Overall rank by patents
#12,470
of 50,000 tracked assignees
USPTO PatentsView assignee record - 24 granted patents across 8 technology areas, recorded in grant years 2015–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B21D (WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL).
The verdict
According to USPTO PatentsView, Hidaka ranks #12,470 of 50,000 tracked US assignees by granted-patent volume, with 24 patents across 8 technology areas.
USPTO PatentsView assignee plate
Corpus R12470 · Foreign Corporation #12,470 · 24 grants
GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DOWN · BOOK-FULL
Nearest grant-volume peer: Hangzhou Amphenol Phoenix Telecom Parts Co., Ltd. (±0 grants)
Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.
Lowest and highest poles plus nearest Innovation Score peers, not a full corpus board reprint.
Qualcomm Incorporated · highest
85 score
Hidaka Seiki · this assignee
26 score
3D Lighting Innovati… · lowest
7 score
What this shows Hidaka Seiki Kabushiki Kaisha stamps GRANTS-SMALL, UPPER-Q, PHOTO-FINISH, CPC-NARROW, INNOV-THIN, CLAIMS-SPARSE, TYPE-FRNCORP, VEL-DOWN, BOOK-FULL. Volume places it #12,470 of 50,000; Innovation Score 26.1/100 sits in the top 81% of the PatentsView-derived corpus. Closest grant-volume peer on this plate is Hangzhou Amphenol Phoenix Telecom Parts Co., Ltd. (±0 grants).
Hidaka Seiki Kabushiki Kaisha has been granted 24 US utility patents between 2015 and 2024, placing Hidaka Seiki Kabushiki Kaisha at #12,470 of 50,000 across all assignees tracked by PlainPatent. This portfolio spans 8 distinct Cooperative Patent Classification (CPC) subclasses, averaging 7.3 claims per patent with primary concentration in B21D (WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL). As a Foreign Corporation, Hidaka Seiki Kabushiki Kaisha is one of the more focused assignees in the PatentsView dataset. By volume, Hidaka sits between Hangzhou Amphenol Phoenix Telecom Parts Co., Ltd. (24 patents, rank #12,466) and Honda Electronics Co., Ltd. (24 patents, rank #12,474) - the closest US assignees by grant volume. The composite Innovation Score of 26.1/100 blends portfolio volume, grant velocity, technology breadth, and claim depth into a single comparable measure drawn directly from USPTO PatentsView records.
Grant cadence records the difference between two grant-year windows. Between 2020 and 2024 the company received 10 grants, compared with 14 in the 2015–2019 window, a -29% shift in five-year grant velocity. Both windows cover five complete grant years; the latest PatentsView year is a partial release and is excluded from this comparison, though it still appears in the yearly table and chart below. Grant timing can lag the related application by years, so this comparison does not establish current R&D spending, strategic intent, or a company’s application activity. The Foreign Corporation classification provides context for the assignee record, not a conclusion about its business strategy.
Claim depth and technology breadth describe this aggregate record. Hidaka Seiki Kabushiki Kaisha's 7.3 average claims per patent is an average count, not a measure of claim scope, legal strength, enforceability, or design-around risk. The record spans 8 CPC subclasses. Combined with portfolio volume, these figures let readers compare the documented grant records of assignees in similar technology classes.
Granted US patents 2015–2025 versus its nearest-ranked assignees by volume, this company marked ◀
HANGZHOU AMPHENOL PHOENIX TELECOM PARTS CO., LTD.
24 patents
HANGZHOU EZVIZ SOFTWARE CO., LTD.
24 patents
HANWHA POWERSYSTEMS CO., LTD
24 patents
HAWKES DESIGN AND CONSULTING, LLC.
24 patents
HITACHI DATA SYSTEMS CORPORATION
24 patents
HITTITE MICROWAVE LLC
24 patents
HOKWANG INDUSTRIES CO., LTD.
24 patents
HONDA ELECTRONICS CO., LTD.
24 patents
HIDAKA SEIKI KABUSHIKI KAISHA
24 patents
What this shows Hidaka holds 24 patents at rank #12,470, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.
By rank, the assignees closest to #12,470 in granted patent volume.
Other assignees with the most granted patents in Hidaka's primary technology class.
Hidaka's Innovation Score vs. every tracked assignee
Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)
26 Top 81% higher than 19% of 50,000 US assignees
Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.
Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025
Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.
| Year | Patents Granted | Share of Period |
|---|---|---|
| 2015 | 8 | 33.3% |
| 2016 | 2 | 8.3% |
| 2018 | 2 | 8.3% |
| 2019 | 2 | 8.3% |
| 2020 | 5 | 20.8% |
| 2021 | 4 | 16.7% |
| 2024 | 1 | 4.2% |
Top 8 of 8 technology areas
Overall rank by patents
#12,470
of 50,000 tracked assignees
26.1 out of 100
Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.