Where does Dicar Inc. rank among US patent assignees?

According to USPTO PatentsView (2015–2025 granted utility patents), Dicar Inc. ranks #39,824 of 49,997 assignees by granted-patent volume, the same sort as the companies listing and top-holders ranking. See /methodology/#corpus-placement.

How many patents does Dicar Inc. hold?

Dicar Inc. holds 6 US utility patents granted between 2019 and 2023, spanning 7 technology areas.

What is Dicar Inc.'s Innovation Score?

Dicar Inc. has an Innovation Score of 24.0 out of 100 (13th percentile of the corpus). This composite metric weighs portfolio volume (40%), grant velocity (20%), technology breadth (25%), and claim depth (15%).

What technology areas does Dicar Inc. focus on?

Dicar Inc.'s top technology area is B26D (CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing) with 6 patents, ranking #59 of 595 assignees active in that subclass. Grants appear in 7 CPC subclasses total.

Is Dicar Inc.'s patent grant rate increasing or decreasing?

Dicar Inc.'s recent grant velocity is +400% compared to the prior five-year period (grant years, not application filing dates). This indicates accelerating grant output.

What does claim depth mean for Dicar Inc.'s patents?

Dicar Inc.'s patents average 11.0 claims each. This is an aggregate descriptive count from the grant record; it does not establish claim scope, legal strength, enforceability, or design-around risk.

How is the Dicar Inc. patent data sourced?

All patent data comes from USPTO PatentsView, a public research dataset maintained by the United States Patent and Trademark Office covering US granted utility patents from 2015 to 2025.

USPTO 2015–2025 USPTO PatentsView US Corporation

Dicar Inc.

USPTO PatentsView assignee record - 6 granted patents across 7 technology areas, recorded in grant years 2019–2023. Grant-trend analysis is cross-referenced to USPTO Patent Public Search; it does not measure application filings, current R&D, or legal strength. Primary class: B26D (CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing).

Compiled by PlainPatent · May 15, 2026

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The verdict

According to USPTO PatentsView, Dicar ranks #39,824 of 49,997 tracked US assignees by granted-patent volume, with 6 patents across 7 technology areas.

#39,824
of 49,997 US assignees by volume: 13th percentile
by Innovation Score (24.0/100): 11.0
avg claims per patent: +400%
grant velocity, last 5 yrs

USPTO PatentsView assignee plate

Corpus R39824 · US Corporation #39,824 · 6 grants

GRANTS-MICRO · LOWER-Q · PHOTO-FINISH · CPC-NARROW · INNOV-THIN · CLAIMS-PAR · TYPE-USCORP · VEL-SURGE · BOOK-FULL

GRANTS-MICRO 6 grants
LOWER-Q #39,824/49,997
PHOTO-FINISH DiaCarta
CPC-NARROW B26D · 7 areas
INNOV-THIN 24.0/100
CLAIMS-PAR 11.0 claims/avg
TYPE-USCORP US Corporation
VEL-SURGE +400% vel
BOOK-FULL 10/10 fields

Nearest grant-volume peer: DiaCarta Inc. (±0 grants)

Instrument codes from this assignee’s USPTO PatentsView grant sheet: volume band, corpus rank, photo-finish peer, lead CPC, Innovation Score, claim depth, assignee type, velocity, and book completeness. Not a USPTO rating of patent strength.

How Dicar’s 24.0 Innovation Score adds up

The same four weighted components behind every Innovation Score on PlainPatent: portfolio volume, grant velocity, technology breadth, and claim depth.

Volume 6.7 pts (28%) Velocity 1.3 pts (5%) Breadth 9.4 pts (39%) Claim depth 6.6 pts (27%)

Qualcomm Incorporated · highest

85
Dicar · this assignee

24
3D Lighting… · lowest

7

What this shows Dicar's Innovation Score is 24.0/100 (13th percentile of the PatentsView-derived corpus). The chart places that score against the nearest Innovation Score peers plus corpus poles, not a reprint of the volume ranking.

Does more volume mean deeper claims for Dicar?

Each dot is one of Dicar’s 8 nearest volume peers (same corpus rank neighbourhood as the chart above), placed by total granted patents (horizontal) against average claims per patent (vertical). Dicar’s own 11.0 claims/patent is at or below the 13.5 median for these volume peers. Volume here does not track with deeper claims; several lower-volume peers claim more thoroughly per patent.

Dicar vs its 8 nearest volume peers: granted patents vs average claims per patent. Source: USPTO PatentsView.

Where Dicar's grants concentrate

Dicar Inc. is a focused PatentsView assignee: 7 CPC subclasses with 100% of grants classified under B26D (CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing). Peak complete grant year is 2020 (3 grants) versus a trough of 1 in 2019. By volume, Dicar sits between DiaCarta Inc. and Digital Porpoise, LLC.

