Where does Hidaka Seiki Kabushiki Kaisha rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Hidaka Seiki Kabushiki Kaisha ranks #12,470 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Hidaka Seiki Kabushiki Kaisha hold?

Hidaka Seiki Kabushiki Kaisha holds 24 US utility patents granted between 2015 and 2024, spanning 8 technology areas.

What is Hidaka Seiki Kabushiki Kaisha's Innovation Score?

Hidaka Seiki Kabushiki Kaisha has an Innovation Score of 26.1 out of 100 (19th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Hidaka Seiki Kabushiki Kaisha's patent grant rate increasing or decreasing?

Hidaka Seiki Kabushiki Kaisha's recent grant velocity is -29% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Hidaka Seiki Kabushiki Kaisha's patents?

Hidaka Seiki Kabushiki Kaisha's patents average 7.3 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Hidaka Seiki Kabushiki Kaisha patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Hidaka Seiki Kabushiki Kaisha

Q: What technology areas does Hidaka Seiki Kabushiki Kaisha focus on?

Hidaka Seiki Kabushiki Kaisha's top technology area is B21D (Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal) with 19 patents, ranking #35 of 818 assignees active in that subclass. Grants appear in 8 CPC subclasses total.

USPTO PatentsView assignee record - 24 granted patents across 8 technology areas, recorded in grant years 2015–2024. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B21D (Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Hidaka ranks #12,470 of 49,997 tracked US assignees by granted-patent volume, with 24 patents across 8 technology areas.

#12,470
of 49,997 US assignees by volume: 19th percentile
by Innovation Score (26.1/100): 7.3
avg claims per patent: -29%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R12470 · Foreign Corporation #12,470 · 24 grants

GRANTS-SMALL · UPPER-Q · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-SPARSE · TYPE-FRNCORP · VEL-DOWN · BOOK-FULL

GRANTS-SMALL 24 grants
UPPER-Q #12,470/49,997
PHOTO-FINISH Hangzhou Amphenol…
CPC-NARROW B21D · 8 areas
INNOV-THIN 26.1/100
CLAIMS-SPARSE 7.3 claims/avg
TYPE-FRNCORP Foreign Corp
VEL-DOWN -29% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Hangzhou Amphenol Phoenix Telecom Parts Co., Ltd. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Hidaka’s 26.1 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 11.1 pts (43%) Velocity 0.6 pts (2%) Breadth 10.0 pts (38%) Claim depth 4.4 pts (17%)

Qualcomm Incorporated · highest

85
Hidaka Seiki · this assignee

26
3D Lighting… · lowest

7

What this shows Hidaka's Innovation Score is 26.1/100 (19th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Hidaka?

Each dot is one of Hidaka’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Hidaka’s own 7.3 claims/patent is at or below the 8.7 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Hidaka vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Hidaka's grants concentrate

Hidaka Seiki Kabushiki Kaisha is a focused PatentsView assignee: 8 CPC subclasses with 79.2% of grants classified under B21D (Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal). Peak complete grant year is 2015 (8 grants) versus a trough of 1 in 2024. By volume, Hidaka sits between Hangzhou Amphenol Phoenix Telecom Parts Co., Ltd. and Honda Electronics Co., Ltd..

Hidaka's three-year grant acceleration

Hidaka Seiki Kabushiki Kaisha shows 1 grants in 2022–2024 against only 11 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Hangzhou Amphenol…

24
Hangzhou Ezviz So…

24
Hanwha Powersyste…

24
Hawkes Design AND…

24
Hitachi Data Syst…

24
Hittite Microwave

24
Hokwang Industries

24
Honda

24
Hidaka Seiki ◀

24

What this shows Hidaka holds 24 patents at rank #12,470, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Hidaka

By rank, the assignees closest to #12,470 in granted patent volume.

Leaders in B21D (Working OR Processing OF Sheet Metal OR Metal Tubes)

Other assignees with the most granted patents in Hidaka's primary technology class.

Hidaka's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

26 19th percentile higher than 19% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2015–2024

Grants by year

Teal-shaded recent years (2020–present) versus the 2015–2019 baseline. Full figures in the table below.

View data table

Hidaka Seiki Kabushiki Kaisha patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2015	8	33.3%
2016	2	8.3%
2018	2	8.3%
2019	2	8.3%
2020	5	20.8%
2021	4	16.7%
2024	1	4.2%

Which technologies does Hidaka Seiki Kabushiki Kaisha patent most?

B21D - Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal 19

B23P - Metal-working NOT Otherwise Provided FOR; Combined OPERATIONS; Universal Machine Tools 11

Y10T - Technical Subjects Covered BY Former US Classification 8

F28F - Details OF Heat-exchange AND Heat-transfer Apparatus, OF General Application 8

F28D - Heat-exchange Apparatus, NOT Provided FOR IN Another Subclass, IN Which THE Heat-exchange Media DO NOT Come Into Direct Contact 6

B65H - Handling Thin OR Filamentary Material, e.g. Sheets, Webs, Cables 5

B65G - Transport OR Storage Devices, e.g. Conveyors FOR Loading OR Tipping, Shop Conveyor Systems OR Pneumatic Tube Conveyors 2

F01D - Non-positive Displacement Machines OR Engines, e.g. Steam Turbines 1

Top 8 of 8 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Hidaka Seiki Kabushiki Kaisha's patent record in context - here's where to go next.

Hidaka Seiki Kabushiki Kaisha's lead technology class is B21D (Working OR Processing OF Sheet Metal OR Metal Tubes, Rods OR Profiles Without Essentially Removing MATERIAL; Punching Metal), 79.2% of its portfolio - see every assignee active in that class. Explore B21D
Ranked #12,470 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Hidaka Seiki Kabushiki Kaisha against Hangzhou Amphenol Phoenix Telecom Parts Co., Ltd., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 26.1/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent, US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.