50% of its portfolio - see every assignee active in that class. Explore H05K
Ranked #33,531 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Tanazawa Hakkosha Co., Ltd. against Taiflex Scientific Co., Ltd., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 34.3/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.