Dicar's three-year grant acceleration

Dicar Inc. shows 1 grants in 2022–2024 against only 5 in 2019–2021. That prior window is too thin for a growth multiple (rename and spin-out assignees look artificially high when the baseline is near zero), so PlainPatent withholds a ranked acceleration claim here.

Diacarta

6
Diamed

6
Diadem S r l

6
Diamond Mattress

6
Dietze & Schell M…

6
Differential Engi…

6
Digi Sens Holding

6
Digital Porpoise

6
Dicar ◀

6

What this shows Dicar holds 6 patents at rank #39,866, shown against the 8 assignees closest to it in grant volume rather than the industry's largest filers.

Companies ranked near Dicar

By rank, the assignees closest to #39,866 in granted patent volume.

Leaders in B26D (Cutting)

Other assignees with the most granted patents in Dicar's primary technology class.

Dicar's Innovation Score vs. every tracked assignee

Composite of portfolio volume, grant velocity, technology breadth, and claim depth (0–100)

24 13th percentile higher than 13% of 49,997 US assignees

Each bar is a band; taller bars hold more US assignees. The dashed line + filled bar mark this entry. Hover or tap any bar for its full count, share, and where it sits relative to this entry.

Source USPTO PatentsView, PlainPatent Innovation Score · 2015–2025

USPTO utility patent grants by year · 2019–2023

Grants by year

Teal-shaded recent years (2020–present) versus the 2019–2019 baseline. Full figures in the table below.

View data table

Dicar Inc. patent grants by year, 2015–2025
Year	Patents Granted	Share of Period
2019	1	16.7%
2020	3	50.0%
2021	1	16.7%
2023	1	16.7%

Which technologies does Dicar Inc. patent most?

B26D - CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing 6

B26F - PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; Severing BY Means Other Than Cutting 6

B29L - Indexing Scheme Associated With Subclass B29c, Relating TO Particular Articles 1

B29C - Shaping OR Joining OF PLASTICS; Shaping OF Material IN A Plastic State, NOT Otherwise Provided FOR; After-treatment OF THE Shaped Products, e.g. Repairing 1

B29K - Indexing Scheme Associated With Subclasses B29b, B29c OR B29d, Relating TO Moulding Materials OR TO Materials FOR ; Moulds, ; Reinforcements, Fillers OR Preformed Parts, e.g. Inserts 1

B32B - Layered Products, i.e. Products Built-up OF Strata OF Flat OR Non-flat, e.g. Cellular OR Honeycomb, Form 1

Y10T - Technical Subjects Covered BY Former US Classification 1

Top 7 of 7 technology areas

More on this record

Data Source

USPTO PatentsView, US granted patents 2015–2025

View all rankings → How is Innovation Score calculated?

What to do with this data

Dicar Inc.'s patent record in context - here's where to go next.

Dicar Inc.'s lead technology class is B26D (CUTTING; Details Common TO Machines FOR Perforating, Punching, Cutting-out, Stamping-out OR Severing), 100% of its portfolio - see every assignee active in that class. Explore B26D
Ranked #39,824 of 49,997 tracked assignees by patent volume - see the full leaderboard. See the ranking
Compare Dicar Inc. against DiaCarta Inc., an assignee filing at a similar volume. Compare portfolios
Innovation Score of 24.0/100 blends volume, velocity, technology breadth, and claim depth. How it's calculated

Figures reflect USPTO PatentsView grant data through May 2026; pending applications not yet granted are not counted.

Data sourced from USPTO PatentsView - official U.S. government patent data. See our methodology for computation details. Retrieved and formatted by PlainPatent

Disclaimer: This information is provided for informational purposes only and does not constitute professional advice. Data is sourced from the USPTO PatentsView database. Consult a qualified professional before making decisions based on this data.

Read our methodology - how this data is sourced, computed, and verified.

Data sources used on this page

USPTO PatentsView - the disambiguated bulk patent-grant, assignee, and CPC data this page's figures are derived from. patentsview.org
Cooperative Patent Classification (CPC) - the joint USPTO/EPO classification scheme used to group patents by technology area. cooperativepatentclassification.org
USPTO Patent Public Search - the official interface to verify the status of any individual patent. ppubs.uspto.gov

Compiled by PlainPatent , US Patent Intelligence Editorial Process · May 15, 2026

Every figure on PlainPatent is rendered directly from USPTO source data, no number is typed in by an editor. This page draws directly on USPTO source data, no figure is typed in by an editor. See our editorial standards & corrections policy, the methodology behind these numbers, or report a data error. Data current as of May 2026.