PlainPatent
USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Hongzhou Sweet I&E Co., Ltd.

USPTO PatentsView assignee record - 10 granted patents across 2 technology areas, recorded in grant years 2021–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: F16L (PIPES; Joints OR Fittings FOR PIPES; Supports FOR Pipes, Cables OR Protective TUBING; Means FOR Thermal Insulation IN General).

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The verdict

According to USPTO PatentsView, Hongzhou ranks #26,486 of 49,997 tracked US assignees by granted-patent volume, with 10 patents across 2 technology areas.

#26,486
of 49,997 US assignees by volume
32nd percentile
by Innovation Score (29.7/100)
1.4
avg claims per patent

USPTO PatentsView assignee plate

Corpus R26486 · Foreign Corporation #26,486 · 10 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH

  • GRANTS-MICRO 10 grants
  • MID-PACK #26,486/49,997
  • PHOTO-FINISH Hinterkopf
  • CPC-NARROW F16L · 2 areas
  • INNOV-THIN 29.7/100
  • CLAIMS-SPARSE 1.4 claims/avg
  • TYPE-FRNCORP Foreign Corp
  • SPAN-YRS 2021–2024 · 4y
  • BOOK-RICH 9/10 fields

Nearest grant-volume peer: Hinterkopf GmbH (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Hongzhou’s 29.7 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Innovation-score neighbourhood around Hongzhou

Lowest and highest poles plus nearest Innovation Score peers, not a full corpus board reprint.

score

What this shows Hongzhou's Innovation Score is 29.7/100 (32nd percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Source USPTO PatentsView, PlainPatent Innovation Score As of 2015–2025

Does more volume mean deeper claims for Hongzhou?

Each dot is one of Hongzhou’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Hongzhou’s own 1.4 claims/patent is at or below the 14.1 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Hongzhou vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView. 2×2 strategic matrix plotting 9 entities by Granted patents (volume) (X) and Avg claims / patent (Y), with a crosshair dividing the plot into four quadrants. Volume + depthSelective & thoroughVolume over depthLean filer 9.99.91010.1 0102030 Granted patents (volume) Avg claims / patent Hinterkopf GmbH - 10, 14.1HinterkopfHistogenics Corporation - 10, 16.4HistogenicsHive Streaming AB - 10, 28Hive Streaming ABHodge Products, Inc. - 10, 10.1Hodge ProductsHub Pen Company, LLC - 10, 2.8Hub PenHubble Network Inc. - 10, 15.8Hubble NetworkHugel Inc. - 10, 14.4HugelHuizhou Haorul Hardware Technology Co., Ltd. - 10, 1Huizhou Haorul Ha…Hongzhou Sweet I&E Co., Ltd. - 10, 1.4Hongzhou Sweet I&E
Hongzhou vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Hongzhou's grants concentrate

Hongzhou Sweet I&E Co., Ltd. is a focused PatentsView assignee: 2 CPC subclasses with 10% of grants classified under F16L (PIPES; Joints OR Fittings FOR PIPES; Supports FOR Pipes, Cables OR Protective TUBING; Means FOR Thermal Insulation IN General). Peak complete grant year is 2021 (3 grants) versus a trough of 2 in 2022. By volume, Hongzhou sits between Hinterkopf GmbH and Huizhou Haorul Hardware Technology Co., Ltd..

Hongzhou's three-year grant acceleration

Hongzhou Sweet I&E Co., Ltd. shows 7 grants in 2022–2024 against only 3 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Who files at Hongzhou's volume?

Granted US patents 2015–2025 versus its nearest-ranked assignees by volume, this company marked ◀

patents

What this shows Hongzhou holds 10 patents at rank #26,491, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Source USPTO PatentsView, granted utility patents As of 2015–2025

Companies ranked near Hongzhou

By rank, the assignees closest to #26,491 in granted patent volume.

Leaders in F16L (Pipes)

Other assignees with the most granted patents in Hongzhou's primary technology class.

Hongzhou's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

30 32nd percentile higher than 32% of 49,997 US assignees

This assignee 0 100 every tracked assignee, bucketed by value

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

1.522.533.5 2021202220232024 2
USPTO utility patent grants by year · 2021–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2021–2019 baseline. Full figures in the table below.

View data table
Hongzhou Sweet I&E Co., Ltd. patent grants by year, 2015–2025
Year Patents Granted Share of Period
2021 3 30.0%
2022 2 20.0%
2023 3 30.0%
2024 2 20.0%

Which technologies does Hongzhou Sweet I&E Co., Ltd. patent most?

Top 2 of 2 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Hongzhou Sweet I&E Co., Ltd.'s patent record in context - here's where to go next.

  • Hongzhou Sweet I&E Co., Ltd.'s lead technology class is F16L (PIPES; Joints OR Fittings FOR PIPES; Supports FOR Pipes, Cables OR Protective TUBING; Means FOR Thermal Insulation IN General), 10% of its portfolio - see every assignee active in that class. Explore F16L
  • Ranked #26,486 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
  • Compare Hongzhou Sweet I&E Co., Ltd. against Hinterkopf GmbH, an assignee filing at a similar volume. Compare portfolios
  • Innovation Score of 29.7/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page
  • USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
  • Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
  • USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.