Where does Effusiontech IP Pty Ltd rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Effusiontech IP Pty Ltd ranks #46,406 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Effusiontech IP Pty Ltd hold?

Effusiontech IP Pty Ltd holds 5 US utility patents granted between 2022 and 2025, spanning 9 technology areas.

What is Effusiontech IP Pty Ltd's Innovation Score?

Effusiontech IP Pty Ltd has an Innovation Score of 43.8 out of 100 (top 27% of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

Is Effusiontech IP Pty Ltd's patent grant rate increasing or decreasing?

Insufficient historical data is available to calculate a velocity trend for Effusiontech IP Pty Ltd.

What does claim depth mean for Effusiontech IP Pty Ltd's patents?

Effusiontech IP Pty Ltd's patents average 11.6 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Effusiontech IP Pty Ltd patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView Foreign Corporation

Effusiontech IP Pty Ltd

Q: What technology areas does Effusiontech IP Pty Ltd focus on?

Effusiontech IP Pty Ltd's top technology area is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering) with 5 patents, ranking #333 of 1,250 assignees active in that subclass. Grants appear in 9 CPC subclasses total.

USPTO PatentsView assignee record - 5 granted patents across 9 technology areas, recorded in grant years 2022–2025. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ).

Compiled by PlainPatent · May 15, 2026

RSS updates for this company

Explore the portfolio See the ranking

The verdict

According to USPTO PatentsView, Effusiontech ranks #46,406 of 49,997 tracked US assignees by granted-patent volume, with 5 patents across 9 technology areas.

#46,406
of 49,997 US assignees by volume: Top 27%
by Innovation Score (43.8/100): 11.6
avg claims per patent

USPTO PatentsView assignee plate

Corpus R46406 · Foreign Corporation #46,406 · 5 grants

GRANTS-MICRO · BOTTOM-DECILE · PHOTO-FINISH · CPC-NARROW · INNOV-PAR · CLAIMS-PAR · TYPE-FRNCORP · SPAN-YRS · BOOK-RICH

GRANTS-MICRO 5 grants
BOTTOM-DECILE #46,406/49,997
PHOTO-FINISH Eden GeoPower
CPC-NARROW B33Y · 9 areas
INNOV-PAR 43.8/100
CLAIMS-PAR 11.6 claims/avg
TYPE-FRNCORP Foreign Corp
SPAN-YRS 2022–2025 · 4y
BOOK-RICH 9/10 fields

Nearest grant-volume peer: Eden GeoPower, Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Effusiontech’s 43.8 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 6.2 pts (14%) Velocity 20.0 pts (46%) Breadth 10.6 pts (24%) Claim depth 7.0 pts (16%)

Qualcomm Incorporated · highest

85
Effusiontech IP Pty · this assignee

44
3D Lighting… · lowest

7

What this shows Effusiontech's Innovation Score is 43.8/100 (top 27% of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Effusiontech?

Each dot is one of Effusiontech’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Effusiontech’s own 11.6 claims/patent is at or below the 16.6 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Effusiontech vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Effusiontech's grants concentrate

Effusiontech IP Pty Ltd is a focused PatentsView assignee: 9 CPC subclasses with 100% of grants classified under B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ). By volume, Effusiontech sits between Eden GeoPower, Inc. and Eko Devices, Inc..

Effusiontech's three-year grant acceleration

Effusiontech IP Pty Ltd shows 4 grants in 2022–2024 against only 0 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Eden Geopower

5
Edge Networking S…

5
Edison Vault

5
Eetrex

5
Ehime Prefecture

5
Ehwa University-i…

5
Eightfold AI

5
Eko Devices

5
Effusiontech IP P… ◀

5

What this shows Effusiontech holds 5 patents at rank #46,531, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Effusiontech

By rank, the assignees closest to #46,531 in granted patent volume.

Leaders in B33Y (Additive Manufacturing)

Other assignees with the most granted patents in Effusiontech's primary technology class.

Effusiontech's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

44 Top 27% higher than 73% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2022–2025

Grants by year

Teal-shaded recent years (2020–present) versus the 2022–2019 baseline. Full figures in the table below.

View data table

Effusiontech IP Pty Ltd patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2022	2	40.0%
2023	2	40.0%
2025partial year	1	20.0%

Which technologies does Effusiontech IP Pty Ltd patent most?

B33Y - Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective Laser Sintering 5

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 4

C23C - Coating Metallic MATERIAL; Coating Material With Metallic MATERIAL; Surface Treatment OF Metallic Material BY Diffusion Into THE Surface, BY Chemical Conversion OR SUBSTITUTION; Coating BY Vacuum Evaporation, BY Sputtering, BY ION Implantation OR BY Chemical Vapour Deposition, IN General 4

B22F - Working Metallic POWDER; Manufacture OF Articles From Metallic POWDER; Making Metallic Powder ; Apparatus OR Devices Specially Adapted FOR Metallic Powder 4

Y02P - Climate Change Mitigation Technologies IN THE Production OR Processing OF Goods 4

B05B - Spraying APPARATUS; Atomising APPARATUS; Nozzles 2

B28B - Shaping Clay OR Other Ceramic COMPOSITIONS; Shaping SLAG; Shaping Mixtures Containing Cementitious Material, e.g. Plaster 1

G06T - Image Data Processing OR Generation, IN General 1

C22C - Alloys 1

Top 9 of 9 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Effusiontech IP Pty Ltd's patent record in context - here's where to go next.

Effusiontech IP Pty Ltd's lead technology class is B33Y (Additive Manufacturing, i.e. Manufacturing OF Three-dimensional [3-D] Objects BY Additive Deposition, Additive Agglomeration OR Additive Layering, e.g. BY 3-D Printing, Stereolithography OR Selective ), 100% of its portfolio - see every assignee active in that class. Explore B33Y
Ranked #46,406 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Effusiontech IP Pty Ltd against Eden GeoPower, Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 43.8/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.