Where does Full Spectrum Laser rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Full Spectrum Laser ranks #46,916 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Full Spectrum Laser hold?

Full Spectrum Laser holds 5 US utility patents granted between 2016 and 2018, spanning 14 technology areas.

What is Full Spectrum Laser's Innovation Score?

Full Spectrum Laser has an Innovation Score of 28.8 out of 100 (28th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Full Spectrum Laser's patent grant rate increasing or decreasing?

Full Spectrum Laser's recent grant velocity is -100% compared to the prior five-year period (grant years, not application filing dates). Grant activity has slowed relative to earlier years.

What does claim depth mean for Full Spectrum Laser's patents?

Full Spectrum Laser's patents average 15.6 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Full Spectrum Laser patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Full Spectrum Laser

Q: What technology areas does Full Spectrum Laser focus on?

Full Spectrum Laser's top technology area is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering) with 3 patents, ranking #489 of 1,250 assignees active in that subclass. Grants appear in 14 CPC subclasses total.

USPTO PatentsView assignee record - 5 granted patents across 14 technology areas, recorded in grant years 2016–2018. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Full ranks #46,916 of 49,997 tracked US assignees by granted-patent volume, with 5 patents across 14 technology areas.

#46,916
of 49,997 US assignees by volume: 28th percentile
by Innovation Score (28.8/100): 15.6
avg claims per patent: -100%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R46916 · US Corporation #46,916 · 5 grants

GRANTS-MICRO · BOTTOM-DECILE · PHOTO-FINISH · CPC-FOCUS · INNOV-THIN · CLAIMS-RICH · TYPE-USCORP · VEL-DROP · BOOK-FULL

GRANTS-MICRO 5 grants
BOTTOM-DECILE #46,916/49,997
PHOTO-FINISH Frustration Free…
CPC-FOCUS B33Y · 14 areas
INNOV-THIN 28.8/100
CLAIMS-RICH 15.6 claims/avg
TYPE-USCORP US Corporation
VEL-DROP -100% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: Frustration Free Solutions, LLC (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Full’s 28.8 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 6.2 pts (22%) Velocity 0.0 pts (0%) Breadth 13.2 pts (46%) Claim depth 9.4 pts (33%)

Qualcomm Incorporated · highest

85
Full Spectrum Laser · this assignee

29
3D Lighting… · lowest

7

What this shows Full's Innovation Score is 28.8/100 (28th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Full?

Each dot is one of Full’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Full’s own 15.6 claims/patent is ABOVE the 5.6 median for these volume peers. More thorough claims than most filers at this scale, not just more of them.

Full vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Full's grants concentrate

Full Spectrum Laser is a focused PatentsView assignee: 14 CPC subclasses with 60% of grants classified under B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ). Peak complete grant year is 2016 (2 grants) versus a trough of 1 in 2017. By volume, Full sits between Frustration Free Solutions, LLC and Fundacao De Amparo A Pesquisa Do Estado De Sao Paulo.

Frustration Free…

5
Fuji Heavy Indust…

5
Fujian Youtong In…

5
Full Spectrum Gen…

5
Fullstar Houseware

5
Fully

5
Funfare

5
Fundacao De Ampar…

5
Full Spectrum Las… ◀

5

What this shows Full holds 5 patents at rank #46,935, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Full

By rank, the assignees closest to #46,935 in granted patent volume.

Leaders in B33Y (Additive Manufacturing)

Other assignees with the most granted patents in Full's primary technology class.

Full's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

29 28th percentile higher than 28% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2016–2018

Grants by year

Teal-shaded recent years (2020–present) versus the 2016–2019 baseline. Full figures in the table below.

View data table

Full Spectrum Laser patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2016	2	40.0%
2017	1	20.0%
2018	2	40.0%

Which technologies does Full Spectrum Laser patent most?

B33Y - Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering 3

G02B - Optical Elements, Systems OR Apparatus 2

B23K - Soldering OR UNSOLDERING; WELDING; Cladding OR Plating BY Soldering OR WELDING; Cutting BY Applying Heat Locally, e.g. Flame CUTTING; Working BY Laser Beam 2

C08F - Macromolecular Compounds Obtained BY Reactions Only Involving Carbon-to-carbon Unsaturated Bonds 2

C09D - Coating Compositions, e.g. Paints, Varnishes OR LACQUERS; Filling PASTES; Chemical Paint OR INK REMOVERS; INKS; Correcting FLUIDS; WOODSTAINS; Pastes OR Solids FOR Colouring OR PRINTING; USE OF Materials Therefor 2

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 1

G06F - Electric Digital Data Processing 1

G05B - Control OR Regulating Systems IN GENERAL; Functional Elements OF Such SYSTEMS; Monitoring OR Testing Arrangements FOR Such Systems OR Elements 1

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 1

G01B - Measuring Length, Thickness OR Similar Linear DIMENSIONS; Measuring ANGLES; Measuring AREAS; Measuring Irregularities OF Surfaces OR Contours 1

G01D - Measuring NOT Specially Adapted FOR A Specific VARIABLE; Arrangements FOR Measuring TWO OR More Variables NOT Covered IN A Single Other SUBCLASS; Tariff Metering APPARATUS; Measuring OR Testing NOT Otherwise Provided FOR 1

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 1

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 1

C09J - ADHESIVES; Non-mechanical Aspects OF Adhesive Processes IN GENERAL; Adhesive Processes NOT Provided FOR ELSEWHERE; USE OF Materials AS Adhesives 1

Top 14 of 14 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Full Spectrum Laser's patent record in context - here's where to go next.

Full Spectrum Laser's lead technology class is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ), 60% of its portfolio - see every assignee active in that class. Explore B33Y
Ranked #46,916 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Full Spectrum Laser against Frustration Free Solutions, LLC, an assignee filing at a similar volume. Compare portfolios
Innovation Score of 28.8/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.