Where does Higher Dimension Materials, Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Higher Dimension Materials, Inc. ranks #35,699 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Higher Dimension Materials, Inc. hold?

Higher Dimension Materials, Inc. holds 7 US utility patents granted between 2019 and 2024, spanning 9 technology areas.

What is Higher Dimension Materials, Inc.'s Innovation Score?

Higher Dimension Materials, Inc. has an Innovation Score of 45.1 out of 100 (top 24% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Higher Dimension Materials, Inc.'s patent grant rate increasing or decreasing?

Higher Dimension Materials, Inc.'s recent grant velocity is +500% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Higher Dimension Materials, Inc.'s patents?

Higher Dimension Materials, Inc.'s patents average 17.7 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Higher Dimension Materials, Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Higher Dimension Materials, Inc.

Q: What technology areas does Higher Dimension Materials, Inc. focus on?

Higher Dimension Materials, Inc.'s top technology area is H02J (Circuit Arrangements OR Systems FOR Supplying OR Distributing Electric POWER; Systems FOR Storing Electric Energy) with 4 patents, ranking #1,060 of 3,143 assignees active in that subclass. Grants appear in 9 CPC subclasses total.

USPTO PatentsView assignee record - 7 granted patents across 9 technology areas, recorded in grant years 2019–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: H02J (Circuit Arrangements OR Systems FOR Supplying OR Distributing Electric POWER; Systems FOR Storing Electric Energy).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Higher ranks #35,699 of 49,997 tracked US assignees by granted-patent volume, with 7 patents across 9 technology areas.

#35,699
of 49,997 US assignees by volume: Top 24%
by Innovation Score (45.1/100): 17.7
avg claims per patent: +500%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R35699 · US Corporation #35,699 · 7 grants

GRANTS-MICRO · MID-PACK · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-RICH · TYPE-USCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 7 grants
MID-PACK #35,699/49,997
PHOTO-FINISH Heraeus Sensor…
CPC-NARROW H02J · 9 areas
INNOV-PAR 45.1/100
CLAIMS-RICH 17.7 claims/avg
TYPE-USCORP US Corporation
VEL-SURGE +500% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Heraeus Sensor Technology GmbH (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Higher’s 45.1 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 7.2 pts (16%) Velocity 16.7 pts (37%) Breadth 10.6 pts (24%) Claim depth 10.6 pts (24%)

Qualcomm Incorporated · highest

85
Higher Dimension… · this assignee

45
3D Lighting… · lowest

7

What this shows Higher's Innovation Score is 45.1/100 (top 24% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Higher?

Each dot is one of Higher’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Higher’s own 17.7 claims/patent is ABOVE the 13.4 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Higher vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Higher's grants concentrate

Higher Dimension Materials, Inc. is a focused PatentsView assignee: 9 CPC subclasses with 57.1% of grants classified under H02J (Circuit Arrangements OR Systems FOR Supplying OR Distributing Electric POWER; Systems FOR Storing Electric Energy). Peak complete grant year is 2023 (2 grants) versus a trough of 1 in 2019. By volume, Higher sits between Heraeus Sensor Technology GmbH and Hiperwall, Inc..

Higher's three-year grant acceleration

Higher Dimension Materials, Inc. shows 5 grants in 2022–2024 against only 2 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Heraeus Sensor Te…

7
Hercutech

7
Heritage Distilli…

7
Heshan Pace Techn…

7
Hills Point Indus…

7
Himile Mechanical…

7
Hinds Instruments

7
Hiperwall

7
Higher Dimension… ◀

7

What this shows Higher holds 7 patents at rank #35,732, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Higher

By rank, the assignees closest to #35,732 in granted patent volume.

Leaders in H02J (Circuit Arrangements OR Systems FOR Supplying OR Distribu…)

Other assignees with the most granted patents in Higher's primary technology class.

Higher's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

45 Top 24% higher than 76% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2019–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2019–2019 baseline. Full figures in the table below.

View data table

Higher Dimension Materials, Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2019	1	14.3%
2021	1	14.3%
2022	1	14.3%
2023	2	28.6%
2024	2	28.6%

Which technologies does Higher Dimension Materials, Inc. patent most?

H02J - Circuit Arrangements OR Systems FOR Supplying OR Distributing Electric POWER; Systems FOR Storing Electric Energy 4

Y02E - Reduction OF Greenhouse GAS [GHG] Emissions, Related TO Energy Generation, Transmission OR Distribution 4

F28D - Heat-exchange Apparatus, NOT Provided FOR IN Another Subclass, IN Which THE Heat-exchange Media DO NOT Come Into Direct Contact 3

F24H - Fluid Heaters, e.g. Water OR AIR Heaters, Having Heat-generating Means, e.g. Heat Pumps, IN General 2

A41D - OUTERWEAR; Protective GARMENTS; Accessories 2

H02K - Dynamo-electric Machines 2

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 1

A01N - Preservation OF Bodies OF Humans OR Animals OR Plants OR Parts Thereof ; Biocides, e.g. AS Disinfectants, AS Pesticides OR AS Herbicides ; Pest Repellants OR ATTRACTANTS; Plant Growth Regulators 1

F28F - Details OF Heat-exchange AND Heat-transfer Apparatus, OF General Application 1

Top 9 of 9 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Higher Dimension Materials, Inc.'s patent record in context - here's where to go next.

Higher Dimension Materials, Inc.'s lead technology class is H02J (Circuit Arrangements OR Systems FOR Supplying OR Distributing Electric POWER; Systems FOR Storing Electric Energy), 57.1% of its portfolio - see every assignee active in that class. Explore H02J
Ranked #35,699 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Higher Dimension Materials, Inc. against Heraeus Sensor Technology GmbH, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 45.1/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.